JPS6422967A - Curable liquid silicone rubber composition - Google Patents
Curable liquid silicone rubber compositionInfo
- Publication number
- JPS6422967A JPS6422967A JP17859487A JP17859487A JPS6422967A JP S6422967 A JPS6422967 A JP S6422967A JP 17859487 A JP17859487 A JP 17859487A JP 17859487 A JP17859487 A JP 17859487A JP S6422967 A JPS6422967 A JP S6422967A
- Authority
- JP
- Japan
- Prior art keywords
- group
- rubber composition
- compound
- silicone rubber
- 100pts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Organic Insulating Materials (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17859487A JPS6422967A (en) | 1987-07-17 | 1987-07-17 | Curable liquid silicone rubber composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17859487A JPS6422967A (en) | 1987-07-17 | 1987-07-17 | Curable liquid silicone rubber composition |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6422967A true JPS6422967A (en) | 1989-01-25 |
JPH0528738B2 JPH0528738B2 (ja) | 1993-04-27 |
Family
ID=16051188
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP17859487A Granted JPS6422967A (en) | 1987-07-17 | 1987-07-17 | Curable liquid silicone rubber composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6422967A (ja) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02175760A (ja) * | 1988-08-08 | 1990-07-09 | American Teleph & Telegr Co <Att> | 包封電子デバイス製品および包封方法 |
WO1990015098A1 (en) * | 1989-05-29 | 1990-12-13 | Kanegafuchi Chemical Industry Co., Ltd. | Curing agent, method of preparation thereof, and curable composition prepared therefrom |
JPH0339360A (ja) * | 1989-07-07 | 1991-02-20 | Shin Etsu Chem Co Ltd | 硬化性液状シリコーンゴム組成物 |
JPH04370151A (ja) * | 1991-06-18 | 1992-12-22 | Shin Etsu Chem Co Ltd | 電子部品含浸用シリコーン組成物及びその硬化物 |
US5567833A (en) * | 1989-05-29 | 1996-10-22 | Kanegafuchi Chemical Industry Co., Ltd. | Curing agent, preparation thereof and curable composition comprising the same |
JP2005146288A (ja) * | 2004-12-17 | 2005-06-09 | Shin Etsu Chem Co Ltd | オルガノポリシロキサン組成物 |
JP2007224102A (ja) * | 2006-02-22 | 2007-09-06 | Shin Etsu Chem Co Ltd | 熱伝導性シリコーン組成物、熱伝導性シリコーン成形体及びその製造方法 |
JP2011046966A (ja) * | 2000-03-31 | 2011-03-10 | Hitachi Chem Co Ltd | 新規なシリコーン重合体の製造法、その方法により製造されたシリコーン重合体、熱硬化性樹脂組成物、樹脂フィルム、絶縁材料付金属箔、両面金属箔付絶縁フィルム、金属張積層板、多層金属張積層板及び多層プリント配線板 |
CN110746779A (zh) * | 2019-10-31 | 2020-02-04 | 西安建筑科技大学 | 一种聚合物复合模板及其制备方法 |
WO2021066084A1 (ja) * | 2019-10-03 | 2021-04-08 | ダウ・東レ株式会社 | 紫外線硬化性オルガノポリシロキサン組成物およびその用途 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6428591B2 (ja) | 2015-12-10 | 2018-11-28 | 信越化学工業株式会社 | 付加硬化型シリコーンゴム組成物及びシリコーンゴム |
Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5039345A (ja) * | 1973-08-13 | 1975-04-11 | ||
JPS5313508A (en) * | 1976-07-21 | 1978-02-07 | Inoue Shokai | Method of applying antiicorrosive coating for steel pipe pile |
JPS55118656A (en) * | 1979-03-07 | 1980-09-11 | Hitachi Ltd | Manufacture of semiconductor device, and silicone resin used therefor |
JPS5610947A (en) * | 1979-07-10 | 1981-02-03 | Toshiba Corp | Semiconductor sealing resin composition |
JPS5850007A (ja) * | 1982-08-28 | 1983-03-24 | Kubota Ltd | 自動回行制御機構付きコンバイン |
JPS58138740A (ja) * | 1982-02-15 | 1983-08-17 | Denki Kagaku Kogyo Kk | 樹脂組成物 |
JPS59176347A (ja) * | 1983-03-25 | 1984-10-05 | Toray Silicone Co Ltd | オルガノポリシロキサン組成物 |
JPS60210643A (ja) * | 1983-11-30 | 1985-10-23 | Denki Kagaku Kogyo Kk | 充填剤及びその組成物 |
JPS6157347A (ja) * | 1984-08-29 | 1986-03-24 | Toshiba Corp | プリンタ制御装置 |
JPS6296568A (ja) * | 1985-10-24 | 1987-05-06 | Denki Kagaku Kogyo Kk | 半導体封止用樹脂組成物 |
JPS6296567A (ja) * | 1985-10-24 | 1987-05-06 | Denki Kagaku Kogyo Kk | 半導体封止用エポキシ樹脂組成物 |
-
1987
- 1987-07-17 JP JP17859487A patent/JPS6422967A/ja active Granted
Patent Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5039345A (ja) * | 1973-08-13 | 1975-04-11 | ||
JPS5313508A (en) * | 1976-07-21 | 1978-02-07 | Inoue Shokai | Method of applying antiicorrosive coating for steel pipe pile |
JPS55118656A (en) * | 1979-03-07 | 1980-09-11 | Hitachi Ltd | Manufacture of semiconductor device, and silicone resin used therefor |
JPS5610947A (en) * | 1979-07-10 | 1981-02-03 | Toshiba Corp | Semiconductor sealing resin composition |
JPS58138740A (ja) * | 1982-02-15 | 1983-08-17 | Denki Kagaku Kogyo Kk | 樹脂組成物 |
JPS5850007A (ja) * | 1982-08-28 | 1983-03-24 | Kubota Ltd | 自動回行制御機構付きコンバイン |
JPS59176347A (ja) * | 1983-03-25 | 1984-10-05 | Toray Silicone Co Ltd | オルガノポリシロキサン組成物 |
JPS60210643A (ja) * | 1983-11-30 | 1985-10-23 | Denki Kagaku Kogyo Kk | 充填剤及びその組成物 |
JPS6157347A (ja) * | 1984-08-29 | 1986-03-24 | Toshiba Corp | プリンタ制御装置 |
JPS6296568A (ja) * | 1985-10-24 | 1987-05-06 | Denki Kagaku Kogyo Kk | 半導体封止用樹脂組成物 |
JPS6296567A (ja) * | 1985-10-24 | 1987-05-06 | Denki Kagaku Kogyo Kk | 半導体封止用エポキシ樹脂組成物 |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02175760A (ja) * | 1988-08-08 | 1990-07-09 | American Teleph & Telegr Co <Att> | 包封電子デバイス製品および包封方法 |
WO1990015098A1 (en) * | 1989-05-29 | 1990-12-13 | Kanegafuchi Chemical Industry Co., Ltd. | Curing agent, method of preparation thereof, and curable composition prepared therefrom |
JPH0395266A (ja) * | 1989-05-29 | 1991-04-19 | Kanegafuchi Chem Ind Co Ltd | 硬化剤、その製造方法及び該硬化剤を用いた硬化性組成物 |
US5567833A (en) * | 1989-05-29 | 1996-10-22 | Kanegafuchi Chemical Industry Co., Ltd. | Curing agent, preparation thereof and curable composition comprising the same |
JPH0339360A (ja) * | 1989-07-07 | 1991-02-20 | Shin Etsu Chem Co Ltd | 硬化性液状シリコーンゴム組成物 |
JPH04370151A (ja) * | 1991-06-18 | 1992-12-22 | Shin Etsu Chem Co Ltd | 電子部品含浸用シリコーン組成物及びその硬化物 |
JP2011046966A (ja) * | 2000-03-31 | 2011-03-10 | Hitachi Chem Co Ltd | 新規なシリコーン重合体の製造法、その方法により製造されたシリコーン重合体、熱硬化性樹脂組成物、樹脂フィルム、絶縁材料付金属箔、両面金属箔付絶縁フィルム、金属張積層板、多層金属張積層板及び多層プリント配線板 |
JP2005146288A (ja) * | 2004-12-17 | 2005-06-09 | Shin Etsu Chem Co Ltd | オルガノポリシロキサン組成物 |
JP2007224102A (ja) * | 2006-02-22 | 2007-09-06 | Shin Etsu Chem Co Ltd | 熱伝導性シリコーン組成物、熱伝導性シリコーン成形体及びその製造方法 |
WO2021066084A1 (ja) * | 2019-10-03 | 2021-04-08 | ダウ・東レ株式会社 | 紫外線硬化性オルガノポリシロキサン組成物およびその用途 |
CN110746779A (zh) * | 2019-10-31 | 2020-02-04 | 西安建筑科技大学 | 一种聚合物复合模板及其制备方法 |
Also Published As
Publication number | Publication date |
---|---|
JPH0528738B2 (ja) | 1993-04-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |