JPH0580929B2 - - Google Patents

Info

Publication number
JPH0580929B2
JPH0580929B2 JP20721086A JP20721086A JPH0580929B2 JP H0580929 B2 JPH0580929 B2 JP H0580929B2 JP 20721086 A JP20721086 A JP 20721086A JP 20721086 A JP20721086 A JP 20721086A JP H0580929 B2 JPH0580929 B2 JP H0580929B2
Authority
JP
Japan
Prior art keywords
epoxy resin
acid anhydride
hydroxyl group
semiconductor device
group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP20721086A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6362363A (ja
Inventor
Toshimichi Suzuki
Isao Urazuka
Hiroshi Yamamoto
Shigeru Katayama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Priority to JP61207210A priority Critical patent/JPS6362363A/ja
Publication of JPS6362363A publication Critical patent/JPS6362363A/ja
Publication of JPH0580929B2 publication Critical patent/JPH0580929B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/50—Encapsulations or containers

Landscapes

  • Led Device Packages (AREA)
  • Light Receiving Elements (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Led Devices (AREA)
  • Epoxy Resins (AREA)
JP61207210A 1986-09-03 1986-09-03 光半導体装置 Granted JPS6362363A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61207210A JPS6362363A (ja) 1986-09-03 1986-09-03 光半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61207210A JPS6362363A (ja) 1986-09-03 1986-09-03 光半導体装置

Publications (2)

Publication Number Publication Date
JPS6362363A JPS6362363A (ja) 1988-03-18
JPH0580929B2 true JPH0580929B2 (enExample) 1993-11-10

Family

ID=16536061

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61207210A Granted JPS6362363A (ja) 1986-09-03 1986-09-03 光半導体装置

Country Status (1)

Country Link
JP (1) JPS6362363A (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69032695T2 (de) * 1990-07-16 1999-02-25 Nitto Denko Corp., Ibaraki, Osaka Herstellung von Epoxyharzen für Photohalbleiter
JP5580212B2 (ja) * 2008-12-19 2014-08-27 日本化薬株式会社 カルボン酸化合物及びそれを含有するエポキシ樹脂組成物
KR20120085256A (ko) * 2009-10-06 2012-07-31 닛뽄 가야쿠 가부시키가이샤 다가 카르복실산 조성물과 그 제조 방법, 및 그 다가 카르복실산 조성물을 함유하여 이루어지는 경화성 수지 조성물
JP5457282B2 (ja) * 2010-06-14 2014-04-02 新日鉄住金化学株式会社 エポキシシリコーン樹脂含有硬化性樹脂組成物
JP2014111675A (ja) * 2011-03-17 2014-06-19 Nissan Chem Ind Ltd シリカ含有エポキシ硬化剤の製造方法
KR20140022828A (ko) * 2011-04-07 2014-02-25 닛뽄 가야쿠 가부시키가이샤 다가 카르복실산 수지 및 그 조성물
JP5993003B2 (ja) * 2012-05-31 2016-09-14 日本化薬株式会社 多価カルボン酸組成物、多価カルボン酸組成物の製造方法、エポキシ樹脂用硬化剤組成物、エポキシ樹脂組成物および硬化物
WO2014136693A1 (ja) * 2013-03-05 2014-09-12 日本化薬株式会社 多価カルボン酸組成物、エポキシ樹脂用硬化剤組成物、エポキシ樹脂組成物およびその硬化物
JP6602170B2 (ja) * 2015-11-16 2019-11-06 日本化薬株式会社 多価カルボン酸樹脂およびそれを含有する多価カルボン酸樹脂組成物、エポキシ樹脂組成物、熱硬化性樹脂組成物、それらの硬化物並びに半導体装置

Also Published As

Publication number Publication date
JPS6362363A (ja) 1988-03-18

Similar Documents

Publication Publication Date Title
US5492981A (en) Casting resin of epoxyalkylsiloxane, epoxy resin and anhyride
KR101692450B1 (ko) 다가 카르복시산, 그 조성물, 경화성 수지 조성물, 경화물 및 다가 카르복시산의 제조방법
JPS5855969B2 (ja) コウカカノウナエポキシジユシソセイブツ
JP4371211B2 (ja) 熱硬化性樹脂組成物及び光半導体封止剤
TW201116555A (en) Polycarboxylic acid composition, process for preparation thereof, and curable resin compositions containing the polycarboxylic acid composition
TW201245288A (en) Polycarboxylic acid resin and composition thereof
US20110201763A1 (en) Thermosetting resin composition for optical-semiconductor element encapsulation and cured material thereof, and optical-semiconductor device obtained using the same
JPH10158473A (ja) 光半導体素子封止用エポキシ樹脂組成物、及び該エポキシ樹脂組成物を用いて封止された光半導体装置
JPH0580929B2 (enExample)
JP3283606B2 (ja) オルガノポリシロキサン及びこれを含有するエポキシ樹脂組成物
JP2004155865A (ja) 変性ポリシロキサン及びそれを用いた硬化性樹脂組成物
JPH06100762A (ja) エポキシ樹脂組成物
KR101683891B1 (ko) 광 반도체 소자 밀봉용 수지 조성물
JP5842600B2 (ja) エポキシ樹脂組成物、硬化物、透明封止材料及び光半導体装置
JPH07288330A (ja) 光半導体装置
KR100877281B1 (ko) 산무수물계 에폭시 수지 경화제의 제조방법, 산무수물계 에폭시 수지 경화제, 에폭시 수지 조성물, 그 경화물 및 광반도체장치
SU578897A3 (ru) Эпоксидна композици
KR101784019B1 (ko) 광반도체 장치용 에폭시 수지 조성물 및 이를 사용한 광반도체 장치
JP3183474B2 (ja) エポキシ樹脂組成物
CN101210168B (zh) 封装材料组合物
JP2760889B2 (ja) 光半導体装置
JPH04209624A (ja) 光半導体封止用エポキシ樹脂組成物
KR101591134B1 (ko) 경화성 조성물
JP2692519B2 (ja) エポキシ樹脂組成物
JPH0532866A (ja) 光透過性エポキシ樹脂組成物及び光半導体装置