JPH0234823Y2 - - Google Patents
Info
- Publication number
- JPH0234823Y2 JPH0234823Y2 JP1985055244U JP5524485U JPH0234823Y2 JP H0234823 Y2 JPH0234823 Y2 JP H0234823Y2 JP 1985055244 U JP1985055244 U JP 1985055244U JP 5524485 U JP5524485 U JP 5524485U JP H0234823 Y2 JPH0234823 Y2 JP H0234823Y2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- tank
- surface treatment
- grooves
- processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985055244U JPH0234823Y2 (enrdf_load_stackoverflow) | 1985-04-12 | 1985-04-12 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985055244U JPH0234823Y2 (enrdf_load_stackoverflow) | 1985-04-12 | 1985-04-12 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61171244U JPS61171244U (enrdf_load_stackoverflow) | 1986-10-24 |
JPH0234823Y2 true JPH0234823Y2 (enrdf_load_stackoverflow) | 1990-09-19 |
Family
ID=30577735
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1985055244U Expired JPH0234823Y2 (enrdf_load_stackoverflow) | 1985-04-12 | 1985-04-12 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0234823Y2 (enrdf_load_stackoverflow) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0626210B2 (ja) * | 1989-06-29 | 1994-04-06 | 東邦化成株式会社 | ウェット処理マシン |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4817894U (enrdf_load_stackoverflow) * | 1971-07-12 | 1973-02-28 | ||
JPS544668U (enrdf_load_stackoverflow) * | 1977-06-14 | 1979-01-12 | ||
JPS5494274A (en) * | 1978-01-10 | 1979-07-25 | Toshiba Corp | Liquid terating device of semiconductor wafers |
JPS5929804Y2 (ja) * | 1980-08-15 | 1984-08-27 | ニチデン機械株式会社 | 溶接機 |
JPS5752138A (en) * | 1980-09-16 | 1982-03-27 | Mitsubishi Electric Corp | Etching device for semiconductor substrate |
JPS5764740A (en) * | 1980-10-09 | 1982-04-20 | Nippon Telegr & Teleph Corp <Ntt> | Developing device |
JPS584143A (ja) * | 1981-06-30 | 1983-01-11 | Fujitsu Ltd | ポジ・レジスト膜の現像方法 |
JPS5848423A (ja) * | 1981-09-17 | 1983-03-22 | Matsushita Electric Ind Co Ltd | 洗浄槽 |
JPS59134834A (ja) * | 1983-01-21 | 1984-08-02 | Mitsubishi Electric Corp | 半導体ウエハの洗浄装置 |
-
1985
- 1985-04-12 JP JP1985055244U patent/JPH0234823Y2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS61171244U (enrdf_load_stackoverflow) | 1986-10-24 |
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