JPH0566015B2 - - Google Patents
Info
- Publication number
- JPH0566015B2 JPH0566015B2 JP58126051A JP12605183A JPH0566015B2 JP H0566015 B2 JPH0566015 B2 JP H0566015B2 JP 58126051 A JP58126051 A JP 58126051A JP 12605183 A JP12605183 A JP 12605183A JP H0566015 B2 JPH0566015 B2 JP H0566015B2
- Authority
- JP
- Japan
- Prior art keywords
- pellet
- bonding
- cavity
- package
- center position
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H10W72/0711—
-
- H10W72/073—
-
- H10W72/07337—
-
- H10W90/736—
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58126051A JPS6018926A (ja) | 1983-07-13 | 1983-07-13 | ペレツトボンデイング装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58126051A JPS6018926A (ja) | 1983-07-13 | 1983-07-13 | ペレツトボンデイング装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6018926A JPS6018926A (ja) | 1985-01-31 |
| JPH0566015B2 true JPH0566015B2 (enExample) | 1993-09-20 |
Family
ID=14925427
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58126051A Granted JPS6018926A (ja) | 1983-07-13 | 1983-07-13 | ペレツトボンデイング装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6018926A (enExample) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6386528A (ja) * | 1986-09-30 | 1988-04-16 | Toshiba Corp | ダイボンデイング装置 |
| US4769534A (en) * | 1986-11-17 | 1988-09-06 | Tektronix, Inc. | Optical detector with storage effects reduction |
| JPH0775238B2 (ja) * | 1988-07-29 | 1995-08-09 | シャープ株式会社 | ダイボンダ |
| JP5022598B2 (ja) * | 2005-12-27 | 2012-09-12 | 株式会社東芝 | ボンディング装置及び半導体装置の製造方法 |
| JP5468848B2 (ja) * | 2009-08-31 | 2014-04-09 | トッパン・フォームズ株式会社 | 塗布量検出装置及び塗布量検出方法 |
| US20230274987A1 (en) * | 2022-02-25 | 2023-08-31 | Applied Materials, Inc. | Machine learning & integrated metrology for run-to-run optimization of chip-to-wafer alignment accuracy |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56164545A (en) * | 1980-05-21 | 1981-12-17 | Hitachi Ltd | Pellet bonding inspection and device therefor |
| JPS57169250A (en) * | 1981-04-13 | 1982-10-18 | Hitachi Ltd | Bonding method for pellet |
-
1983
- 1983-07-13 JP JP58126051A patent/JPS6018926A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6018926A (ja) | 1985-01-31 |
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