JPH0213932B2 - - Google Patents

Info

Publication number
JPH0213932B2
JPH0213932B2 JP59257087A JP25708784A JPH0213932B2 JP H0213932 B2 JPH0213932 B2 JP H0213932B2 JP 59257087 A JP59257087 A JP 59257087A JP 25708784 A JP25708784 A JP 25708784A JP H0213932 B2 JPH0213932 B2 JP H0213932B2
Authority
JP
Japan
Prior art keywords
resin
support plate
main surface
resin body
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59257087A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61135129A (ja
Inventor
Minehide Totokawa
Takaaki Yokoyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanken Electric Co Ltd
Original Assignee
Sanken Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanken Electric Co Ltd filed Critical Sanken Electric Co Ltd
Priority to JP59257087A priority Critical patent/JPS61135129A/ja
Publication of JPS61135129A publication Critical patent/JPS61135129A/ja
Publication of JPH0213932B2 publication Critical patent/JPH0213932B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W74/01—
    • H10W72/01515—
    • H10W72/075—
    • H10W74/00—
    • H10W74/10—
    • H10W90/756—

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP59257087A 1984-12-05 1984-12-05 樹脂封止型半導体装置の製造方法 Granted JPS61135129A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59257087A JPS61135129A (ja) 1984-12-05 1984-12-05 樹脂封止型半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59257087A JPS61135129A (ja) 1984-12-05 1984-12-05 樹脂封止型半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS61135129A JPS61135129A (ja) 1986-06-23
JPH0213932B2 true JPH0213932B2 (enExample) 1990-04-05

Family

ID=17301560

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59257087A Granted JPS61135129A (ja) 1984-12-05 1984-12-05 樹脂封止型半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS61135129A (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0394432A (ja) * 1989-06-30 1991-04-19 Sanken Electric Co Ltd 樹脂封止型電子部品の製造方法

Also Published As

Publication number Publication date
JPS61135129A (ja) 1986-06-23

Similar Documents

Publication Publication Date Title
JPS6220705B2 (enExample)
JP5180722B2 (ja) 半導体装置の製造方法
JPS6227750B2 (enExample)
JPH0815165B2 (ja) 樹脂絶縁型半導体装置の製造方法
JPH0213462B2 (enExample)
JPH0527261B2 (enExample)
JPH0213932B2 (enExample)
JPS6132434A (ja) 樹脂封止型半導体装置の製造方法
JPH0244147B2 (enExample)
JPH0254665B2 (enExample)
US12211764B2 (en) Semiconductor device and method of manufacturing the same
JPH0754841B2 (ja) 絶縁物封止型回路装置
JP3808746B2 (ja) 樹脂パッケージ型半導体装置の製造方法
JPS63211638A (ja) 樹脂封止型半導体装置の製造方法
JPS607750A (ja) 絶縁型半導体装置
JPS6244815B2 (enExample)
JPS612348A (ja) 樹脂封止形半導体装置の製造方法
JPH0528778Y2 (enExample)
JPH0213461B2 (enExample)
JPH05109795A (ja) 樹脂封止型半導体装置の製造方法
JPH0195751U (enExample)
JPH088363A (ja) リードフレームおよびそれを用いた半導体装置ならびに半導体製造方法およびその製造に用いるモールド金型
KR200159005Y1 (ko) 리드온칩 반도체 패키지
JPS6138194Y2 (enExample)
JPS6246268Y2 (enExample)

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees