JPH0450741B2 - - Google Patents

Info

Publication number
JPH0450741B2
JPH0450741B2 JP61108594A JP10859486A JPH0450741B2 JP H0450741 B2 JPH0450741 B2 JP H0450741B2 JP 61108594 A JP61108594 A JP 61108594A JP 10859486 A JP10859486 A JP 10859486A JP H0450741 B2 JPH0450741 B2 JP H0450741B2
Authority
JP
Japan
Prior art keywords
electrode
ball
semiconductor device
copper
wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61108594A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62265729A (ja
Inventor
Masahiro Koizumi
Hitoshi Oonuki
Yasushi Kawabuchi
Mitsuo Chikazaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP61108594A priority Critical patent/JPS62265729A/ja
Publication of JPS62265729A publication Critical patent/JPS62265729A/ja
Publication of JPH0450741B2 publication Critical patent/JPH0450741B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/50—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147—Copper (Cu) as principal constituent
    • H10W72/01551—
    • H10W72/075—
    • H10W72/07551—
    • H10W72/07553—
    • H10W72/07555—
    • H10W72/531—
    • H10W72/536—
    • H10W72/5363—
    • H10W72/5525—
    • H10W72/5528—
    • H10W72/59—
    • H10W72/923—
    • H10W72/952—
    • H10W74/00—
    • H10W90/756—

Landscapes

  • Wire Bonding (AREA)
JP61108594A 1986-05-14 1986-05-14 半導体装置 Granted JPS62265729A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61108594A JPS62265729A (ja) 1986-05-14 1986-05-14 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61108594A JPS62265729A (ja) 1986-05-14 1986-05-14 半導体装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP52A Division JPH06168990A (ja) 1993-08-09 1993-08-09 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS62265729A JPS62265729A (ja) 1987-11-18
JPH0450741B2 true JPH0450741B2 (enExample) 1992-08-17

Family

ID=14488762

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61108594A Granted JPS62265729A (ja) 1986-05-14 1986-05-14 半導体装置

Country Status (1)

Country Link
JP (1) JPS62265729A (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0817189B2 (ja) * 1989-01-13 1996-02-21 三菱電機株式会社 半導体装置の製造方法
US5229646A (en) * 1989-01-13 1993-07-20 Mitsubishi Denki Kabushiki Kaisha Semiconductor device with a copper wires ball bonded to aluminum electrodes
JPH06168990A (ja) * 1993-08-09 1994-06-14 Hitachi Ltd 半導体装置の製造方法
KR102078986B1 (ko) 2012-03-22 2020-02-19 스미또모 베이크라이트 가부시키가이샤 반도체 장치 및 그 제조 방법
SG11201403952XA (en) 2012-03-23 2014-10-30 Sumitomo Bakelite Co Semiconductor device
JP6002437B2 (ja) * 2012-05-17 2016-10-05 新日本無線株式会社 半導体装置及びその製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3023528C2 (de) * 1980-06-24 1984-11-29 W.C. Heraeus Gmbh, 6450 Hanau Aluminium enthaltender Feinstdraht
JPS60240137A (ja) * 1984-05-15 1985-11-29 Mitsubishi Electric Corp ワイヤボンデイング用キヤピラリチツプ
JPS6188537A (ja) * 1984-10-05 1986-05-06 Mitsubishi Electric Corp 半導体装置のリ−ド

Also Published As

Publication number Publication date
JPS62265729A (ja) 1987-11-18

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