JPS6138194Y2 - - Google Patents

Info

Publication number
JPS6138194Y2
JPS6138194Y2 JP1981025812U JP2581281U JPS6138194Y2 JP S6138194 Y2 JPS6138194 Y2 JP S6138194Y2 JP 1981025812 U JP1981025812 U JP 1981025812U JP 2581281 U JP2581281 U JP 2581281U JP S6138194 Y2 JPS6138194 Y2 JP S6138194Y2
Authority
JP
Japan
Prior art keywords
heat sink
resin material
mounting hole
semiconductor device
cavity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1981025812U
Other languages
English (en)
Japanese (ja)
Other versions
JPS57138344U (enExample
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1981025812U priority Critical patent/JPS6138194Y2/ja
Publication of JPS57138344U publication Critical patent/JPS57138344U/ja
Application granted granted Critical
Publication of JPS6138194Y2 publication Critical patent/JPS6138194Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H10W72/5449
    • H10W72/884
    • H10W74/00
    • H10W74/10
    • H10W90/736
    • H10W90/756

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1981025812U 1981-02-24 1981-02-24 Expired JPS6138194Y2 (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1981025812U JPS6138194Y2 (enExample) 1981-02-24 1981-02-24

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1981025812U JPS6138194Y2 (enExample) 1981-02-24 1981-02-24

Publications (2)

Publication Number Publication Date
JPS57138344U JPS57138344U (enExample) 1982-08-30
JPS6138194Y2 true JPS6138194Y2 (enExample) 1986-11-05

Family

ID=29823505

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981025812U Expired JPS6138194Y2 (enExample) 1981-02-24 1981-02-24

Country Status (1)

Country Link
JP (1) JPS6138194Y2 (enExample)

Also Published As

Publication number Publication date
JPS57138344U (enExample) 1982-08-30

Similar Documents

Publication Publication Date Title
US5091341A (en) Method of sealing semiconductor device with resin by pressing a lead frame to a heat sink using an upper mold pressure member
JP2001525126A (ja) セラミック基板を備えた電力用半導体モジュール
US4750030A (en) Resin-molded semiconductor device having heat radiating plate embedded in the resin
US5489805A (en) Slotted thermal dissipater for a semiconductor package
JPS6244408B2 (enExample)
JPH0815165B2 (ja) 樹脂絶縁型半導体装置の製造方法
JPS6138194Y2 (enExample)
JPH0527261B2 (enExample)
JP2752677B2 (ja) 半導体装置の製造方法
JPH0254665B2 (enExample)
JPH0213462B2 (enExample)
JPS607484Y2 (ja) 電子部品の樹脂モ−ルド装置
JPS615529A (ja) 絶縁型半導体装置
JPS5926604Y2 (ja) 半導体装置
JPS61279137A (ja) 樹脂封止半導体装置の製造方法
JP2514818B2 (ja) 集積回路基板の樹脂封止方法
JPS63211638A (ja) 樹脂封止型半導体装置の製造方法
JPS607750A (ja) 絶縁型半導体装置
JPS595981Y2 (ja) 半導体装置
JPH02164044A (ja) 絶縁型樹脂封止半導体装置の成形装置
JPS60128645A (ja) 絶縁型パワートランジスタの製造方法
JPH0338837Y2 (enExample)
JPH0195751U (enExample)
JPH04103659U (ja) 表面実装型半導体集積回路装置
JPH0341476Y2 (enExample)