JPH0412620B2 - - Google Patents
Info
- Publication number
- JPH0412620B2 JPH0412620B2 JP58083363A JP8336383A JPH0412620B2 JP H0412620 B2 JPH0412620 B2 JP H0412620B2 JP 58083363 A JP58083363 A JP 58083363A JP 8336383 A JP8336383 A JP 8336383A JP H0412620 B2 JPH0412620 B2 JP H0412620B2
- Authority
- JP
- Japan
- Prior art keywords
- wire
- ball
- bonding
- aluminum alloy
- ultrafine
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H10W72/50—
-
- H10W72/536—
-
- H10W72/5522—
-
- H10W72/5524—
-
- H10W72/59—
-
- H10W72/952—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58083363A JPS59208770A (ja) | 1983-05-12 | 1983-05-12 | ボ−ルボンデイング用アルミ合金極細線 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58083363A JPS59208770A (ja) | 1983-05-12 | 1983-05-12 | ボ−ルボンデイング用アルミ合金極細線 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59208770A JPS59208770A (ja) | 1984-11-27 |
| JPH0412620B2 true JPH0412620B2 (enExample) | 1992-03-05 |
Family
ID=13800340
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58083363A Granted JPS59208770A (ja) | 1983-05-12 | 1983-05-12 | ボ−ルボンデイング用アルミ合金極細線 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59208770A (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100379888C (zh) * | 2006-06-06 | 2008-04-09 | 洛阳张鑫合金材料厂 | 一种铝镁铬合金丝的制备方法 |
| JP5305067B2 (ja) * | 2007-09-14 | 2013-10-02 | 日産自動車株式会社 | アルミニウム合金からなる応力緩衝材料 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3023528C2 (de) * | 1980-06-24 | 1984-11-29 | W.C. Heraeus Gmbh, 6450 Hanau | Aluminium enthaltender Feinstdraht |
| JPS5887841A (ja) * | 1981-11-20 | 1983-05-25 | Tanaka Denshi Kogyo Kk | 半導体素子のボンデイング用Al線 |
| JPS58124235A (ja) * | 1982-01-20 | 1983-07-23 | Hitachi Cable Ltd | 半導体装置用アルミ合金極細線 |
-
1983
- 1983-05-12 JP JP58083363A patent/JPS59208770A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59208770A (ja) | 1984-11-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0482183B2 (enExample) | ||
| JPH0817189B2 (ja) | 半導体装置の製造方法 | |
| JP3527356B2 (ja) | 半導体装置 | |
| US5153704A (en) | Semiconductor device using annealed bonding wire | |
| JP3337049B2 (ja) | ボンディング用金線 | |
| JPH0734449B2 (ja) | 半導体装置の電極接合部構造 | |
| JPH0412620B2 (enExample) | ||
| JPH0450741B2 (enExample) | ||
| JPS63238232A (ja) | 銅細線とその製造法 | |
| JPH02114545A (ja) | ワイヤボンディング接続方法 | |
| TWI290761B (en) | Semiconductor device and a method of manufacturing the same | |
| JP3085090B2 (ja) | ボンディングワイヤ | |
| JPS59172757A (ja) | 半導体装置 | |
| JPH06168990A (ja) | 半導体装置の製造方法 | |
| JPH04386B2 (enExample) | ||
| CN103238210B (zh) | 金-铂-钯合金接合线 | |
| JP2533675B2 (ja) | 半導体装置及びその製造方法 | |
| JPH09275119A (ja) | 半導体装置 | |
| JPS62249436A (ja) | 半導体装置 | |
| JPH0770665B2 (ja) | 半導体装置の製造方法 | |
| JP2721259B2 (ja) | ワイヤボンディング方法及びそれに使用する銅系リードフレーム | |
| JPS5835950A (ja) | 半導体装置 | |
| JPH03208355A (ja) | 半導体装置及びその製造方法 | |
| JPS611031A (ja) | Alボ−ルボンデイング方法 | |
| JPS61194758A (ja) | 半導体装置 |