JPH0582745B2 - - Google Patents

Info

Publication number
JPH0582745B2
JPH0582745B2 JP59098241A JP9824184A JPH0582745B2 JP H0582745 B2 JPH0582745 B2 JP H0582745B2 JP 59098241 A JP59098241 A JP 59098241A JP 9824184 A JP9824184 A JP 9824184A JP H0582745 B2 JPH0582745 B2 JP H0582745B2
Authority
JP
Japan
Prior art keywords
alloy
copper
sealing
lead frame
composite material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59098241A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60242653A (ja
Inventor
Teruo Watanabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Daido Steel Co Ltd
Original Assignee
Daido Steel Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daido Steel Co Ltd filed Critical Daido Steel Co Ltd
Priority to JP59098241A priority Critical patent/JPS60242653A/ja
Publication of JPS60242653A publication Critical patent/JPS60242653A/ja
Publication of JPH0582745B2 publication Critical patent/JPH0582745B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W70/457—
    • H10W72/07551—
    • H10W72/50—
    • H10W90/754—
    • H10W90/756—

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP59098241A 1984-05-16 1984-05-16 リ−ドフレ−ム用複合材 Granted JPS60242653A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59098241A JPS60242653A (ja) 1984-05-16 1984-05-16 リ−ドフレ−ム用複合材

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59098241A JPS60242653A (ja) 1984-05-16 1984-05-16 リ−ドフレ−ム用複合材

Publications (2)

Publication Number Publication Date
JPS60242653A JPS60242653A (ja) 1985-12-02
JPH0582745B2 true JPH0582745B2 (cg-RX-API-DMAC10.html) 1993-11-22

Family

ID=14214462

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59098241A Granted JPS60242653A (ja) 1984-05-16 1984-05-16 リ−ドフレ−ム用複合材

Country Status (1)

Country Link
JP (1) JPS60242653A (cg-RX-API-DMAC10.html)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62217649A (ja) * 1986-03-18 1987-09-25 Kyocera Corp 混成集積回路素子収納用パツケ−ジ
JPS6489552A (en) * 1987-09-30 1989-04-04 Toshiba Corp Ceramic substrate
JPH02109357A (ja) * 1988-10-18 1990-04-23 Sumitomo Special Metals Co Ltd プラスチックモールド用クラッド板の製造方法
JPH03218660A (ja) * 1989-08-25 1991-09-26 Kyocera Corp 半導体素子収納用パッケージ
JPH07109869B2 (ja) * 1989-12-01 1995-11-22 日立金属株式会社 リードフレーム用部材
JPH03188659A (ja) * 1989-12-19 1991-08-16 Toppan Printing Co Ltd 半導体集積回路用リードフレーム
JPH085563Y2 (ja) * 1990-03-31 1996-02-14 日本アビオニクス株式会社 高電力ハイブリッドｉｃ用金属パッケージ
JPH03290957A (ja) * 1990-04-06 1991-12-20 Sumitomo Special Metals Co Ltd プラスチックスパッケージ用リードフレーム材料
JPH03290956A (ja) * 1990-04-06 1991-12-20 Sumitomo Special Metals Co Ltd プラスチックスパッケージ用リードフレーム材料
US5831332A (en) * 1991-05-17 1998-11-03 Fujitsu Limited Semiconductor package for surface mounting
JPH0831559B2 (ja) * 1991-05-17 1996-03-27 富士通株式会社 半導体装置
DE69222084T2 (de) * 1991-05-17 1998-01-22 Fujitsu Ltd Oberflächenmontierbare Halbleiterpackung
KR0163871B1 (ko) * 1995-11-25 1998-12-01 김광호 하부에 히트 싱크가 부착된 솔더 볼 어레이 패키지
JP2008243522A (ja) * 2007-03-27 2008-10-09 Matsushita Electric Ind Co Ltd プラズマディスプレイパネル
JP6657947B2 (ja) * 2015-12-28 2020-03-04 Tdk株式会社 電子部品

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5916353A (ja) * 1982-07-19 1984-01-27 Sumitomo Electric Ind Ltd リ−ドフレ−ム

Also Published As

Publication number Publication date
JPS60242653A (ja) 1985-12-02

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