JPH0528778Y2 - - Google Patents

Info

Publication number
JPH0528778Y2
JPH0528778Y2 JP1988025991U JP2599188U JPH0528778Y2 JP H0528778 Y2 JPH0528778 Y2 JP H0528778Y2 JP 1988025991 U JP1988025991 U JP 1988025991U JP 2599188 U JP2599188 U JP 2599188U JP H0528778 Y2 JPH0528778 Y2 JP H0528778Y2
Authority
JP
Japan
Prior art keywords
support plate
lead
external
thin
external lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1988025991U
Other languages
English (en)
Japanese (ja)
Other versions
JPH01130554U (enExample
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988025991U priority Critical patent/JPH0528778Y2/ja
Publication of JPH01130554U publication Critical patent/JPH01130554U/ja
Application granted granted Critical
Publication of JPH0528778Y2 publication Critical patent/JPH0528778Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
JP1988025991U 1988-03-01 1988-03-01 Expired - Lifetime JPH0528778Y2 (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988025991U JPH0528778Y2 (enExample) 1988-03-01 1988-03-01

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988025991U JPH0528778Y2 (enExample) 1988-03-01 1988-03-01

Publications (2)

Publication Number Publication Date
JPH01130554U JPH01130554U (enExample) 1989-09-05
JPH0528778Y2 true JPH0528778Y2 (enExample) 1993-07-23

Family

ID=31247208

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988025991U Expired - Lifetime JPH0528778Y2 (enExample) 1988-03-01 1988-03-01

Country Status (1)

Country Link
JP (1) JPH0528778Y2 (enExample)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6121134Y2 (enExample) * 1980-09-19 1986-06-25

Also Published As

Publication number Publication date
JPH01130554U (enExample) 1989-09-05

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