JPH0548955B2 - - Google Patents

Info

Publication number
JPH0548955B2
JPH0548955B2 JP62317724A JP31772487A JPH0548955B2 JP H0548955 B2 JPH0548955 B2 JP H0548955B2 JP 62317724 A JP62317724 A JP 62317724A JP 31772487 A JP31772487 A JP 31772487A JP H0548955 B2 JPH0548955 B2 JP H0548955B2
Authority
JP
Japan
Prior art keywords
support plate
lead
resin
semiconductor
molding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP62317724A
Other languages
English (en)
Japanese (ja)
Other versions
JPH01158756A (ja
Inventor
Sadao Yoshida
Masami Minami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanken Electric Co Ltd
Original Assignee
Sanken Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanken Electric Co Ltd filed Critical Sanken Electric Co Ltd
Priority to JP62317724A priority Critical patent/JPH01158756A/ja
Publication of JPH01158756A publication Critical patent/JPH01158756A/ja
Publication of JPH0548955B2 publication Critical patent/JPH0548955B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP62317724A 1987-12-16 1987-12-16 樹脂封止型半導体装置の製造方法 Granted JPH01158756A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62317724A JPH01158756A (ja) 1987-12-16 1987-12-16 樹脂封止型半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62317724A JPH01158756A (ja) 1987-12-16 1987-12-16 樹脂封止型半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPH01158756A JPH01158756A (ja) 1989-06-21
JPH0548955B2 true JPH0548955B2 (US20100268047A1-20101021-C00003.png) 1993-07-22

Family

ID=18091334

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62317724A Granted JPH01158756A (ja) 1987-12-16 1987-12-16 樹脂封止型半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPH01158756A (US20100268047A1-20101021-C00003.png)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2563171Y2 (ja) * 1992-06-26 1998-02-18 シャープ株式会社 樹脂封止型半導体装置
JP2597768Y2 (ja) * 1992-09-04 1999-07-12 シャープ株式会社 電力半導体装置
JP3572833B2 (ja) * 1996-12-19 2004-10-06 株式会社デンソー 樹脂封止型半導体装置の製造方法
DE10247610A1 (de) * 2002-10-11 2004-04-29 Micronas Gmbh Elektronisches Bauelement mit einem Systemträger
US20040113240A1 (en) 2002-10-11 2004-06-17 Wolfgang Hauser An electronic component with a leadframe
JP4349437B2 (ja) 2007-06-04 2009-10-21 株式会社デンソー 電子装置の製造方法
JP6677922B2 (ja) * 2015-10-08 2020-04-08 株式会社リコー 画像形成装置の製造方法
CN107845575A (zh) * 2017-11-03 2018-03-27 浙江人和光伏科技有限公司 一种薄片二极管的生产方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5029672A (US20100268047A1-20101021-C00003.png) * 1973-07-17 1975-03-25

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62180957U (US20100268047A1-20101021-C00003.png) * 1986-05-06 1987-11-17

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5029672A (US20100268047A1-20101021-C00003.png) * 1973-07-17 1975-03-25

Also Published As

Publication number Publication date
JPH01158756A (ja) 1989-06-21

Similar Documents

Publication Publication Date Title
JPH0730046A (ja) 半導体装置、リードフレーム及び半導体装置の製造方法
JP2000156433A (ja) 電子装置
JPH1145958A (ja) 表面実装部品及びその製造方法
JPH0548955B2 (US20100268047A1-20101021-C00003.png)
EP0307946B1 (en) Method of manufacturing a resin insulated type semiconductor device
JP2525555Y2 (ja) 樹脂封止型半導体装置用リードフレーム組立体
JPS61102040A (ja) 樹脂封止型半導体装置の製造方法
JPH0254665B2 (US20100268047A1-20101021-C00003.png)
JP2973506B2 (ja) 樹脂封止形半導体装置の製造方法
JPH0394432A (ja) 樹脂封止型電子部品の製造方法
JP3705235B2 (ja) 半導体装置の製造方法
JPH079917B2 (ja) 樹脂封止型半導体装置の製造方法
JPS6244815B2 (US20100268047A1-20101021-C00003.png)
KR100448432B1 (ko) 에어-캐버티 플라스틱 패키지용 성형 금형
JPS647496B2 (US20100268047A1-20101021-C00003.png)
JPH0328067B2 (US20100268047A1-20101021-C00003.png)
JP2802966B2 (ja) 樹脂封止型電子部品の製造方法
JP2601033B2 (ja) 樹脂封止型半導体装置およびその製造方法
JPS6314466Y2 (US20100268047A1-20101021-C00003.png)
JP2596247B2 (ja) 半導体装置の成形用金型
KR100253708B1 (ko) 반도체 패키지 및 그 제조방법
KR200177346Y1 (ko) 반도체 패키지(semiconductor package)
JPH0213461B2 (US20100268047A1-20101021-C00003.png)
JPH0824156B2 (ja) 樹脂封止型半導体装置の製造方法
JPH0378779B2 (US20100268047A1-20101021-C00003.png)

Legal Events

Date Code Title Description
R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees