JPH0241904B2 - - Google Patents

Info

Publication number
JPH0241904B2
JPH0241904B2 JP58211793A JP21179383A JPH0241904B2 JP H0241904 B2 JPH0241904 B2 JP H0241904B2 JP 58211793 A JP58211793 A JP 58211793A JP 21179383 A JP21179383 A JP 21179383A JP H0241904 B2 JPH0241904 B2 JP H0241904B2
Authority
JP
Japan
Prior art keywords
chip
bonding pad
signal line
integrated circuit
semiconductor integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58211793A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60103631A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP58211793A priority Critical patent/JPS60103631A/ja
Publication of JPS60103631A publication Critical patent/JPS60103631A/ja
Publication of JPH0241904B2 publication Critical patent/JPH0241904B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/90—
    • H10W70/60—
    • H10W72/075—
    • H10W72/5449—
    • H10W72/932—
    • H10W90/756—

Landscapes

  • Wire Bonding (AREA)
JP58211793A 1983-11-11 1983-11-11 半導体集積回路装置 Granted JPS60103631A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58211793A JPS60103631A (ja) 1983-11-11 1983-11-11 半導体集積回路装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58211793A JPS60103631A (ja) 1983-11-11 1983-11-11 半導体集積回路装置

Publications (2)

Publication Number Publication Date
JPS60103631A JPS60103631A (ja) 1985-06-07
JPH0241904B2 true JPH0241904B2 (enExample) 1990-09-19

Family

ID=16611698

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58211793A Granted JPS60103631A (ja) 1983-11-11 1983-11-11 半導体集積回路装置

Country Status (1)

Country Link
JP (1) JPS60103631A (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4990996A (en) * 1987-12-18 1991-02-05 Zilog, Inc. Bonding pad scheme
JP3462921B2 (ja) * 1995-02-14 2003-11-05 三菱電機株式会社 半導体装置
JP3850814B2 (ja) * 2003-06-24 2006-11-29 ローム株式会社 半導体集積装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS525228B2 (enExample) * 1972-09-18 1977-02-10
JPS52157768U (enExample) * 1976-05-26 1977-11-30
JPS5687350A (en) * 1979-12-18 1981-07-15 Nec Corp Semiconductor device

Also Published As

Publication number Publication date
JPS60103631A (ja) 1985-06-07

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