JPH07502295A - ノボラック樹脂中の金属イオンの低減 - Google Patents
ノボラック樹脂中の金属イオンの低減Info
- Publication number
- JPH07502295A JPH07502295A JP5511142A JP51114293A JPH07502295A JP H07502295 A JPH07502295 A JP H07502295A JP 5511142 A JP5511142 A JP 5511142A JP 51114293 A JP51114293 A JP 51114293A JP H07502295 A JPH07502295 A JP H07502295A
- Authority
- JP
- Japan
- Prior art keywords
- ppb
- ion exchange
- sodium
- resin
- total amount
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920005989 resin Polymers 0.000 title claims description 130
- 239000011347 resin Substances 0.000 title claims description 130
- 229920003986 novolac Polymers 0.000 title claims description 126
- 229910021645 metal ion Inorganic materials 0.000 title claims description 82
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 216
- 229910052742 iron Inorganic materials 0.000 claims description 161
- 238000000034 method Methods 0.000 claims description 159
- 239000011734 sodium Substances 0.000 claims description 150
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 claims description 148
- 229910052708 sodium Inorganic materials 0.000 claims description 148
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 139
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 claims description 138
- 239000003456 ion exchange resin Substances 0.000 claims description 129
- 229920003303 ion-exchange polymer Polymers 0.000 claims description 129
- NWUYHJFMYQTDRP-UHFFFAOYSA-N 1,2-bis(ethenyl)benzene;1-ethenyl-2-ethylbenzene;styrene Chemical compound C=CC1=CC=CC=C1.CCC1=CC=CC=C1C=C.C=CC1=CC=CC=C1C=C NWUYHJFMYQTDRP-UHFFFAOYSA-N 0.000 claims description 118
- -1 iron ions Chemical class 0.000 claims description 115
- 239000002904 solvent Substances 0.000 claims description 106
- 229920002120 photoresistant polymer Polymers 0.000 claims description 102
- 239000000203 mixture Substances 0.000 claims description 99
- 239000000758 substrate Substances 0.000 claims description 59
- 239000002253 acid Substances 0.000 claims description 39
- 238000004519 manufacturing process Methods 0.000 claims description 37
- 230000002378 acidificating effect Effects 0.000 claims description 35
- 239000003513 alkali Substances 0.000 claims description 32
- 238000000576 coating method Methods 0.000 claims description 32
- 239000011248 coating agent Substances 0.000 claims description 30
- 150000002989 phenols Chemical class 0.000 claims description 29
- 229910052500 inorganic mineral Inorganic materials 0.000 claims description 26
- 239000011707 mineral Substances 0.000 claims description 26
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 24
- 239000003377 acid catalyst Substances 0.000 claims description 24
- 239000008098 formaldehyde solution Substances 0.000 claims description 21
- 238000005406 washing Methods 0.000 claims description 21
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical group COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 claims description 18
- 239000003054 catalyst Substances 0.000 claims description 16
- 150000002500 ions Chemical group 0.000 claims description 16
- 239000004065 semiconductor Substances 0.000 claims description 14
- 238000004140 cleaning Methods 0.000 claims description 12
- 239000011877 solvent mixture Substances 0.000 claims description 3
- 230000003647 oxidation Effects 0.000 claims 1
- 238000007254 oxidation reaction Methods 0.000 claims 1
- 239000000243 solution Substances 0.000 description 126
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 60
- 239000008367 deionised water Substances 0.000 description 41
- 229910021641 deionized water Inorganic materials 0.000 description 41
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 28
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 24
- 235000010755 mineral Nutrition 0.000 description 20
- 235000006408 oxalic acid Nutrition 0.000 description 20
- 239000000047 product Substances 0.000 description 20
- 239000010408 film Substances 0.000 description 18
- 238000006243 chemical reaction Methods 0.000 description 17
- 239000007788 liquid Substances 0.000 description 17
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 14
- RLSSMJSEOOYNOY-UHFFFAOYSA-N m-cresol Chemical compound CC1=CC=CC(O)=C1 RLSSMJSEOOYNOY-UHFFFAOYSA-N 0.000 description 14
- IWDCLRJOBJJRNH-UHFFFAOYSA-N p-cresol Chemical compound CC1=CC=C(O)C=C1 IWDCLRJOBJJRNH-UHFFFAOYSA-N 0.000 description 14
- 238000011161 development Methods 0.000 description 13
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 12
- 229910052751 metal Inorganic materials 0.000 description 12
- 239000002184 metal Substances 0.000 description 12
- 230000005855 radiation Effects 0.000 description 12
- 239000000463 material Substances 0.000 description 9
- 239000012508 resin bead Substances 0.000 description 9
- TUAMRELNJMMDMT-UHFFFAOYSA-N 3,5-xylenol Chemical compound CC1=CC(C)=CC(O)=C1 TUAMRELNJMMDMT-UHFFFAOYSA-N 0.000 description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 229910052782 aluminium Inorganic materials 0.000 description 7
- 239000011575 calcium Substances 0.000 description 7
- 229910052791 calcium Inorganic materials 0.000 description 7
- 150000001875 compounds Chemical class 0.000 description 7
- 238000005530 etching Methods 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 7
- DNIAPMSPPWPWGF-UHFFFAOYSA-N monopropylene glycol Natural products CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 7
- 229910052757 nitrogen Inorganic materials 0.000 description 7
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 6
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 6
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 6
- 239000003795 chemical substances by application Substances 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 229910017604 nitric acid Inorganic materials 0.000 description 6
- 229910052725 zinc Inorganic materials 0.000 description 6
- 239000011701 zinc Substances 0.000 description 6
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 239000007864 aqueous solution Substances 0.000 description 5
- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 239000011777 magnesium Substances 0.000 description 5
- 229910052749 magnesium Inorganic materials 0.000 description 5
- 229910052700 potassium Inorganic materials 0.000 description 5
- 239000011591 potassium Substances 0.000 description 5
- 229910001414 potassium ion Inorganic materials 0.000 description 5
- 239000000843 powder Substances 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- 235000012239 silicon dioxide Nutrition 0.000 description 5
- 235000012431 wafers Nutrition 0.000 description 5
- NKTOLZVEWDHZMU-UHFFFAOYSA-N 2,5-xylenol Chemical compound CC1=CC=C(C)C(O)=C1 NKTOLZVEWDHZMU-UHFFFAOYSA-N 0.000 description 4
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 4
- 229910001430 chromium ion Inorganic materials 0.000 description 4
- 239000000356 contaminant Substances 0.000 description 4
- 238000011109 contamination Methods 0.000 description 4
- 238000004821 distillation Methods 0.000 description 4
- 239000003623 enhancer Substances 0.000 description 4
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 4
- 239000011541 reaction mixture Substances 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000002002 slurry Substances 0.000 description 4
- 229910001415 sodium ion Inorganic materials 0.000 description 4
- 238000004528 spin coating Methods 0.000 description 4
- 229910001220 stainless steel Inorganic materials 0.000 description 4
- 239000010935 stainless steel Substances 0.000 description 4
- NPYPAHLBTDXSSS-UHFFFAOYSA-N Potassium ion Chemical compound [K+] NPYPAHLBTDXSSS-UHFFFAOYSA-N 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 239000011324 bead Substances 0.000 description 3
- 238000009833 condensation Methods 0.000 description 3
- 230000005494 condensation Effects 0.000 description 3
- 238000006482 condensation reaction Methods 0.000 description 3
- 238000010908 decantation Methods 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 239000000975 dye Substances 0.000 description 3
- 125000002485 formyl group Chemical class [H]C(*)=O 0.000 description 3
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 3
- 239000003504 photosensitizing agent Substances 0.000 description 3
- 239000004014 plasticizer Substances 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- SIWVGXQOXWGJCI-UHFFFAOYSA-N 1,2-bis(ethenyl)benzene;2-ethenylbenzenesulfonic acid Chemical compound C=CC1=CC=CC=C1C=C.OS(=O)(=O)C1=CC=CC=C1C=C SIWVGXQOXWGJCI-UHFFFAOYSA-N 0.000 description 2
- ANVNEINAONNWFY-UHFFFAOYSA-N 2,3-diethoxypropanoic acid Chemical compound CCOCC(C(O)=O)OCC ANVNEINAONNWFY-UHFFFAOYSA-N 0.000 description 2
- KUFFULVDNCHOFZ-UHFFFAOYSA-N 2,4-xylenol Chemical compound CC1=CC=C(O)C(C)=C1 KUFFULVDNCHOFZ-UHFFFAOYSA-N 0.000 description 2
- ZSLUVFAKFWKJRC-IGMARMGPSA-N 232Th Chemical compound [232Th] ZSLUVFAKFWKJRC-IGMARMGPSA-N 0.000 description 2
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 2
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 2
- FKNQFGJONOIPTF-UHFFFAOYSA-N Sodium cation Chemical compound [Na+] FKNQFGJONOIPTF-UHFFFAOYSA-N 0.000 description 2
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 2
- 229910052776 Thorium Inorganic materials 0.000 description 2
- 238000002835 absorbance Methods 0.000 description 2
- 239000002318 adhesion promoter Substances 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 239000002585 base Substances 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000010894 electron beam technology Methods 0.000 description 2
- BHXIWUJLHYHGSJ-UHFFFAOYSA-N ethyl 3-ethoxypropanoate Chemical compound CCOCCC(=O)OCC BHXIWUJLHYHGSJ-UHFFFAOYSA-N 0.000 description 2
- 229940116333 ethyl lactate Drugs 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- JEGUKCSWCFPDGT-UHFFFAOYSA-N h2o hydrate Chemical compound O.O JEGUKCSWCFPDGT-UHFFFAOYSA-N 0.000 description 2
- 239000011630 iodine Substances 0.000 description 2
- 229910052740 iodine Inorganic materials 0.000 description 2
- 229910052744 lithium Inorganic materials 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 239000002736 nonionic surfactant Substances 0.000 description 2
- 108091008695 photoreceptors Proteins 0.000 description 2
- 239000002952 polymeric resin Substances 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- 238000009877 rendering Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 239000011593 sulfur Substances 0.000 description 2
- 229910052717 sulfur Inorganic materials 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- SNICXCGAKADSCV-JTQLQIEISA-N (-)-Nicotine Chemical compound CN1CCC[C@H]1C1=CC=CN=C1 SNICXCGAKADSCV-JTQLQIEISA-N 0.000 description 1
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- ZRDYULMDEGRWRC-UHFFFAOYSA-N (4-hydroxyphenyl)-(2,3,4-trihydroxyphenyl)methanone Chemical compound C1=CC(O)=CC=C1C(=O)C1=CC=C(O)C(O)=C1O ZRDYULMDEGRWRC-UHFFFAOYSA-N 0.000 description 1
- CHRJZRDFSQHIFI-UHFFFAOYSA-N 1,2-bis(ethenyl)benzene;styrene Chemical compound C=CC1=CC=CC=C1.C=CC1=CC=CC=C1C=C CHRJZRDFSQHIFI-UHFFFAOYSA-N 0.000 description 1
- YZUPZGFPHUVJKC-UHFFFAOYSA-N 1-bromo-2-methoxyethane Chemical group COCCBr YZUPZGFPHUVJKC-UHFFFAOYSA-N 0.000 description 1
- YVLNDCLPPGIRCP-UHFFFAOYSA-N 2-nitro-3-phenylprop-2-enoic acid Chemical compound OC(=O)C([N+]([O-])=O)=CC1=CC=CC=C1 YVLNDCLPPGIRCP-UHFFFAOYSA-N 0.000 description 1
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 1
- OYPRJOBELJOOCE-BKFZFHPZSA-N Calcium-45 Chemical compound [45Ca] OYPRJOBELJOOCE-BKFZFHPZSA-N 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- 229920013683 Celanese Polymers 0.000 description 1
- 241000282994 Cervidae Species 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 101001018064 Homo sapiens Lysosomal-trafficking regulator Proteins 0.000 description 1
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 description 1
- 102100033472 Lysosomal-trafficking regulator Human genes 0.000 description 1
- WWKGVZASJYXZKN-UHFFFAOYSA-N Methyl violet 2B Chemical compound [Cl-].C1=CC(N(C)C)=CC=C1C(C=1C=CC(N)=CC=1)=C1C=CC(=[N+](C)C)C=C1 WWKGVZASJYXZKN-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- URLKBWYHVLBVBO-UHFFFAOYSA-N Para-Xylene Chemical group CC1=CC=C(C)C=C1 URLKBWYHVLBVBO-UHFFFAOYSA-N 0.000 description 1
- 241000287462 Phalacrocorax carbo Species 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 1
- 101100352915 Schizosaccharomyces pombe (strain 972 / ATCC 24843) ppb1 gene Proteins 0.000 description 1
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- 235000021355 Stearic acid Nutrition 0.000 description 1
- LEHOTFFKMJEONL-UHFFFAOYSA-N Uric Acid Chemical compound N1C(=O)NC(=O)C2=C1NC(=O)N2 LEHOTFFKMJEONL-UHFFFAOYSA-N 0.000 description 1
- TVWHNULVHGKJHS-UHFFFAOYSA-N Uric acid Natural products N1C(=O)NC(=O)C2NC(=O)NC21 TVWHNULVHGKJHS-UHFFFAOYSA-N 0.000 description 1
- KVXNKFYSHAUJIA-UHFFFAOYSA-N acetic acid;ethoxyethane Chemical group CC(O)=O.CCOCC KVXNKFYSHAUJIA-UHFFFAOYSA-N 0.000 description 1
- TUVYSBJZBYRDHP-UHFFFAOYSA-N acetic acid;methoxymethane Chemical compound COC.CC(O)=O TUVYSBJZBYRDHP-UHFFFAOYSA-N 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
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- 239000004840 adhesive resin Substances 0.000 description 1
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- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-O ammonium group Chemical group [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- BBEAQIROQSPTKN-UHFFFAOYSA-N antipyrene Natural products C1=CC=C2C=CC3=CC=CC4=CC=C1C2=C43 BBEAQIROQSPTKN-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
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- 229910052804 chromium Inorganic materials 0.000 description 1
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- 239000003086 colorant Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000008139 complexing agent Substances 0.000 description 1
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- GVEPBJHOBDJJJI-UHFFFAOYSA-N fluoranthrene Natural products C1=CC(C2=CC=CC=C22)=C3C2=CC=CC3=C1 GVEPBJHOBDJJJI-UHFFFAOYSA-N 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 238000005247 gettering Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 1
- 150000004679 hydroxides Chemical class 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000005342 ion exchange Methods 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 229910001416 lithium ion Inorganic materials 0.000 description 1
- 210000004185 liver Anatomy 0.000 description 1
- 238000005461 lubrication Methods 0.000 description 1
- IVSZLXZYQVIEFR-UHFFFAOYSA-N m-xylene Chemical group CC1=CC=CC(C)=C1 IVSZLXZYQVIEFR-UHFFFAOYSA-N 0.000 description 1
- 229940107698 malachite green Drugs 0.000 description 1
- FDZZZRQASAIRJF-UHFFFAOYSA-M malachite green Chemical compound [Cl-].C1=CC(N(C)C)=CC=C1C(C=1C=CC=CC=1)=C1C=CC(=[N+](C)C)C=C1 FDZZZRQASAIRJF-UHFFFAOYSA-M 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229940100630 metacresol Drugs 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- SYWIXHZXHQDFOO-UHFFFAOYSA-N methyl n-phenyliminocarbamate Chemical compound COC(=O)N=NC1=CC=CC=C1 SYWIXHZXHQDFOO-UHFFFAOYSA-N 0.000 description 1
- 238000001393 microlithography Methods 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- PGSADBUBUOPOJS-UHFFFAOYSA-N neutral red Chemical compound Cl.C1=C(C)C(N)=CC2=NC3=CC(N(C)C)=CC=C3N=C21 PGSADBUBUOPOJS-UHFFFAOYSA-N 0.000 description 1
- 229960002715 nicotine Drugs 0.000 description 1
- SNICXCGAKADSCV-UHFFFAOYSA-N nicotine Natural products CN1CCCC1C1=CC=CN=C1 SNICXCGAKADSCV-UHFFFAOYSA-N 0.000 description 1
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 229920006287 phenoxy resin Polymers 0.000 description 1
- 239000013034 phenoxy resin Substances 0.000 description 1
- OXNIZHLAWKMVMX-UHFFFAOYSA-N picric acid Chemical compound OC1=C([N+]([O-])=O)C=C([N+]([O-])=O)C=C1[N+]([O-])=O OXNIZHLAWKMVMX-UHFFFAOYSA-N 0.000 description 1
- 229920002189 poly(glycerol 1-O-monomethacrylate) polymer Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229910021426 porous silicon Inorganic materials 0.000 description 1
- 229940072033 potash Drugs 0.000 description 1
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Substances [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 description 1
- 235000015320 potassium carbonate Nutrition 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 238000006462 rearrangement reaction Methods 0.000 description 1
- 239000013557 residual solvent Substances 0.000 description 1
- 229920003987 resole Polymers 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 238000010561 standard procedure Methods 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000013519 translation Methods 0.000 description 1
- GQIUQDDJKHLHTB-UHFFFAOYSA-N trichloro(ethenyl)silane Chemical compound Cl[Si](Cl)(Cl)C=C GQIUQDDJKHLHTB-UHFFFAOYSA-N 0.000 description 1
- HQUQLFOMPYWACS-UHFFFAOYSA-N tris(2-chloroethyl) phosphate Chemical compound ClCCOP(=O)(OCCCl)OCCCl HQUQLFOMPYWACS-UHFFFAOYSA-N 0.000 description 1
- 229940116269 uric acid Drugs 0.000 description 1
- LLWJPGAKXJBKKA-UHFFFAOYSA-N victoria blue B Chemical compound [Cl-].C1=CC(N(C)C)=CC=C1C(C=1C=CC(=CC=1)N(C)C)=C(C=C1)C2=CC=CC=C2C1=[NH+]C1=CC=CC=C1 LLWJPGAKXJBKKA-UHFFFAOYSA-N 0.000 description 1
- 239000005050 vinyl trichlorosilane Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G8/00—Condensation polymers of aldehydes or ketones with phenols only
- C08G8/04—Condensation polymers of aldehydes or ketones with phenols only of aldehydes
- C08G8/08—Condensation polymers of aldehydes or ketones with phenols only of aldehydes of formaldehyde, e.g. of formaldehyde formed in situ
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G8/00—Condensation polymers of aldehydes or ketones with phenols only
- C08G8/04—Condensation polymers of aldehydes or ketones with phenols only of aldehydes
- C08G8/08—Condensation polymers of aldehydes or ketones with phenols only of aldehydes of formaldehyde, e.g. of formaldehyde formed in situ
- C08G8/10—Condensation polymers of aldehydes or ketones with phenols only of aldehydes of formaldehyde, e.g. of formaldehyde formed in situ with phenol
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
- G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
- G03F7/0236—Condensation products of carbonyl compounds and phenolic compounds, e.g. novolak resins
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Phenolic Resins Or Amino Resins (AREA)
- Materials For Photolithography (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
Description
Claims (42)
- 1.水に不溶で、水性アルカリに可溶なノボラック樹脂の製造法であって、 a)酸性イオン交換樹脂を水で洗浄し、前記イオン交換樹脂を鉱酸溶液で洗浄し 、それによってイオン交換樹脂中のナトリウムおよび鉄イオンの総量を500p pb未満に下げること、 b)前記イオン交換樹脂に水/ホルムアルデヒド溶液を通し、それによって前記 溶液のナトリウムおよび鉄イオンの総量を500ppb未満に下げること、c) ナトリウムおよび鉄イオンの総含有量が200ppb未満である、1種またはそ れより多いフェノール性化合物を用意すること、 d)前記ホルムアルデヒドを前記1種またはそれより多いフェノール性化合物と 、触媒の存在下で縮合させ、それによって水に不溶で、水性アルカリに可溶な、 ナトリウムおよび鉄イオンの総量が500ppb未満であるノボラック樹脂を製 造すること、 を含むことを特徴とする方法。
- 2.前記触媒が酸触媒である、請求項1に記載の方法。
- 3.前記酸触媒を前記イオン交換樹脂に通す、請求項2に記載の方法。
- 4.ナトリウムおよび鉄イオンの総量を500ppb未満に低下させる、請求項 3に記載の方法。
- 5.前記イオン交換樹脂が、ナトリウムおよび鉄イオンの総量が100ppb未 満に低下するまで洗浄される、請求項1に記載の方法。
- 6.前記触媒のナトリウムおよび鉄イオンの総量が100ppb未満であり、製 造されるノボラック樹脂のナトリウムおよび鉄イオンの総量が180ppb未満 である、請求項5に記載の方法。
- 7.ポジ型フォトレジスト組成物の製造法であって、a)酸性イオン交換樹脂を 水で洗浄し、前記イオン交換樹脂を鉱酸溶液で洗浄し、それによつでイオン交換 樹脂中の金属イオンの総量を500ppb未満に下げること、b)前記イオン交 換樹脂に水/ホルムアルデヒド溶液を通し、それによって前記溶液の金属イオン の総量を500ppb未満に下げること、 c)金属イオンの総含有量が200ppb未満である、1種またはそれより多い フェノール性化合物を用意すること、 d)前記ホルムアルデヒドを前記1種またはそれより多いフェノール性化合物と 、触媒の存在下で縮合させ、それによって水に不溶で、水性アルカリに可溶な、 金属イオンの総量が500ppb未満であるノボラック樹脂を製造すること、 e)1)フォトレジスト組成物を光増感させるのに十分な量の感光性成分、2) 前記水に不溶で、水性アルカリに可溶なノボラック樹脂、および3)好適な溶剤 の混合物を用意すること、 を含んでなることを特徴とする方法。
- 8.前記触媒が酸触媒である、請求項7の方法。
- 9.前記酸触媒を前記イオン交換樹脂に通す、請求項8に記載の方法。
- 10.ナトリウムおよび鉄イオンの総量を500ppb未満に低下させる、請求 項9に記載の方法。
- 11.前記イオン交換樹脂を、ナトリウムおよび鉄イオンの総量が100ppb 未満に低下するまで洗浄する、請求項7に記載の方法。
- 12.前記触媒のナトリウムおよび鉄イオンの総量が100ppb未満であり、 製造されるノボラック樹脂のナトリウムおよび鉄イオンの総量が180ppb未 満である、請求項11に記載の方法。
- 13.前記溶剤が、プロピレングリコールメチルエーテルアセテートおよびエチ ル−3−エトキシプロピオネートからなる群から選択される、請求項7に記載の 方法。
- 14.好適な基材上に写真画像を形成することにより、半導体デバイスを製造す る方法であって、a)酸性イオン交換樹脂を水で洗浄し、前記イオン交換樹脂を 鉱酸溶液で洗浄し、それによってイオン交換樹脂中の金属イオンの総量を500 ppb未満に下げること、b)前記イオン交換樹脂に水/ホルムアルデヒド溶液 を通し、それによって前記溶液の金属イオンの総量を500ppb未満に下げる こと、 c)金属イオンの総含有量が200ppb未満である、1種またはそれより多い フェノール性化合物を用意すること、 d)前記ホルムアルデヒドを前記1種またはそれより多いフェノール性化合物と 、触媒の存在下で縮合させ、それによって水に不溶で、水性アルカリに可溶な、 金属イオンの総量が500ppb未満であるノボラック樹脂を製造すること、 e)1)フォトレジスト組成物を光増感させるのに十分な量の感光性成分、2) 前記水に不溶で、水性アルカリに可溶なノボラック樹脂、および3)好適な溶剤 の混合物を用意し、それによってポジ型フォトレジスト組成物を製造すること、 f)好適な基材を前記フォトレジスト組成物で被覆すること、 g)被覆された基材を、実質的にすべての溶剤が除去されるまで熱処理すること 、 h)前記フォトレジスト組成物を像様に露光すること、および i)前記フォトレジスト組成物の、像様に露光した区域を好適な現像剤で除去す ること、 を含んでなることを特徴とする方法。
- 15.前記触媒が酸触媒である、請求項14の方法。
- 16.前記酸触媒を前記イオン交換樹脂に通す、請求項15に記載の方法。
- 17.ナトリウムおよび鉄イオンの総量を500ppb未満に低下させる、請求 項16に記載の方法。
- 18.前記イオン交換樹脂が、ナトリウムおよび鉄イオンの総量が100ppb 未満に低下するまで洗浄される、請求項14に記載の方法。
- 19.前記触媒のナトリウムおよび鉄イオンの総量が100ppb未満であり、 製造されるノボラック樹脂のナトリウムおよび鉄イオンの総量が180ppb未 満である、請求項18に記載の方法。
- 20.前記溶剤が、プロピレングリコールメチルエーテルアセテートおよびエチ ル−3−エトキシプロピオネートからなる群から選択される、請求項14に記載 の方法。
- 21.水に不溶で、水性アルカリに可溶な、金属イオン含有量が非常に低いノボ ラック樹脂の製造法であって、 a)酸性イオン交換樹脂を水で処理し、続いて前記イオン交換樹脂を鉱酸溶液で 洗浄し、それによって前記イオン交換樹脂中のナトリウムおよび鉄イオンの総量 を500ppb未満に下げること、 b)ノボラック樹脂を好適な溶剤に溶解させた溶液を用意すること、 C)前記イオン交換樹脂を、ノボラック樹脂溶剤と相容性がある溶剤で洗浄する こと、および d)前記イオン交換樹脂にノボラック樹脂溶液を通し、それによって前記溶液の ナトリウムおよび鉄イオンの総量を500ppb未満に下げること、 を含んでなることを特徴とする方法。
- 22.ノボラック樹脂のナトリウムおよび鉄イオンの総量を500ppb未満に 下げる、請求項21に記載の方法。
- 23.前記イオン交換樹脂が、ナトリウムおよび鉄イオンの総量が100ppb 未満に下がるまで洗浄される、請求項21に記載の方法。
- 24.製造された前記ノボラック樹脂の、ナトリウムおよび鉄イオンの総量が1 80ppb未満である、請求項21に記載の方法。
- 25.前記溶剤が、プロピレングリコールメチルエーテルアセテートおよびエチ ル−3−エトキシプロピオネートからなる群から選択される、請求項21に記載 の方法。
- 26.ノボラック樹脂の溶剤および前記イオン交換樹脂の洗浄に使用される溶剤 が同一である、請求項21に記載の方法。
- 27.金属イオン含有量が非常に低いポジ型フォトレジストの製造法であって、 a)酸性イオン交換樹脂を水で処理し、続いて前記イオン交換樹脂を鉱酸溶液で 洗浄し、それによって前記イオン交換樹脂中のナトリウムおよび鉄イオンの総量 を500ppb未満に下げること、 b)ノボラック樹脂を好適な溶剤に溶解させた溶液を用意すること、 c)前記酸性イオン交換樹脂を、ノボラック樹脂溶剤と相容性がある溶剤で洗浄 すること、 d)前記イオン交換樹脂にノボラック樹脂溶液を通し、それによって前記溶液の ナトリウムおよび鉄イオンの総量を500ppb未満に下げること、およびe) 1)フォトレジスト組成物を光増感させるのに十分な量の感光性成分、2)前記 水に不溶で、水性アルカリに可溶な、金属イオンの総量が非常に少ないノボラッ ク樹脂、および3)好適な溶剤の混合物を用意すること、を含んでなることを特 徴とする方法。
- 28.ノボラック樹脂のナトリウムおよび鉄イオンの総量を500ppb未満に 下げる、請求項27に記載の方法。
- 29.前記イオン交換樹脂が、ナトリウムおよび鉄イオンの総量が100ppb 未満に下がるまで洗浄される、請求項27に記載の方法。
- 30.製造された前記ノボラック樹脂の、ナトリウムおよび鉄イオンの総量が1 80ppb未満である、請求項27に記載の方法。
- 31.前記溶剤が、プロピレングリコールメチルエーテルアセテートおよびエチ ル−3−エトキシプロピオネートからなる群から選択されることを特徴とする、 請求項27に記載の方法。
- 32.ノボラック樹脂の溶剤および前記イオン交換樹脂の洗浄に使用される溶剤 が同一である、請求項27に記載の方法。
- 33.ノボラック樹脂の溶剤、前記イオン交換樹脂の洗浄に使用される溶剤、お よび前記フォトレジスト組成物用の溶剤がすべて同一である、請求項27に記載 の方法。
- 34.好適な基材をポジ型フォトレジスト組成物で被覆し、基材上に写真画像を 形成することにより半導体デバイスを製造する方法であって、 a)酸性イオン交換樹脂を水で処理し、続いて前記イオン交換樹脂を鉱酸溶液で 洗浄し、それによって前記イオン交換樹脂中のナトリウムおよび鉄イオンの総量 を500ppb未満に下げること、 b)ノボラック樹脂を好適な溶剤に溶解させた溶液を用意すること、 c)前記酸性イオン交換樹脂を、ノボラック樹脂溶剤と相容性がある溶剤で洗浄 すること、 d)前記イオン交換樹脂にノボラック樹脂溶液を通し、それによって前記溶液の ナトリウムおよび鉄イオンの総量を500ppb未満済に下げること、e)1) フォトレジスト組成物を光増感させるのに十分な量の感光性成分、2)水に不溶 で、水性アルカリに可溶な、金属イオンの総量が非常に少ないノボラック樹脂、 および3)好適な溶剤の混合物を用意すること、およびf)被覆された基材を実 質的にすべての溶剤が除去されるまで熱処理し、感光性組成物を像様に露光させ 、その様な組成物の、像様に露光した区域を、好適な現像剤で除去すること、 を含んでなることを特徴とする方法。
- 35.前記現像剤が水性アルカリ現像剤である、請求項34に記載の方法。
- 36.さらに、除去工程の直前または後に、被覆した基材を焼き付ける工程を含 む、請求項34に記載の方法。
- 37.ノボラック樹脂のナトリウムおよび鉄イオンの総量を500ppb未満に 下げる、請求項34に記載の方法。
- 38.前記イオン交換樹脂が、ナトリウムおよび鉄イオンの総量が100ppb 未満に下がるまで洗浄される、請求項34に記載の方法。
- 39.製造された前記ノボラック樹脂の、ナトリウムおよび鉄イオンの総量が1 80ppb未満である、請求項34に記載の方法。
- 40.前記溶剤が、プロピレングリコールメチルエーテルアセテートおよびエチ ル−3−エトキシプロピオネートからなる群から選択される、請求項34に記載 の方法。
- 41.ノボラック樹脂の溶剤および前記イオン交換樹脂の洗浄に使用される溶剤 が同一である、請求項34に記載の方法。
- 42.ノボラック樹脂の溶剤、前記イオン交換樹脂の洗浄に使用される溶剤、お よび前記フォトレジスト組成物用の溶剤がすべて同一である、請求項34に記載 の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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US80959191A | 1991-12-18 | 1991-12-18 | |
US809,591 | 1991-12-18 | ||
PCT/US1992/010834 WO1993012152A1 (en) | 1991-12-18 | 1992-12-15 | Metal ion reduction in novolak resins |
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JP2002255832A Division JP4065746B2 (ja) | 1991-12-18 | 2002-07-29 | ノボラック樹脂中の金属イオンの低減 |
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JPH07502295A true JPH07502295A (ja) | 1995-03-09 |
JP3630422B2 JP3630422B2 (ja) | 2005-03-16 |
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Family Applications (2)
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---|---|---|---|
JP51114293A Expired - Lifetime JP3630422B2 (ja) | 1991-12-18 | 1992-12-15 | ノボラック樹脂中の金属イオンの低減 |
JP2002255832A Expired - Fee Related JP4065746B2 (ja) | 1991-12-18 | 2002-07-29 | ノボラック樹脂中の金属イオンの低減 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2002255832A Expired - Fee Related JP4065746B2 (ja) | 1991-12-18 | 2002-07-29 | ノボラック樹脂中の金属イオンの低減 |
Country Status (7)
Country | Link |
---|---|
US (1) | US5594098A (ja) |
EP (1) | EP0617709B1 (ja) |
JP (2) | JP3630422B2 (ja) |
KR (1) | KR100231655B1 (ja) |
DE (1) | DE69215383T2 (ja) |
SG (1) | SG48902A1 (ja) |
WO (1) | WO1993012152A1 (ja) |
Cited By (5)
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JPH08503983A (ja) * | 1992-11-25 | 1996-04-30 | ヘキスト、セラニーズ、コーポレーション | フォトレジスト用底部反射防止塗料における金属イオンの低減 |
JPH08505886A (ja) * | 1992-12-29 | 1996-06-25 | ヘキスト、セラニーズ、コーポレーション | 原料中の金属イオンの低減 |
JP2002182402A (ja) * | 2000-12-18 | 2002-06-26 | Shin Etsu Chem Co Ltd | レジストのベースポリマーの精製方法 |
JP2005075767A (ja) * | 2003-08-29 | 2005-03-24 | Idemitsu Kosan Co Ltd | フォトレジスト基材及びその精製方法、並びにフォトレジスト組成物 |
JPWO2005097725A1 (ja) * | 2004-04-05 | 2008-02-28 | 出光興産株式会社 | カリックスレゾルシナレン化合物、フォトレジスト基材及びその組成物 |
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US5614352A (en) * | 1994-12-30 | 1997-03-25 | Hoechst Celanese Corporation | Metal ion reduction in novolak resins solution in PGMEA by chelating ion exchange resin |
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US5693749A (en) * | 1995-09-20 | 1997-12-02 | Hoechst Celanese Corporation | Fractionation of phenol formaldehyde condensate and photoresist compositions produced therefrom |
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US5750031A (en) * | 1995-09-26 | 1998-05-12 | Clariant Finance (Bvi) Limited | Process for producing surfactant having a low metal ion level and developer produced therefrom |
US5656413A (en) * | 1995-09-28 | 1997-08-12 | Hoechst Celanese Corporation | Low metal ion containing 4,4'-[1-[4-[1-(4-Hydroxyphenyl)-1-methylethyl]phenyl]ethylidene]bisphe nol and photoresist compositions therefrom |
US5962183A (en) * | 1995-11-27 | 1999-10-05 | Clariant Finance (Bvi) Limited | Metal ion reduction in photoresist compositions by chelating ion exchange resin |
US5665517A (en) * | 1996-01-11 | 1997-09-09 | Hoechst Celanese Corporation | Acidic ion exchange resin as a catalyst to synthesize a novolak resin and photoresist composition therefrom |
US5789522A (en) * | 1996-09-06 | 1998-08-04 | Shipley Company, L.L.C. | Resin purification process |
US5702611A (en) * | 1997-01-14 | 1997-12-30 | Shipley Company, L.L.C. | Process for removing heavy metal ions by ion exchange |
US6200479B1 (en) | 1997-01-14 | 2001-03-13 | Shipley Company, L.L.C. | Phenolic resin purification |
US5936071A (en) * | 1998-02-02 | 1999-08-10 | Clariant Finance (Bvi) Limited | Process for making a photoactive compound and photoresist therefrom |
US20040206702A1 (en) * | 2002-08-08 | 2004-10-21 | Davidson James M. | Use of an oxidizer to improve trace metals removal from photoresist and photoresist components |
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08503983A (ja) * | 1992-11-25 | 1996-04-30 | ヘキスト、セラニーズ、コーポレーション | フォトレジスト用底部反射防止塗料における金属イオンの低減 |
JPH08505886A (ja) * | 1992-12-29 | 1996-06-25 | ヘキスト、セラニーズ、コーポレーション | 原料中の金属イオンの低減 |
JP2002182402A (ja) * | 2000-12-18 | 2002-06-26 | Shin Etsu Chem Co Ltd | レジストのベースポリマーの精製方法 |
JP2005075767A (ja) * | 2003-08-29 | 2005-03-24 | Idemitsu Kosan Co Ltd | フォトレジスト基材及びその精製方法、並びにフォトレジスト組成物 |
JPWO2005097725A1 (ja) * | 2004-04-05 | 2008-02-28 | 出光興産株式会社 | カリックスレゾルシナレン化合物、フォトレジスト基材及びその組成物 |
Also Published As
Publication number | Publication date |
---|---|
JP2003160625A (ja) | 2003-06-03 |
DE69215383T2 (de) | 1997-04-30 |
EP0617709A1 (en) | 1994-10-05 |
JP4065746B2 (ja) | 2008-03-26 |
JP3630422B2 (ja) | 2005-03-16 |
WO1993012152A1 (en) | 1993-06-24 |
SG48902A1 (en) | 1998-05-18 |
EP0617709B1 (en) | 1996-11-20 |
KR100231655B1 (ko) | 1999-11-15 |
KR940703873A (ko) | 1994-12-12 |
DE69215383D1 (de) | 1997-01-02 |
US5594098A (en) | 1997-01-14 |
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