JPH0412620B2 - - Google Patents

Info

Publication number
JPH0412620B2
JPH0412620B2 JP58083363A JP8336383A JPH0412620B2 JP H0412620 B2 JPH0412620 B2 JP H0412620B2 JP 58083363 A JP58083363 A JP 58083363A JP 8336383 A JP8336383 A JP 8336383A JP H0412620 B2 JPH0412620 B2 JP H0412620B2
Authority
JP
Japan
Prior art keywords
wire
ball
bonding
aluminum alloy
ultrafine
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58083363A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59208770A (ja
Inventor
Hitoshi Oonuki
Masateru Suwa
Masahiro Koizumi
Masamichi Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP58083363A priority Critical patent/JPS59208770A/ja
Publication of JPS59208770A publication Critical patent/JPS59208770A/ja
Publication of JPH0412620B2 publication Critical patent/JPH0412620B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/50
    • H10W72/536
    • H10W72/5522
    • H10W72/5524
    • H10W72/59
    • H10W72/952

Landscapes

  • Wire Bonding (AREA)
JP58083363A 1983-05-12 1983-05-12 ボ−ルボンデイング用アルミ合金極細線 Granted JPS59208770A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58083363A JPS59208770A (ja) 1983-05-12 1983-05-12 ボ−ルボンデイング用アルミ合金極細線

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58083363A JPS59208770A (ja) 1983-05-12 1983-05-12 ボ−ルボンデイング用アルミ合金極細線

Publications (2)

Publication Number Publication Date
JPS59208770A JPS59208770A (ja) 1984-11-27
JPH0412620B2 true JPH0412620B2 (enExample) 1992-03-05

Family

ID=13800340

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58083363A Granted JPS59208770A (ja) 1983-05-12 1983-05-12 ボ−ルボンデイング用アルミ合金極細線

Country Status (1)

Country Link
JP (1) JPS59208770A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100379888C (zh) * 2006-06-06 2008-04-09 洛阳张鑫合金材料厂 一种铝镁铬合金丝的制备方法
JP5305067B2 (ja) * 2007-09-14 2013-10-02 日産自動車株式会社 アルミニウム合金からなる応力緩衝材料

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3023528C2 (de) * 1980-06-24 1984-11-29 W.C. Heraeus Gmbh, 6450 Hanau Aluminium enthaltender Feinstdraht
JPS5887841A (ja) * 1981-11-20 1983-05-25 Tanaka Denshi Kogyo Kk 半導体素子のボンデイング用Al線
JPS58124235A (ja) * 1982-01-20 1983-07-23 Hitachi Cable Ltd 半導体装置用アルミ合金極細線

Also Published As

Publication number Publication date
JPS59208770A (ja) 1984-11-27

Similar Documents

Publication Publication Date Title
JPH0482183B2 (enExample)
JPH0817189B2 (ja) 半導体装置の製造方法
JP3527356B2 (ja) 半導体装置
US5153704A (en) Semiconductor device using annealed bonding wire
JP3337049B2 (ja) ボンディング用金線
JPH0734449B2 (ja) 半導体装置の電極接合部構造
JPH0412620B2 (enExample)
JPH0450741B2 (enExample)
JPS63238232A (ja) 銅細線とその製造法
JPH02114545A (ja) ワイヤボンディング接続方法
TWI290761B (en) Semiconductor device and a method of manufacturing the same
JP3085090B2 (ja) ボンディングワイヤ
JPS59172757A (ja) 半導体装置
JPH06168990A (ja) 半導体装置の製造方法
JPH04386B2 (enExample)
CN103238210B (zh) 金-铂-钯合金接合线
JP2533675B2 (ja) 半導体装置及びその製造方法
JPH09275119A (ja) 半導体装置
JPS62249436A (ja) 半導体装置
JPH0770665B2 (ja) 半導体装置の製造方法
JP2721259B2 (ja) ワイヤボンディング方法及びそれに使用する銅系リードフレーム
JPS5835950A (ja) 半導体装置
JPH03208355A (ja) 半導体装置及びその製造方法
JPS611031A (ja) Alボ−ルボンデイング方法
JPS61194758A (ja) 半導体装置