JPS60103631A - 半導体集積回路装置 - Google Patents

半導体集積回路装置

Info

Publication number
JPS60103631A
JPS60103631A JP58211793A JP21179383A JPS60103631A JP S60103631 A JPS60103631 A JP S60103631A JP 58211793 A JP58211793 A JP 58211793A JP 21179383 A JP21179383 A JP 21179383A JP S60103631 A JPS60103631 A JP S60103631A
Authority
JP
Japan
Prior art keywords
bonding pad
chip
bonding
integrated circuit
circuit device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58211793A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0241904B2 (enExample
Inventor
Yoshinori Sato
義則 佐藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP58211793A priority Critical patent/JPS60103631A/ja
Publication of JPS60103631A publication Critical patent/JPS60103631A/ja
Publication of JPH0241904B2 publication Critical patent/JPH0241904B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/90—
    • H10W70/60—
    • H10W72/075—
    • H10W72/5449—
    • H10W72/932—
    • H10W90/756—

Landscapes

  • Wire Bonding (AREA)
JP58211793A 1983-11-11 1983-11-11 半導体集積回路装置 Granted JPS60103631A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58211793A JPS60103631A (ja) 1983-11-11 1983-11-11 半導体集積回路装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58211793A JPS60103631A (ja) 1983-11-11 1983-11-11 半導体集積回路装置

Publications (2)

Publication Number Publication Date
JPS60103631A true JPS60103631A (ja) 1985-06-07
JPH0241904B2 JPH0241904B2 (enExample) 1990-09-19

Family

ID=16611698

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58211793A Granted JPS60103631A (ja) 1983-11-11 1983-11-11 半導体集積回路装置

Country Status (1)

Country Link
JP (1) JPS60103631A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4990996A (en) * 1987-12-18 1991-02-05 Zilog, Inc. Bonding pad scheme
US5801451A (en) * 1995-02-14 1998-09-01 Mitsubishi Denki Kabushiki Kaisha Semiconductor device including a plurality of input buffer circuits receiving the same control signal
CN100353553C (zh) * 2003-06-24 2007-12-05 罗姆股份有限公司 半导体集成装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4950878A (enExample) * 1972-09-18 1974-05-17
JPS52157768U (enExample) * 1976-05-26 1977-11-30
JPS5687350A (en) * 1979-12-18 1981-07-15 Nec Corp Semiconductor device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4950878A (enExample) * 1972-09-18 1974-05-17
JPS52157768U (enExample) * 1976-05-26 1977-11-30
JPS5687350A (en) * 1979-12-18 1981-07-15 Nec Corp Semiconductor device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4990996A (en) * 1987-12-18 1991-02-05 Zilog, Inc. Bonding pad scheme
US5801451A (en) * 1995-02-14 1998-09-01 Mitsubishi Denki Kabushiki Kaisha Semiconductor device including a plurality of input buffer circuits receiving the same control signal
CN100353553C (zh) * 2003-06-24 2007-12-05 罗姆股份有限公司 半导体集成装置

Also Published As

Publication number Publication date
JPH0241904B2 (enExample) 1990-09-19

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