JPH0528738B2 - - Google Patents

Info

Publication number
JPH0528738B2
JPH0528738B2 JP62178594A JP17859487A JPH0528738B2 JP H0528738 B2 JPH0528738 B2 JP H0528738B2 JP 62178594 A JP62178594 A JP 62178594A JP 17859487 A JP17859487 A JP 17859487A JP H0528738 B2 JPH0528738 B2 JP H0528738B2
Authority
JP
Japan
Prior art keywords
weight
group
parts
formula
silica powder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP62178594A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6422967A (en
Inventor
Hiroshi Inomata
Masachika Yoshino
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Chemical Co Ltd
Priority to JP17859487A priority Critical patent/JPS6422967A/ja
Publication of JPS6422967A publication Critical patent/JPS6422967A/ja
Publication of JPH0528738B2 publication Critical patent/JPH0528738B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Organic Insulating Materials (AREA)
JP17859487A 1987-07-17 1987-07-17 Curable liquid silicone rubber composition Granted JPS6422967A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17859487A JPS6422967A (en) 1987-07-17 1987-07-17 Curable liquid silicone rubber composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17859487A JPS6422967A (en) 1987-07-17 1987-07-17 Curable liquid silicone rubber composition

Publications (2)

Publication Number Publication Date
JPS6422967A JPS6422967A (en) 1989-01-25
JPH0528738B2 true JPH0528738B2 (cs) 1993-04-27

Family

ID=16051188

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17859487A Granted JPS6422967A (en) 1987-07-17 1987-07-17 Curable liquid silicone rubber composition

Country Status (1)

Country Link
JP (1) JPS6422967A (cs)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10851242B2 (en) 2015-12-10 2020-12-01 Shin-Etsu Chemical Co., Ltd. Addition-curable silicone rubber composition and silicone rubber

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4888226A (en) * 1988-08-08 1989-12-19 American Telephone And Telegraph Company Silicone gel electronic device encapsulant
EP0431173B1 (en) * 1989-05-29 1995-08-02 Kanegafuchi Chemical Industry Co., Ltd. Curing agent, method of preparation thereof, and curable composition prepared therefrom
US5409995A (en) * 1989-05-29 1995-04-25 Kanegafuchi Chemical Industry Co., Ltd. Curing agent, preparation thereof and curable composition comprising the same
JPH0660281B2 (ja) * 1989-07-07 1994-08-10 信越化学工業株式会社 硬化性液状シリコーンゴム組成物
JP2714729B2 (ja) * 1991-06-18 1998-02-16 信越化学工業株式会社 電子部品含浸用シリコーン組成物及びその硬化物
EP1275680B1 (en) * 2000-03-31 2013-07-17 Hitachi Chemical Co., Ltd. Process for producing novel silicone polymer, silicone polymer produced by the process, thermosetting resin composition, resin film, metal foil with insulating material, insulating film with metal foil on each side, metal-clad laminate, multilayered metal-clad laminate, and multilayered printed circuit board
JP2005146288A (ja) * 2004-12-17 2005-06-09 Shin Etsu Chem Co Ltd オルガノポリシロキサン組成物
JP4803365B2 (ja) * 2006-02-22 2011-10-26 信越化学工業株式会社 熱伝導性シリコーン組成物、熱伝導性シリコーン成形体及びその製造方法
JP2014065900A (ja) * 2012-09-07 2014-04-17 Dow Corning Toray Co Ltd 硬化性シリコーン組成物およびその硬化物
KR20220078629A (ko) * 2019-10-03 2022-06-10 다우 실리콘즈 코포레이션 자외선 경화성 오가노폴리실록산 조성물 및 그의 용도
CN110746779A (zh) * 2019-10-31 2020-02-04 西安建筑科技大学 一种聚合物复合模板及其制备方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5128310B2 (cs) * 1973-08-13 1976-08-18
JPS5313508A (en) * 1976-07-21 1978-02-07 Inoue Shokai Method of applying antiicorrosive coating for steel pipe pile
JPS55118656A (en) * 1979-03-07 1980-09-11 Hitachi Ltd Manufacture of semiconductor device, and silicone resin used therefor
JPS5610947A (en) * 1979-07-10 1981-02-03 Toshiba Corp Semiconductor sealing resin composition
JPS58138740A (ja) * 1982-02-15 1983-08-17 Denki Kagaku Kogyo Kk 樹脂組成物
JPS5850007A (ja) * 1982-08-28 1983-03-24 Kubota Ltd 自動回行制御機構付きコンバイン
JPS59176347A (ja) * 1983-03-25 1984-10-05 Toray Silicone Co Ltd オルガノポリシロキサン組成物
JPS60210643A (ja) * 1983-11-30 1985-10-23 Denki Kagaku Kogyo Kk 充填剤及びその組成物
JPS6157347A (ja) * 1984-08-29 1986-03-24 Toshiba Corp プリンタ制御装置
JPS6296568A (ja) * 1985-10-24 1987-05-06 Denki Kagaku Kogyo Kk 半導体封止用樹脂組成物
JPS6296567A (ja) * 1985-10-24 1987-05-06 Denki Kagaku Kogyo Kk 半導体封止用エポキシ樹脂組成物

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10851242B2 (en) 2015-12-10 2020-12-01 Shin-Etsu Chemical Co., Ltd. Addition-curable silicone rubber composition and silicone rubber

Also Published As

Publication number Publication date
JPS6422967A (en) 1989-01-25

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