JPH0254665B2 - - Google Patents

Info

Publication number
JPH0254665B2
JPH0254665B2 JP59159047A JP15904784A JPH0254665B2 JP H0254665 B2 JPH0254665 B2 JP H0254665B2 JP 59159047 A JP59159047 A JP 59159047A JP 15904784 A JP15904784 A JP 15904784A JP H0254665 B2 JPH0254665 B2 JP H0254665B2
Authority
JP
Japan
Prior art keywords
strip
support plate
resin
mold
section
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59159047A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6156420A (ja
Inventor
Takaaki Yokoyama
Yoshiharu Tada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanken Electric Co Ltd
Original Assignee
Sanken Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanken Electric Co Ltd filed Critical Sanken Electric Co Ltd
Priority to JP59159047A priority Critical patent/JPS6156420A/ja
Publication of JPS6156420A publication Critical patent/JPS6156420A/ja
Publication of JPH0254665B2 publication Critical patent/JPH0254665B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W74/01—
    • H10W72/01515—
    • H10W72/075—
    • H10W72/5449—
    • H10W74/00—
    • H10W90/756—

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP59159047A 1984-07-31 1984-07-31 樹脂封止形半導体装置の製造方法 Granted JPS6156420A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59159047A JPS6156420A (ja) 1984-07-31 1984-07-31 樹脂封止形半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59159047A JPS6156420A (ja) 1984-07-31 1984-07-31 樹脂封止形半導体装置の製造方法

Related Child Applications (4)

Application Number Title Priority Date Filing Date
JP1086909A Division JPH01309338A (ja) 1989-04-07 1989-04-07 樹脂封止形半導体装置の製造方法
JP1086912A Division JPH0249445A (ja) 1989-04-07 1989-04-07 樹脂封止形半導体装置の製造方法
JP1086911A Division JPH0249444A (ja) 1989-04-07 1989-04-07 樹脂封止形半導体装置の製造方法
JP1086910A Division JPH01315147A (ja) 1989-04-07 1989-04-07 樹脂封止形半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS6156420A JPS6156420A (ja) 1986-03-22
JPH0254665B2 true JPH0254665B2 (enExample) 1990-11-22

Family

ID=15685065

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59159047A Granted JPS6156420A (ja) 1984-07-31 1984-07-31 樹脂封止形半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS6156420A (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6148954A (ja) * 1984-08-15 1986-03-10 Nec Kansai Ltd 半導体装置の製造方法
JPS62180957U (enExample) * 1986-05-06 1987-11-17
JPH0824156B2 (ja) * 1987-05-25 1996-03-06 サンケン電気株式会社 樹脂封止型半導体装置の製造方法
JPH0741165Y2 (ja) * 1987-07-27 1995-09-20 サンケン電気株式会社 樹脂封止型半導体装置用リードフレーム
JPS6442825A (en) * 1987-08-10 1989-02-15 Sanken Electric Co Ltd Manufacture of resin sealed semiconductor device
JPH0739241Y2 (ja) * 1987-09-08 1995-09-06 サンケン電気株式会社 樹脂封止型半導体装置用リードフレーム
IT1252624B (it) * 1991-12-05 1995-06-19 Cons Ric Microelettronica Dispositivo semiconduttore incapsulato in resina e elettricamente isolato di migliorate caratteristiche di isolamento,e relativo processo di fabbricazione

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60172346U (ja) * 1984-04-23 1985-11-15 新電元工業株式会社 樹脂密封型半導体装置

Also Published As

Publication number Publication date
JPS6156420A (ja) 1986-03-22

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees