JPH0523505B2 - - Google Patents

Info

Publication number
JPH0523505B2
JPH0523505B2 JP60266759A JP26675985A JPH0523505B2 JP H0523505 B2 JPH0523505 B2 JP H0523505B2 JP 60266759 A JP60266759 A JP 60266759A JP 26675985 A JP26675985 A JP 26675985A JP H0523505 B2 JPH0523505 B2 JP H0523505B2
Authority
JP
Japan
Prior art keywords
layer
light receiving
substrate
receiving section
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60266759A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62124771A (ja
Inventor
Shigehiro Myatake
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP60266759A priority Critical patent/JPS62124771A/ja
Priority to DE86306796T priority patent/DE3689409T2/de
Priority to EP86306796A priority patent/EP0224993B1/en
Priority to US06/903,503 priority patent/US4851890A/en
Publication of JPS62124771A publication Critical patent/JPS62124771A/ja
Publication of JPH0523505B2 publication Critical patent/JPH0523505B2/ja
Priority to HK187895A priority patent/HK187895A/en
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H10F39/12—Image sensors
    • H10F39/15—Charge-coupled device [CCD] image sensors
    • H10F39/158—Charge-coupled device [CCD] image sensors having arrangements for blooming suppression
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H10F39/12—Image sensors
    • H10F39/15—Charge-coupled device [CCD] image sensors
    • H10F39/153—Two-dimensional or three-dimensional array CCD image sensors

Landscapes

  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
JP60266759A 1985-11-25 1985-11-25 固体撮像装置 Granted JPS62124771A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP60266759A JPS62124771A (ja) 1985-11-25 1985-11-25 固体撮像装置
DE86306796T DE3689409T2 (de) 1985-11-25 1986-09-03 Verfahren zum Betreiben eines Festkörperbildsensors.
EP86306796A EP0224993B1 (en) 1985-11-25 1986-09-03 A method of operating a solid-state image sensor
US06/903,503 US4851890A (en) 1985-11-25 1986-09-04 Solid-state image sensor
HK187895A HK187895A (en) 1985-11-25 1995-12-14 A method of operating a solid-state image sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60266759A JPS62124771A (ja) 1985-11-25 1985-11-25 固体撮像装置

Publications (2)

Publication Number Publication Date
JPS62124771A JPS62124771A (ja) 1987-06-06
JPH0523505B2 true JPH0523505B2 (en, 2012) 1993-04-02

Family

ID=17435313

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60266759A Granted JPS62124771A (ja) 1985-11-25 1985-11-25 固体撮像装置

Country Status (5)

Country Link
US (1) US4851890A (en, 2012)
EP (1) EP0224993B1 (en, 2012)
JP (1) JPS62124771A (en, 2012)
DE (1) DE3689409T2 (en, 2012)
HK (1) HK187895A (en, 2012)

Families Citing this family (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2633455B1 (fr) * 1988-06-24 1990-08-24 Thomson Csf Matrice photosensible a transfert de trame d.t.c., avec un systeme antieblouissement vertical, et procede de fabrication d'une telle matrice
JPH0237884A (ja) * 1988-07-27 1990-02-07 Nec Corp 固体撮像素子の駆動方法
FR2636171B1 (fr) * 1988-08-10 1990-11-09 Philips Nv Dispositif capteur d'images du type a transfert de trame
EP0360595A3 (en) * 1988-09-22 1990-05-09 Matsushita Electronics Corporation Solid state image sensor
US5132759A (en) * 1989-07-28 1992-07-21 Kabushiki Kaisha Toshiba Solid-state imaging device in which reverse bias voltage is automatically set
JPH0360159A (ja) * 1989-07-28 1991-03-15 Nec Corp 固体撮像素子
JP2901649B2 (ja) * 1989-07-31 1999-06-07 株式会社日立製作所 半導体装置及びそれを用いたカメラ
US5122850A (en) * 1989-09-05 1992-06-16 Eastman Kodak Company Blooming control and reduced image lag in interline transfer CCD area image sensors
KR930002818B1 (ko) * 1990-05-11 1993-04-10 금성일렉트론주식회사 Ccd 영상소자
US5276341A (en) * 1990-05-11 1994-01-04 Gold Star Electron Co., Ltd. Structure for fabrication of a CCD image sensor
CA2045363A1 (en) * 1990-10-01 1992-04-02 Selim S. Bencuya Ccd frame transfer device with simplified and improved well and electrode structure
EP0492144A3 (en) * 1990-11-26 1992-08-12 Matsushita Electronics Corporation Charge-coupled device and solid-state imaging device
ES2032368T1 (es) * 1990-11-26 1993-02-16 Trw Repa Gmbh Dispositivo de retencion de cinturon de seguridad para vehiculos.
JPH04355964A (ja) * 1990-12-21 1992-12-09 Mitsubishi Electric Corp 固体撮像装置及びその製造方法
US5238864A (en) * 1990-12-21 1993-08-24 Mitsubishi Denki Kabushiki Kaisha Method of making solid-state imaging device
JPH04286361A (ja) * 1991-03-15 1992-10-12 Sony Corp 固体撮像装置
JP3311004B2 (ja) * 1991-03-28 2002-08-05 株式会社東芝 固体撮像装置
JPH04335573A (ja) * 1991-05-10 1992-11-24 Sony Corp Ｃｃｄ固体撮像素子
AU1995092A (en) * 1991-05-10 1992-12-30 Q-Dot. Inc. High-speed peristaltic ccd imager with gaas fet output
KR940009648B1 (ko) * 1991-10-15 1994-10-15 금성일렉트론 주식회사 전하결합소자의 제조방법
KR970011376B1 (ko) * 1993-12-13 1997-07-10 금성일렉트론 주식회사 씨씨디(ccd)형 고체촬상소자
KR0136933B1 (ko) * 1994-05-21 1998-04-24 문정환 씨씨디(ccd) 영상소자 및 제조방법
JP2797993B2 (ja) * 1995-02-21 1998-09-17 日本電気株式会社 固体撮像装置およびその製造方法
JP2848268B2 (ja) * 1995-04-20 1999-01-20 日本電気株式会社 固体撮像装置およびその製造方法
KR0162691B1 (ko) * 1995-06-03 1998-12-01 문정환 고체 촬상소자의 수광부 구조 및 그 제조방법
US6351001B1 (en) * 1996-04-17 2002-02-26 Eastman Kodak Company CCD image sensor
US5872371A (en) * 1997-02-27 1999-02-16 Eastman Kodak Company Active pixel sensor with punch-through reset and cross-talk suppression
JP3003590B2 (ja) * 1996-10-02 2000-01-31 日本電気株式会社 固体撮像素子およびその製造方法
KR100278285B1 (ko) * 1998-02-28 2001-01-15 김영환 씨모스 이미지센서 및 그 제조방법
KR100282424B1 (ko) * 1999-03-18 2001-02-15 김영환 수평전하 전송소자 및 그의 제조방법
US6310366B1 (en) * 1999-06-16 2001-10-30 Micron Technology, Inc. Retrograde well structure for a CMOS imager
JP4246890B2 (ja) * 2000-06-26 2009-04-02 株式会社東芝 固体撮像装置
JP2002074614A (ja) * 2000-08-25 2002-03-15 Alps Electric Co Ltd 磁気ヘッド
JP2003060192A (ja) * 2001-08-20 2003-02-28 Sony Corp 固体撮像装置の製造方法
JP2005217302A (ja) * 2004-01-30 2005-08-11 Sony Corp 固体撮像装置
JP2004349715A (ja) * 2004-06-21 2004-12-09 Sony Corp イメージセンサ
US7875916B2 (en) 2005-09-28 2011-01-25 Eastman Kodak Company Photodetector and n-layer structure for improved collection efficiency
US20090243025A1 (en) * 2008-03-25 2009-10-01 Stevens Eric G Pixel structure with a photodetector having an extended depletion depth
US8618458B2 (en) * 2008-11-07 2013-12-31 Omnivision Technologies, Inc. Back-illuminated CMOS image sensors
US8772891B2 (en) * 2008-12-10 2014-07-08 Truesense Imaging, Inc. Lateral overflow drain and channel stop regions in image sensors
KR102605619B1 (ko) 2019-07-17 2023-11-23 삼성전자주식회사 기판 관통 비아들을 포함하는 반도체 소자 및 그 제조 방법

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5917581B2 (ja) * 1978-01-13 1984-04-21 株式会社東芝 固体撮像装置
JPS5762557A (en) * 1980-10-02 1982-04-15 Nec Corp Solid state image pickup device and driving method therefor
JPS57173273A (en) * 1981-04-17 1982-10-25 Nec Corp Solid-state image pickup device
JPS57162364A (en) * 1981-03-30 1982-10-06 Matsushita Electric Ind Co Ltd Solid state image pickup device
JPS5879383A (ja) * 1981-11-04 1983-05-13 Toshiba Corp 固体撮像装置
JPS6157181A (ja) * 1984-08-28 1986-03-24 Sharp Corp 固体撮像装置

Also Published As

Publication number Publication date
EP0224993A1 (en) 1987-06-10
HK187895A (en) 1995-12-22
JPS62124771A (ja) 1987-06-06
US4851890A (en) 1989-07-25
DE3689409D1 (de) 1994-01-27
EP0224993B1 (en) 1993-12-15
DE3689409T2 (de) 1994-04-07

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term