JPS60172346U - 樹脂密封型半導体装置 - Google Patents
樹脂密封型半導体装置Info
- Publication number
- JPS60172346U JPS60172346U JP1984059687U JP5968784U JPS60172346U JP S60172346 U JPS60172346 U JP S60172346U JP 1984059687 U JP1984059687 U JP 1984059687U JP 5968784 U JP5968784 U JP 5968784U JP S60172346 U JPS60172346 U JP S60172346U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- heat radiator
- semiconductor device
- lead wire
- semiconductor chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
め要約のデータは記録されません。
Description
第1図a ” dは従来装置の構造図、第2図a〜dは
本考案の実施例構造図である。図において1は放熱体、
1aはリード線部、1bは端部、1′は立上部、1″は
折曲げ部、1cは破断部、1dは他端の樹脂成形時の治
具保持部、2は半導体チップ、3はリード線、3aは接
続線、4は樹脂部、4′は樹脂空隙部、5は螺子穴、5
aは螺子絶縁用樹脂、6は金属放熱体、7は螺子である
。
本考案の実施例構造図である。図において1は放熱体、
1aはリード線部、1bは端部、1′は立上部、1″は
折曲げ部、1cは破断部、1dは他端の樹脂成形時の治
具保持部、2は半導体チップ、3はリード線、3aは接
続線、4は樹脂部、4′は樹脂空隙部、5は螺子穴、5
aは螺子絶縁用樹脂、6は金属放熱体、7は螺子である
。
Claims (1)
- 板状放熱体と前記放熱体の一端に連なるリード線部と前
記放熱体に電極部が固着された半導体チップと前記半導
体チップの他の電極部に接続され前記リード線部とほぼ
平行に導出され、る他のリード線と前記リード線部の一
端、半導体チップ及び放熱体を封止する樹脂部よりなる
半導体装置において前記樹脂部内の前記放熱体の他端に
被断可能な部分を設けたことを特徴とする樹脂密封型半
導体装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1984059687U JPS60172346U (ja) | 1984-04-23 | 1984-04-23 | 樹脂密封型半導体装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1984059687U JPS60172346U (ja) | 1984-04-23 | 1984-04-23 | 樹脂密封型半導体装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS60172346U true JPS60172346U (ja) | 1985-11-15 |
Family
ID=30586340
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1984059687U Pending JPS60172346U (ja) | 1984-04-23 | 1984-04-23 | 樹脂密封型半導体装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60172346U (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6156420A (ja) * | 1984-07-31 | 1986-03-22 | Sanken Electric Co Ltd | 樹脂封止形半導体装置の製造方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57178352A (en) * | 1981-04-28 | 1982-11-02 | Matsushita Electronics Corp | Manufacture of resin sealing type semiconductor device and lead frame employed thereon |
JPS58143538A (ja) * | 1982-02-19 | 1983-08-26 | Matsushita Electronics Corp | 樹脂封止形半導体装置の製造方法 |
JPS60128646A (ja) * | 1983-12-16 | 1985-07-09 | Hitachi Ltd | 絶縁型パワートランジスタの製造方法 |
-
1984
- 1984-04-23 JP JP1984059687U patent/JPS60172346U/ja active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57178352A (en) * | 1981-04-28 | 1982-11-02 | Matsushita Electronics Corp | Manufacture of resin sealing type semiconductor device and lead frame employed thereon |
JPS58143538A (ja) * | 1982-02-19 | 1983-08-26 | Matsushita Electronics Corp | 樹脂封止形半導体装置の製造方法 |
JPS60128646A (ja) * | 1983-12-16 | 1985-07-09 | Hitachi Ltd | 絶縁型パワートランジスタの製造方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6156420A (ja) * | 1984-07-31 | 1986-03-22 | Sanken Electric Co Ltd | 樹脂封止形半導体装置の製造方法 |
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