JPH0582741B2 - - Google Patents

Info

Publication number
JPH0582741B2
JPH0582741B2 JP59270686A JP27068684A JPH0582741B2 JP H0582741 B2 JPH0582741 B2 JP H0582741B2 JP 59270686 A JP59270686 A JP 59270686A JP 27068684 A JP27068684 A JP 27068684A JP H0582741 B2 JPH0582741 B2 JP H0582741B2
Authority
JP
Japan
Prior art keywords
wire
wire bonding
ball
pad
inspection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP59270686A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61148828A (ja
Inventor
Tosha Nemoto
Mutsumi Suematsu
Masayoshi Yamaguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP59270686A priority Critical patent/JPS61148828A/ja
Publication of JPS61148828A publication Critical patent/JPS61148828A/ja
Publication of JPH0582741B2 publication Critical patent/JPH0582741B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/0711—
    • H10W72/07173—
    • H10W72/07178—
    • H10W72/075—
    • H10W72/07531—
    • H10W72/536—
    • H10W72/5363—
    • H10W72/884—
    • H10W90/736—
    • H10W90/756—

Landscapes

  • Length Measuring Devices By Optical Means (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Wire Bonding (AREA)
JP59270686A 1984-12-24 1984-12-24 ワイヤボンデイングの検査方法 Granted JPS61148828A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59270686A JPS61148828A (ja) 1984-12-24 1984-12-24 ワイヤボンデイングの検査方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59270686A JPS61148828A (ja) 1984-12-24 1984-12-24 ワイヤボンデイングの検査方法

Publications (2)

Publication Number Publication Date
JPS61148828A JPS61148828A (ja) 1986-07-07
JPH0582741B2 true JPH0582741B2 (enExample) 1993-11-22

Family

ID=17489534

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59270686A Granted JPS61148828A (ja) 1984-12-24 1984-12-24 ワイヤボンデイングの検査方法

Country Status (1)

Country Link
JP (1) JPS61148828A (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0732188B2 (ja) * 1986-12-03 1995-04-10 ビュー・エンジニアリング・インコーポレーテッド 半導体装置の検査装置
US4872052A (en) * 1986-12-03 1989-10-03 View Engineering, Inc. Semiconductor device inspection system
JPH01142407A (ja) * 1987-11-30 1989-06-05 Toshiba Corp ワイヤボンディングの検査装置
JPH0538011U (ja) * 1991-08-29 1993-05-21 穰 杉山 橋梁継目用雨水受装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57134944A (en) * 1981-02-16 1982-08-20 Toshiba Corp Wire bonding device
JPS57198638A (en) * 1981-05-30 1982-12-06 Toshiba Corp Detection of wire bonding state and device therefore
JPS59139638A (ja) * 1983-01-31 1984-08-10 Hitachi Ltd 半導体装置の検査方法及び装置
JPS59144140A (ja) * 1983-02-07 1984-08-18 Hitachi Ltd ワイヤボンデイング部の検査方法

Also Published As

Publication number Publication date
JPS61148828A (ja) 1986-07-07

Similar Documents

Publication Publication Date Title
JP7713567B2 (ja) ダイボンディング装置および半導体装置の製造方法
US6900459B2 (en) Apparatus for automatically positioning electronic dice within component packages
US5547537A (en) Ceramic carrier transport for die attach equipment
JPH04233245A (ja) 半導体チップと導体リード・フレームの検査及び位置合せのためのシステム及び方法
US6820792B2 (en) Die bonding equipment
JPH0737923A (ja) ワイヤボンディング装置及びその方法
US6337221B1 (en) Die bonding method for manufacturing fine pitch ball grid array packages
JPH0582741B2 (enExample)
JPH0737925A (ja) ワイヤボンディング装置及びその方法
JP2587998B2 (ja) 外観検査装置
JP3225067B2 (ja) リード測定方法
JP2533375B2 (ja) テ―プボンディングにおけるリ―ドとバンプの位置検出方法
JPH0566015B2 (enExample)
JPH0521506A (ja) 画像認識手段による電子部品の位置検出装置
CN115410947B (zh) 芯片贴装装置及半导体器件的制造方法
JP2881743B2 (ja) 電子部品の実装装置及び電子部品の実装方法、認識装置及び認識方法
KR100260732B1 (ko) 펠릿의본딩상태검사장치및그검사방법
JPS61111551A (ja) ワイヤボンデイング装置
JPS6117137B2 (enExample)
JPH0238450Y2 (enExample)
JPH09238000A (ja) 電子部品の認識方法及び電子部品自動装着装置
JPH06196528A (ja) インナーリードボンダ
JPS58161333A (ja) 半導体製造装置
JPH07193398A (ja) 自動組立・実装装置及びその方法
JPH0669687A (ja) 部品のリード位置認識方法及びそれを使用した部品装着装置

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees