JPS60172346U - 樹脂密封型半導体装置 - Google Patents

樹脂密封型半導体装置

Info

Publication number
JPS60172346U
JPS60172346U JP1984059687U JP5968784U JPS60172346U JP S60172346 U JPS60172346 U JP S60172346U JP 1984059687 U JP1984059687 U JP 1984059687U JP 5968784 U JP5968784 U JP 5968784U JP S60172346 U JPS60172346 U JP S60172346U
Authority
JP
Japan
Prior art keywords
resin
heat radiator
semiconductor device
lead wire
semiconductor chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1984059687U
Other languages
English (en)
Inventor
一彦 伊藤
岡村　富雄
石川　才司
Original Assignee
新電元工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 新電元工業株式会社 filed Critical 新電元工業株式会社
Priority to JP1984059687U priority Critical patent/JPS60172346U/ja
Publication of JPS60172346U publication Critical patent/JPS60172346U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図ａ　”　ｄは従来装置の構造図、第２図ａ〜ｄは
本考案の実施例構造図である。図において１は放熱体、
１ａはリード線部、１ｂは端部、１′は立上部、１″は
折曲げ部、１ｃは破断部、１ｄは他端の樹脂成形時の治
具保持部、２は半導体チップ、３はリード線、３ａは接
続線、４は樹脂部、４′は樹脂空隙部、５は螺子穴、５
ａは螺子絶縁用樹脂、６は金属放熱体、７は螺子である
。

Claims (1)

    【実用新案登録請求の範囲】
  1. 板状放熱体と前記放熱体の一端に連なるリード線部と前
    記放熱体に電極部が固着された半導体チップと前記半導
    体チップの他の電極部に接続され前記リード線部とほぼ
    平行に導出され、る他のリード線と前記リード線部の一
    端、半導体チップ及び放熱体を封止する樹脂部よりなる
    半導体装置において前記樹脂部内の前記放熱体の他端に
    被断可能な部分を設けたことを特徴とする樹脂密封型半
    導体装置。
JP1984059687U 1984-04-23 1984-04-23 樹脂密封型半導体装置 Pending JPS60172346U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984059687U JPS60172346U (ja) 1984-04-23 1984-04-23 樹脂密封型半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984059687U JPS60172346U (ja) 1984-04-23 1984-04-23 樹脂密封型半導体装置

Publications (1)

Publication Number Publication Date
JPS60172346U true JPS60172346U (ja) 1985-11-15

Family

ID=30586340

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984059687U Pending JPS60172346U (ja) 1984-04-23 1984-04-23 樹脂密封型半導体装置

Country Status (1)

Country Link
JP (1) JPS60172346U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6156420A (ja) * 1984-07-31 1986-03-22 Sanken Electric Co Ltd 樹脂封止形半導体装置の製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57178352A (en) * 1981-04-28 1982-11-02 Matsushita Electronics Corp Manufacture of resin sealing type semiconductor device and lead frame employed thereon
JPS58143538A (ja) * 1982-02-19 1983-08-26 Matsushita Electronics Corp 樹脂封止形半導体装置の製造方法
JPS60128646A (ja) * 1983-12-16 1985-07-09 Hitachi Ltd 絶縁型パワートランジスタの製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57178352A (en) * 1981-04-28 1982-11-02 Matsushita Electronics Corp Manufacture of resin sealing type semiconductor device and lead frame employed thereon
JPS58143538A (ja) * 1982-02-19 1983-08-26 Matsushita Electronics Corp 樹脂封止形半導体装置の製造方法
JPS60128646A (ja) * 1983-12-16 1985-07-09 Hitachi Ltd 絶縁型パワートランジスタの製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6156420A (ja) * 1984-07-31 1986-03-22 Sanken Electric Co Ltd 樹脂封止形半導体装置の製造方法

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