JPH0518476B2 - - Google Patents

Info

Publication number
JPH0518476B2
JPH0518476B2 JP60118898A JP11889885A JPH0518476B2 JP H0518476 B2 JPH0518476 B2 JP H0518476B2 JP 60118898 A JP60118898 A JP 60118898A JP 11889885 A JP11889885 A JP 11889885A JP H0518476 B2 JPH0518476 B2 JP H0518476B2
Authority
JP
Japan
Prior art keywords
heat
resin
fine powder
adhesive
resistant resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60118898A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61276875A (ja
Inventor
Akira Enomoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ibiden Co Ltd
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Priority to JP60118898A priority Critical patent/JPS61276875A/ja
Priority to US06/860,886 priority patent/US4752499A/en
Publication of JPS61276875A publication Critical patent/JPS61276875A/ja
Priority to US07/357,693 priority patent/US5021472A/en
Publication of JPH0518476B2 publication Critical patent/JPH0518476B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1635—Composition of the substrate
    • C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
    • C23C18/1641—Organic substrates, e.g. resin, plastic
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/22—Roughening, e.g. by etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/02—Soldered or welded connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0212—Resin particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0773—Dissolving the filler without dissolving the matrix material; Dissolving the matrix material without dissolving the filler
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP60118898A 1985-05-16 1985-06-03 配線板ならびにそれの製造方法と配線板に用いる無電解めっき用接着剤 Granted JPS61276875A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP60118898A JPS61276875A (ja) 1985-06-03 1985-06-03 配線板ならびにそれの製造方法と配線板に用いる無電解めっき用接着剤
US06/860,886 US4752499A (en) 1985-05-16 1986-05-08 Adhesive for electroless plating and method of preparation of circuit board using this adhesive
US07/357,693 US5021472A (en) 1985-05-16 1989-05-25 Adhesive for electroless plating and method of preparation of circuit board using this adhesive

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60118898A JPS61276875A (ja) 1985-06-03 1985-06-03 配線板ならびにそれの製造方法と配線板に用いる無電解めっき用接着剤

Publications (2)

Publication Number Publication Date
JPS61276875A JPS61276875A (ja) 1986-12-06
JPH0518476B2 true JPH0518476B2 (enrdf_load_stackoverflow) 1993-03-12

Family

ID=14747894

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60118898A Granted JPS61276875A (ja) 1985-05-16 1985-06-03 配線板ならびにそれの製造方法と配線板に用いる無電解めっき用接着剤

Country Status (1)

Country Link
JP (1) JPS61276875A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6342682B1 (en) 1996-01-11 2002-01-29 Ibiden Co., Ltd. Printed wiring board and manufacturing method thereof

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6429479A (en) * 1987-07-23 1989-01-31 Ibiden Co Ltd Adhesive composition for electroless plating
JPS6447095A (en) * 1987-08-18 1989-02-21 Ibiden Co Ltd Printed wiring board and manufacture thereof
JPH0634447B2 (ja) * 1987-08-31 1994-05-02 イビデン株式会社 アディティブ用接着剤、これを使用したアディティブ用基材及びプリント配線板
DE3913966B4 (de) * 1988-04-28 2005-06-02 Ibiden Co., Ltd., Ogaki Klebstoffdispersion zum stromlosen Plattieren, sowie Verwendung zur Herstellung einer gedruckten Schaltung
JPH0649852B2 (ja) * 1988-06-28 1994-06-29 イビデン株式会社 無電解めっき用接着剤
JPH0776281B2 (ja) * 1989-01-10 1995-08-16 イビデン株式会社 プリプレグ
JP2842631B2 (ja) * 1989-08-24 1999-01-06 イビデン株式会社 プリント配線板の製造方法
US5344893A (en) * 1991-07-23 1994-09-06 Ibiden Co., Ltd. Epoxy/amino powder resin adhesive for printed circuit board
DE69532651T2 (de) 1995-12-26 2004-07-29 Ibiden Co. Ltd., Ogaki Metallfilm verbundkörper, verbindungsschicht und bindemittel
WO1998047329A1 (fr) * 1997-04-15 1998-10-22 Ibiden Co., Ltd. Adhesif utile pour effectuer le depot autocatalytique, composition de produit de depart utile pour preparer de l'adhesif pour depot catalytique et carte imprimee
KR100448561B1 (ko) 1997-04-15 2004-09-13 이비덴 가부시키가이샤 무전해 도금용 접착제, 무전해 도금용 접착제 조제용의 원료조성물 및 프린트 배선판
JP3142511B2 (ja) * 1997-11-05 2001-03-07 イビデン株式会社 無電解メッキ用接着剤およびその製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5844709A (ja) * 1981-09-10 1983-03-15 マルコン電子株式会社 コンデンサの製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6342682B1 (en) 1996-01-11 2002-01-29 Ibiden Co., Ltd. Printed wiring board and manufacturing method thereof

Also Published As

Publication number Publication date
JPS61276875A (ja) 1986-12-06

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