JPH0582976B2 - - Google Patents
Info
- Publication number
- JPH0582976B2 JPH0582976B2 JP60178054A JP17805485A JPH0582976B2 JP H0582976 B2 JPH0582976 B2 JP H0582976B2 JP 60178054 A JP60178054 A JP 60178054A JP 17805485 A JP17805485 A JP 17805485A JP H0582976 B2 JPH0582976 B2 JP H0582976B2
- Authority
- JP
- Japan
- Prior art keywords
- lead
- board
- solder
- leads
- swinging
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3468—Applying molten solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17805485A JPS6237956A (ja) | 1985-08-12 | 1985-08-12 | 半田付装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17805485A JPS6237956A (ja) | 1985-08-12 | 1985-08-12 | 半田付装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6237956A JPS6237956A (ja) | 1987-02-18 |
JPH0582976B2 true JPH0582976B2 (enrdf_load_stackoverflow) | 1993-11-24 |
Family
ID=16041793
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP17805485A Granted JPS6237956A (ja) | 1985-08-12 | 1985-08-12 | 半田付装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6237956A (enrdf_load_stackoverflow) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6125540A (en) * | 1998-02-17 | 2000-10-03 | Newcourt, Inc. | Continuous process for forming structure suitable for use as a core member |
US6199342B1 (en) | 1998-02-17 | 2001-03-13 | Newcourt, Inc. | Method for forming structure suitable for use as a core member |
US6506276B1 (en) | 2000-06-12 | 2003-01-14 | Newcourt, Inc. | Method for forming a cellular core member |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CH647554A5 (de) * | 1980-01-30 | 1985-01-31 | Siemens Ag Albis | Einrichtung zum beaufschlagen der anschluesse von integrierten bausteinen mit lot. |
-
1985
- 1985-08-12 JP JP17805485A patent/JPS6237956A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS6237956A (ja) | 1987-02-18 |
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