JPH0563937B2 - - Google Patents

Info

Publication number
JPH0563937B2
JPH0563937B2 JP3187449A JP18744991A JPH0563937B2 JP H0563937 B2 JPH0563937 B2 JP H0563937B2 JP 3187449 A JP3187449 A JP 3187449A JP 18744991 A JP18744991 A JP 18744991A JP H0563937 B2 JPH0563937 B2 JP H0563937B2
Authority
JP
Japan
Prior art keywords
strip
support plate
section
resin
small cross
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP3187449A
Other languages
English (en)
Japanese (ja)
Other versions
JPH04340237A (ja
Inventor
Takaaki Yokoyama
Yoshiharu Tada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanken Electric Co Ltd
Original Assignee
Sanken Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanken Electric Co Ltd filed Critical Sanken Electric Co Ltd
Priority to JP3187449A priority Critical patent/JPH04340237A/ja
Publication of JPH04340237A publication Critical patent/JPH04340237A/ja
Publication of JPH0563937B2 publication Critical patent/JPH0563937B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP3187449A 1991-07-26 1991-07-26 樹脂封止形半導体装置の製造方法 Granted JPH04340237A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3187449A JPH04340237A (ja) 1991-07-26 1991-07-26 樹脂封止形半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3187449A JPH04340237A (ja) 1991-07-26 1991-07-26 樹脂封止形半導体装置の製造方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP1086912A Division JPH0249445A (ja) 1989-04-07 1989-04-07 樹脂封止形半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPH04340237A JPH04340237A (ja) 1992-11-26
JPH0563937B2 true JPH0563937B2 (enExample) 1993-09-13

Family

ID=16206272

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3187449A Granted JPH04340237A (ja) 1991-07-26 1991-07-26 樹脂封止形半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPH04340237A (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4953205B2 (ja) * 2007-05-01 2012-06-13 三菱電機株式会社 半導体装置
JP5281797B2 (ja) * 2008-01-22 2013-09-04 アスモ株式会社 樹脂封止型半導体装置
JP5091832B2 (ja) * 2008-10-28 2012-12-05 新電元工業株式会社 リードフレーム及び半導体装置

Also Published As

Publication number Publication date
JPH04340237A (ja) 1992-11-26

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees