JPH0347732B2 - - Google Patents

Info

Publication number
JPH0347732B2
JPH0347732B2 JP55054137A JP5413780A JPH0347732B2 JP H0347732 B2 JPH0347732 B2 JP H0347732B2 JP 55054137 A JP55054137 A JP 55054137A JP 5413780 A JP5413780 A JP 5413780A JP H0347732 B2 JPH0347732 B2 JP H0347732B2
Authority
JP
Japan
Prior art keywords
film
pad
resin
nitride film
polyimide resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP55054137A
Other languages
English (en)
Japanese (ja)
Other versions
JPS56150830A (en
Inventor
Kazuhiro Tsurumaru
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP5413780A priority Critical patent/JPS56150830A/ja
Priority to DE19813116406 priority patent/DE3116406A1/de
Publication of JPS56150830A publication Critical patent/JPS56150830A/ja
Priority to US06/837,757 priority patent/US4733289A/en
Priority to US07/372,184 priority patent/US4990993A/en
Publication of JPH0347732B2 publication Critical patent/JPH0347732B2/ja
Granted legal-status Critical Current

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Classifications

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    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
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    • H01L2924/01014—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
  • Formation Of Insulating Films (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP5413780A 1980-04-25 1980-04-25 Semiconductor device Granted JPS56150830A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP5413780A JPS56150830A (en) 1980-04-25 1980-04-25 Semiconductor device
DE19813116406 DE3116406A1 (de) 1980-04-25 1981-04-24 Halbleiteranordnung
US06/837,757 US4733289A (en) 1980-04-25 1986-03-10 Resin-molded semiconductor device using polyimide and nitride films for the passivation film
US07/372,184 US4990993A (en) 1980-04-25 1989-06-26 Resin-molded semiconductor device using polymide and nitride films for the passivation film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5413780A JPS56150830A (en) 1980-04-25 1980-04-25 Semiconductor device

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2177407A Division JPH0340430A (ja) 1990-07-06 1990-07-06 半導体装置

Publications (2)

Publication Number Publication Date
JPS56150830A JPS56150830A (en) 1981-11-21
JPH0347732B2 true JPH0347732B2 (US20080094685A1-20080424-C00004.png) 1991-07-22

Family

ID=12962181

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5413780A Granted JPS56150830A (en) 1980-04-25 1980-04-25 Semiconductor device

Country Status (3)

Country Link
US (2) US4733289A (US20080094685A1-20080424-C00004.png)
JP (1) JPS56150830A (US20080094685A1-20080424-C00004.png)
DE (1) DE3116406A1 (US20080094685A1-20080424-C00004.png)

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WO2018116785A1 (ja) * 2016-12-20 2018-06-28 株式会社デンソー 半導体装置およびその製造方法

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JP2018100950A (ja) * 2016-12-20 2018-06-28 株式会社デンソー 半導体装置およびその製造方法
WO2018116785A1 (ja) * 2016-12-20 2018-06-28 株式会社デンソー 半導体装置およびその製造方法
CN110088587A (zh) * 2016-12-20 2019-08-02 株式会社电装 半导体装置及其制造方法

Also Published As

Publication number Publication date
JPS56150830A (en) 1981-11-21
DE3116406A1 (de) 1982-06-16
US4733289A (en) 1988-03-22
US4990993A (en) 1991-02-05

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