JPH0268992A - 多層配線基板 - Google Patents

多層配線基板

Info

Publication number
JPH0268992A
JPH0268992A JP63220869A JP22086988A JPH0268992A JP H0268992 A JPH0268992 A JP H0268992A JP 63220869 A JP63220869 A JP 63220869A JP 22086988 A JP22086988 A JP 22086988A JP H0268992 A JPH0268992 A JP H0268992A
Authority
JP
Japan
Prior art keywords
layer
glass ceramics
polyimide
polyimide resin
ceramic substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP63220869A
Other languages
English (en)
Inventor
Koji Kanehara
金原　広治
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP63220869A priority Critical patent/JPH0268992A/ja
Priority to DE68915901T priority patent/DE68915901T2/de
Priority to EP89116215A priority patent/EP0357088B1/en
Publication of JPH0268992A publication Critical patent/JPH0268992A/ja
Priority to US07/665,938 priority patent/US5111003A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F17/0013—Printed inductances with stacked layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • H05K3/4605—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated made from inorganic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0179—Thin film deposited insulating layer, e.g. inorganic layer for printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1581—Treating the backside of the PCB, e.g. for heating during soldering or providing a liquid coating on the backside
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/467—Adding a circuit layer by thin film methods
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12556—Organic component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12583—Component contains compound of adjacent metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12875—Platinum group metal-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12889—Au-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24851—Intermediate layer is discontinuous or differential
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24926—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including ceramic, glass, porcelain or quartz layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
    • Y10T428/31609—Particulate metal or metal compound-containing
    • Y10T428/31612—As silicone, silane or siloxane
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
    • Y10T428/31623—Next to polyamide or polyimide
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31721—Of polyimide
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31725—Of polyamide
    • Y10T428/31765—Inorganic-containing or next to inorganic-containing

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、多層配線基板の構造に関し、特に、ガラスセ
ラミックス基板上にポリイミド樹脂の微細多層配線層を
形成する多層配線基板の層構成に関する。
〔従来の技術〕
従来、ガラスセラミックス基板上にポリイミド樹脂を絶
縁材料に用いて微細多層配線層を形成する場合には、ガ
ラスセラミックス基板上にシラン系の密着改良剤等を塗
布してポリイミド樹脂層を形成していた。
〔発明が解決しようとする課題〕
しかし、シラン系の密着改良剤の塗布だけでは、ガラス
セラミックスとポリイミド樹脂との強い密着が得られな
い。そのため、多層配線基板の大型化に従がい、ガラス
セラミックス基板とポリイミド樹脂との熱膨張率の差に
よる応力が増大し、それが原因となって、ガラスセラミ
ックス。
ポリイミド樹脂間の剥れが発生するという欠点がある。
〔課題を解決するための手段〕
本発明は、ガラスセラミックス基板上にポリイミド樹脂
を絶縁材料とする微細多層配線層を形成する多層配線基
板において、前記ガラスセラミックス基板と前記多層配
線層との間に薄い無機絶縁層もしくは金属層を挟むこと
を特徴とする。
〔実施例〕
次に、本発明について図面を参照して説明する。第１図
は本発明の第１の実施例の断面図である。ガラスセラミ
ックス基板１１は金の導体配線層１４を内層に含んでい
る。ガラスセラミックス基板１１の上にはポリイミド樹
脂を絶縁材料とした多層配線層１３が形成され、この多
層配線層１３は内層に金の導体配線層１５を含んでいる
。ガラスセラミックス基板１１とポリイミド多層配線層
１３との間には二酸化ケイ素の層１２か挟まれている。
この二酸化ケイ素の層１２は厚さが１ミクロンで、ガラ
スセラミックスとポリイミド樹脂との間の密着層として
機能している。ガラスセラミックス基板１】、の導体配
線層１４とポリイミド多層配線層内の導体配線層１５と
をつなぐために二酸化ケイ素Ｎ１２にピアホール１６が
形成されている。
本実施例では二酸化ケイ素層１２はプラズマＣＶＤ法で
カラスセラミックス基板上に形成し、ピアホール１６は
りアクティブイオンビームエッチツク法て形成しな。そ
の他に、二酸化ケイ素層はスパッタなどの物理蒸着法で
、ピアホールはりアクティブイオンエツチング、ウェッ
トエツチング、リフトオフ法などでも形成できる。
さらに、ガラスセラミックス基板とポリイミド樹脂との
密着改良層として二酸化ケイ素の他に酸化アルミニウム
、窒化アルミニウム、窒化ホウ素または、特に密着改良
のなめに組成を変えたガラスセラミックスが使用できる
。
また、カラスセラミックス基板１１とポリイミド樹脂多
層配線層１３との間に挟む無機絶縁層の熱膨張率が、ガ
ラスセラミックスとポリイミド樹脂の中間である場合は
、この無機絶縁層は密着改良層だけでなく、熱膨張率の
異なる２つの材料層間の応力緩和層としても機能する。
この様な無機絶縁材料には各種添加剤を加え熱膨張率を
調整したセラミンクペーストなどがある。
第２図は本発明の第２の実施例の断面図である。ガラス
セラミックス基板２１およびポリイミド多層配線層２３
は、おのおのの内層も古めてすべて第１図に示した第１
の実施例と同じ構成であり、それぞれ導体配線層２４お
よび２５を含んでいる。ガラスセラミックス基板２１と
ポリイミド多層配線層２３の間には金とパラジウムによ
る多層メツキで形成された応力緩和層２２が挟まれてい
る。
この応力緩和層２２はクロムとパラジウムのスパッタ膜
層（クロム１０００吉、パラジウム１０００告）金メツ
キ層（５μｍ）、パラジウムメッキ層（０，５μｍ）で
構成されている。ガラスセラミックス基板２１と応力緩
和層２２とはクロムのスパッタ膜が密着層となり、応力
緩和層２２とポリイミド多層配線層２３とはパラジウム
メッキ層が密着層となっている。ガラスセラミックス基
板２１とポリイミド多層配線層２３の熱膨張率の違いに
よって発生する応力は応力緩和層２２の中の５μｍ厚の
金メツキ層によって緩和される。
ガラスセラミックス基板内の導体配線層２４とポリイミ
ド多層配線層２３の導体配線層２５をつなぐ部分の応力
緩和層２２には配線層と緩和層が短絡しない様にピアホ
ール２６が形成されている。
なお、応力緩和層２２は、ピアホール２６を除く部分は
すべてベタ層でもしくは微細メツシュ層で形成されてお
り、この応力緩和層を電源のグランドに接続することに
より、信号配線層のインピーダンスマツチングなどにも
使用できる。
応力緩和層を構成する金属には本実施例の他に次のもの
が使用できる。クロムスパッタの他にはチタン、タング
ステン、ニクロムスパッタなど、パラジウムスパッタの
他には白金、ニッケルスパッタなど、金メツキの他には
銅メツキなど、パラジウムメッキの他にはニッケル、ク
ロムメツキなどである。
〔発明の効果〕
以上説明したように本発明は、ガラスセラミックス基板
とポリイミド樹脂層との間に薄い無機絶縁層もしくは金
属層を挟むことにより、ガラスセラミックス基板とポリ
イミド樹脂層との密着の大幅な改善および、熱膨張率の
違いによる剥れを防止することができるという効果があ
る。
【図面の簡単な説明】
第１図は本発明の第１の実施例の断面図、第２図は第２
の実施例の断面図である。 １１・・・ガラスセラミックス基板、１２・・・二酸化
ケイ素層、１３・・・ポリイミド多層配線層、１４・・
・ガラスセラミックス基板内の導体配線層、１５・・・
ポリイミド絶縁層の導体配線層、１６・・・二酸化ケイ
素層のビアポール、２１・・・ガラスセラミックス基板
、２２・・・応力緩和層、２３・・・ポリイミド多層配
線層、２４・・・ガラスセラミックス基板内の導体配線
層、２５・・・ポリイミド絶縁層の導体配線層、２６・
・・応力緩和層のピアホール。

Claims (1)

    【特許請求の範囲】
  1. ガラスセラミックス基板上にポリイミド樹脂を絶縁材料
    とする微細多層配線層を形成する多層配線基板において
    、前記ガラスセラミックス基板と前記多層配線層との間
    に薄い無機絶縁層もしくは金属層を挟むことを特徴とす
    る多層配線基板。
JP63220869A 1988-09-02 1988-09-02 多層配線基板 Pending JPH0268992A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP63220869A JPH0268992A (ja) 1988-09-02 1988-09-02 多層配線基板
DE68915901T DE68915901T2 (de) 1988-09-02 1989-09-01 Mehrschichtiges Substrat mit Leiterbahnen.
EP89116215A EP0357088B1 (en) 1988-09-02 1989-09-01 Multilayer wiring substrate
US07/665,938 US5111003A (en) 1988-09-02 1991-03-06 Multilayer wiring substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63220869A JPH0268992A (ja) 1988-09-02 1988-09-02 多層配線基板

Publications (1)

Publication Number Publication Date
JPH0268992A true JPH0268992A (ja) 1990-03-08

Family

ID=16757818

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63220869A Pending JPH0268992A (ja) 1988-09-02 1988-09-02 多層配線基板

Country Status (4)

Country Link
US (1) US5111003A (ja)
EP (1) EP0357088B1 (ja)
JP (1) JPH0268992A (ja)
DE (1) DE68915901T2 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05102662A (ja) * 1991-10-07 1993-04-23 Fujitsu Ltd 薄膜多層回路基板
JPH07297560A (ja) * 1994-04-28 1995-11-10 Hitachi Ltd 多層プリント配線基板およびその実装構造体
JP2010003871A (ja) * 2008-06-20 2010-01-07 Kyocera Corp 配線基板およびプローブカードならびに電子装置

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US5080958A (en) * 1989-08-01 1992-01-14 E. I. Du Pont De Nemours And Company Multilayer interconnects
JP2551224B2 (ja) * 1990-10-17 1996-11-06 日本電気株式会社 多層配線基板および多層配線基板の製造方法
FR2674078B1 (fr) * 1991-03-12 1994-10-07 Thomson Trt Defense Emetteur-recepteur hyperfrequence utilisant la technique des circuits imprimes multicouches.
US5315239A (en) * 1991-12-16 1994-05-24 Hughes Aircraft Company Circuit module connections
US5347091A (en) * 1992-08-21 1994-09-13 Cts Corporation Multilayer circuit card connector
US5389743A (en) * 1992-12-21 1995-02-14 Hughes Aircraft Company Rivet design for enhanced copper thick-film I/O pad adhesion
JPH0828580B2 (ja) * 1993-04-21 1996-03-21 日本電気株式会社 配線基板構造及びその製造方法
JPH06325979A (ja) * 1993-05-11 1994-11-25 Murata Mfg Co Ltd 複合電子部品
JP3252635B2 (ja) * 1995-01-13 2002-02-04 株式会社村田製作所 積層電子部品
US6080468A (en) * 1997-02-28 2000-06-27 Taiyo Yuden Co., Ltd. Laminated composite electronic device and a manufacturing method thereof
JP3840921B2 (ja) * 2001-06-13 2006-11-01 株式会社デンソー プリント基板のおよびその製造方法
JP2003298232A (ja) * 2002-04-02 2003-10-17 Sony Corp 多層配線基板の製造方法および多層配線基板
KR20080005528A (ko) * 2005-04-05 2008-01-14 에스브이 프로브 피티이 엘티디 세라믹 스페이스 트랜스포머에서의 프로브 패드 구조
KR100896601B1 (ko) * 2007-11-05 2009-05-08 삼성전기주식회사 무수축 세라믹 기판의 제조방법 및 이를 이용한 무수축세라믹 기판
US9394067B2 (en) 2011-06-30 2016-07-19 Hellermanntyton Corporation Cable tie tensioning and cut-off tool
WO2015108051A1 (ja) * 2014-01-17 2015-07-23 株式会社村田製作所 積層配線基板およびこれを備える検査装置
JP6724775B2 (ja) * 2016-12-28 2020-07-15 凸版印刷株式会社 配線基板の個片化方法及びパッケージ用基板
US20180206334A1 (en) * 2017-01-16 2018-07-19 Innolux Corporation Metal-laminated structure and high-frequency device comprising the same
CN108668453A (zh) * 2018-04-27 2018-10-16 深圳顺络电子股份有限公司 一种多孔加热组件及其制作方法

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JPS5498583A (en) * 1978-01-20 1979-08-03 Sanyo Electric Co Ltd Coating method of metallic film
JPS59151490A (ja) * 1983-02-18 1984-08-29 日本電気株式会社 回路基板の配線導体

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JPS59167096A (ja) * 1983-03-11 1984-09-20 日本電気株式会社 回路基板
EP0235582A3 (en) * 1986-02-27 1989-03-29 Hewlett-Packard Company Bonded press pad
JPS62287658A (ja) * 1986-06-06 1987-12-14 Hitachi Ltd セラミックス多層回路板
JPS6319896A (ja) * 1986-07-14 1988-01-27 日本電気株式会社 多層配線基板
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JPS52149358A (en) * 1976-06-08 1977-12-12 Fujitsu Ltd Multilayer wiring method
JPS5498583A (en) * 1978-01-20 1979-08-03 Sanyo Electric Co Ltd Coating method of metallic film
JPS59151490A (ja) * 1983-02-18 1984-08-29 日本電気株式会社 回路基板の配線導体

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05102662A (ja) * 1991-10-07 1993-04-23 Fujitsu Ltd 薄膜多層回路基板
JPH07297560A (ja) * 1994-04-28 1995-11-10 Hitachi Ltd 多層プリント配線基板およびその実装構造体
JP2010003871A (ja) * 2008-06-20 2010-01-07 Kyocera Corp 配線基板およびプローブカードならびに電子装置

Also Published As

Publication number Publication date
EP0357088B1 (en) 1994-06-08
EP0357088A3 (en) 1991-05-29
EP0357088A2 (en) 1990-03-07
DE68915901D1 (de) 1994-07-14
US5111003A (en) 1992-05-05
DE68915901T2 (de) 1994-09-22

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