JPS61148828A - ワイヤボンデイングの検査方法 - Google Patents

ワイヤボンデイングの検査方法

Info

Publication number
JPS61148828A
JPS61148828A JP59270686A JP27068684A JPS61148828A JP S61148828 A JPS61148828 A JP S61148828A JP 59270686 A JP59270686 A JP 59270686A JP 27068684 A JP27068684 A JP 27068684A JP S61148828 A JPS61148828 A JP S61148828A
Authority
JP
Japan
Prior art keywords
circuit
inspection
wire bonding
judging
itv camera
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59270686A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0582741B2 (enExample
Inventor
Toshiya Nemoto
根本　俊哉
Mutsumi Suematsu
睦 末松
Masayoshi Yamaguchi
政義 山口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP59270686A priority Critical patent/JPS61148828A/ja
Publication of JPS61148828A publication Critical patent/JPS61148828A/ja
Publication of JPH0582741B2 publication Critical patent/JPH0582741B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/0711—
    • H10W72/07173—
    • H10W72/07178—
    • H10W72/075—
    • H10W72/07531—
    • H10W72/536—
    • H10W72/5363—
    • H10W72/884—
    • H10W90/736—
    • H10W90/756—

Landscapes

  • Length Measuring Devices By Optical Means (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Wire Bonding (AREA)
JP59270686A 1984-12-24 1984-12-24 ワイヤボンデイングの検査方法 Granted JPS61148828A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59270686A JPS61148828A (ja) 1984-12-24 1984-12-24 ワイヤボンデイングの検査方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59270686A JPS61148828A (ja) 1984-12-24 1984-12-24 ワイヤボンデイングの検査方法

Publications (2)

Publication Number Publication Date
JPS61148828A true JPS61148828A (ja) 1986-07-07
JPH0582741B2 JPH0582741B2 (enExample) 1993-11-22

Family

ID=17489534

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59270686A Granted JPS61148828A (ja) 1984-12-24 1984-12-24 ワイヤボンデイングの検査方法

Country Status (1)

Country Link
JP (1) JPS61148828A (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63144532A (ja) * 1986-12-03 1988-06-16 ビユ−・エンジニアリング・インコ−ポレ−テツド 半導体装置の検査装置
JPH01142407A (ja) * 1987-11-30 1989-06-05 Toshiba Corp ワイヤボンディングの検査装置
US4872052A (en) * 1986-12-03 1989-10-03 View Engineering, Inc. Semiconductor device inspection system
JPH0538011U (ja) * 1991-08-29 1993-05-21 穰 杉山 橋梁継目用雨水受装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57134944A (en) * 1981-02-16 1982-08-20 Toshiba Corp Wire bonding device
JPS57198638A (en) * 1981-05-30 1982-12-06 Toshiba Corp Detection of wire bonding state and device therefore
JPS59139638A (ja) * 1983-01-31 1984-08-10 Hitachi Ltd 半導体装置の検査方法及び装置
JPS59144140A (ja) * 1983-02-07 1984-08-18 Hitachi Ltd ワイヤボンデイング部の検査方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57134944A (en) * 1981-02-16 1982-08-20 Toshiba Corp Wire bonding device
JPS57198638A (en) * 1981-05-30 1982-12-06 Toshiba Corp Detection of wire bonding state and device therefore
JPS59139638A (ja) * 1983-01-31 1984-08-10 Hitachi Ltd 半導体装置の検査方法及び装置
JPS59144140A (ja) * 1983-02-07 1984-08-18 Hitachi Ltd ワイヤボンデイング部の検査方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63144532A (ja) * 1986-12-03 1988-06-16 ビユ−・エンジニアリング・インコ−ポレ−テツド 半導体装置の検査装置
US4872052A (en) * 1986-12-03 1989-10-03 View Engineering, Inc. Semiconductor device inspection system
JPH01142407A (ja) * 1987-11-30 1989-06-05 Toshiba Corp ワイヤボンディングの検査装置
JPH0538011U (ja) * 1991-08-29 1993-05-21 穰 杉山 橋梁継目用雨水受装置

Also Published As

Publication number Publication date
JPH0582741B2 (enExample) 1993-11-22

Similar Documents

Publication Publication Date Title
US5119436A (en) Method of centering bond positions
JP2018120983A (ja) 半導体製造装置および半導体装置の製造方法
JPS61148828A (ja) ワイヤボンデイングの検査方法
JP2587998B2 (ja) 外観検査装置
JPH0569301B2 (enExample)
JPS6265436A (ja) ダイボンダにおけるウエハ−位置制御方法
KR102899484B1 (ko) 반도체 제조 장치, 에지의 검출 방법 및 반도체 장치의 제조 방법
JP3404755B2 (ja) ワイヤボンディング装置
JP2533375B2 (ja) テ―プボンディングにおけるリ―ドとバンプの位置検出方法
JPS634348B2 (enExample)
JPH0732188B2 (ja) 半導体装置の検査装置
KR100260732B1 (ko) 펠릿의본딩상태검사장치및그검사방법
JPH0521506A (ja) 画像認識手段による電子部品の位置検出装置
JPH0238450Y2 (enExample)
GB1592368A (en) Automated manipulative operation system
KR102387058B1 (ko) 부품 반송 장치, 부품 반송 방법 및 부품 실장 장치
JP2881743B2 (ja) 電子部品の実装装置及び電子部品の実装方法、認識装置及び認識方法
KR100348829B1 (ko) 리드프레임의 리버스인풋을 방지하기 위한 화상인식방법
JP2024175774A (ja) 半導体製造装置、塗布装置および半導体装置の製造方法
JPS61111551A (ja) ワイヤボンデイング装置
JPH01227443A (ja) 半導体ペレットボンデイング装置
JPS6117137B2 (enExample)
JP2977954B2 (ja) ワイヤボンディング方法
CN120656965A (zh) 半导体制造装置以及半导体器件的制造方法
JPH0412549A (ja) 半導体ペレットのピックアップ装置

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees