JPH0345548B2 - - Google Patents
Info
- Publication number
- JPH0345548B2 JPH0345548B2 JP58125309A JP12530983A JPH0345548B2 JP H0345548 B2 JPH0345548 B2 JP H0345548B2 JP 58125309 A JP58125309 A JP 58125309A JP 12530983 A JP12530983 A JP 12530983A JP H0345548 B2 JPH0345548 B2 JP H0345548B2
- Authority
- JP
- Japan
- Prior art keywords
- bipolar transistor
- film
- transistor
- type
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/01—Manufacture or treatment
- H10D84/0107—Integrating at least one component covered by H10D12/00 or H10D30/00 with at least one component covered by H10D8/00, H10D10/00 or H10D18/00, e.g. integrating IGFETs with BJTs
- H10D84/0109—Integrating at least one component covered by H10D12/00 or H10D30/00 with at least one component covered by H10D8/00, H10D10/00 or H10D18/00, e.g. integrating IGFETs with BJTs the at least one component covered by H10D12/00 or H10D30/00 being a MOS device
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/01—Manufacture or treatment
- H10D84/02—Manufacture or treatment characterised by using material-based technologies
- H10D84/03—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology
- H10D84/038—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology using silicon technology, e.g. SiGe
Landscapes
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58125309A JPS6017943A (ja) | 1983-07-08 | 1983-07-08 | 半導体装置の製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58125309A JPS6017943A (ja) | 1983-07-08 | 1983-07-08 | 半導体装置の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6017943A JPS6017943A (ja) | 1985-01-29 |
JPH0345548B2 true JPH0345548B2 (enrdf_load_stackoverflow) | 1991-07-11 |
Family
ID=14906910
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP58125309A Granted JPS6017943A (ja) | 1983-07-08 | 1983-07-08 | 半導体装置の製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6017943A (enrdf_load_stackoverflow) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5190886A (en) * | 1984-12-11 | 1993-03-02 | Seiko Epson Corporation | Semiconductor device and method of production |
JPS61139058A (ja) * | 1984-12-11 | 1986-06-26 | Seiko Epson Corp | 半導体製造装置 |
DE3676781D1 (de) * | 1985-09-13 | 1991-02-14 | Siemens Ag | Integrierte bipolar- und komplementaere mos-transistoren auf einem gemeinsamen substrat enthaltende schaltung und verfahren zu ihrer herstellung. |
JP2578757B2 (ja) * | 1985-10-17 | 1997-02-05 | 日本電気株式会社 | 半導体装置 |
JPS63216370A (ja) * | 1987-03-05 | 1988-09-08 | Toshiba Corp | 半導体装置 |
JP2610906B2 (ja) * | 1987-11-18 | 1997-05-14 | 富士電機株式会社 | BiMOS半導体回路装置の製造方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5420679A (en) * | 1977-07-18 | 1979-02-16 | Hitachi Ltd | Bipolar mos semiconductor integrated circuit device and the same |
JPS55165669A (en) * | 1979-06-11 | 1980-12-24 | Hitachi Ltd | Bipolar-mos device |
JPS5768075A (en) * | 1980-10-16 | 1982-04-26 | Nippon Gakki Seizo Kk | Manufacture of integrated circuit device |
-
1983
- 1983-07-08 JP JP58125309A patent/JPS6017943A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS6017943A (ja) | 1985-01-29 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP0283135B1 (en) | Fabrication of semiconductor structure | |
JPH0355984B2 (enrdf_load_stackoverflow) | ||
JPH0555484A (ja) | 半導体装置の製造方法 | |
US5319235A (en) | Monolithic IC formed of a CCD, CMOS and a bipolar element | |
JPH05226589A (ja) | C−BiCMOS型半導体装置およびその製造方法 | |
JP3165118B2 (ja) | 半導体装置 | |
JPS61242064A (ja) | 相補型半導体装置の製造方法 | |
JP2596117B2 (ja) | 半導体集積回路の製造方法 | |
JPH0345548B2 (enrdf_load_stackoverflow) | ||
JP3303550B2 (ja) | 半導体装置の製造方法 | |
JPH03262154A (ja) | BiCMOS型半導体集積回路の製造方法 | |
JP3097095B2 (ja) | 半導体装置の製造方法 | |
JP2575876B2 (ja) | 半導体装置 | |
JPH10172981A (ja) | 半導体装置及びその製造方法 | |
JPS6244862B2 (enrdf_load_stackoverflow) | ||
JP2937338B2 (ja) | 半導体装置 | |
JPH056961A (ja) | 半導体装置の製造方法 | |
JPH02241057A (ja) | 半導体集積回路の製造方法 | |
JPH01150349A (ja) | 半導体集積回路装置の製造方法 | |
JP2915040B2 (ja) | 半導体装置の製造方法 | |
JP2793207B2 (ja) | 半導体装置の製造方法 | |
JPH04368171A (ja) | Bi−CMOS集積回路の製造方法 | |
JPH0369179B2 (enrdf_load_stackoverflow) | ||
JPH0734453B2 (ja) | 半導体集積回路装置の製造方法 | |
JPH0352223B2 (enrdf_load_stackoverflow) |