JPH0527261B2 - - Google Patents

Info

Publication number
JPH0527261B2
JPH0527261B2 JP58236154A JP23615483A JPH0527261B2 JP H0527261 B2 JPH0527261 B2 JP H0527261B2 JP 58236154 A JP58236154 A JP 58236154A JP 23615483 A JP23615483 A JP 23615483A JP H0527261 B2 JPH0527261 B2 JP H0527261B2
Authority
JP
Japan
Prior art keywords
guide
resin
lead
header
leads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58236154A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60128646A (ja
Inventor
Masao Yamaguchi
Nobukatsu Tanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP58236154A priority Critical patent/JPS60128646A/ja
Priority to GB08429620A priority patent/GB2151845A/en
Priority to KR1019840007370A priority patent/KR930007518B1/ko
Publication of JPS60128646A publication Critical patent/JPS60128646A/ja
Publication of JPH0527261B2 publication Critical patent/JPH0527261B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W70/481—
    • H10W72/00—
    • H10W72/5363—
    • H10W72/5449—
    • H10W74/00—
    • H10W74/10—
    • H10W90/756—

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP58236154A 1983-12-16 1983-12-16 絶縁型パワートランジスタの製造方法 Granted JPS60128646A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP58236154A JPS60128646A (ja) 1983-12-16 1983-12-16 絶縁型パワートランジスタの製造方法
GB08429620A GB2151845A (en) 1983-12-16 1984-11-23 A semiconductor memory
KR1019840007370A KR930007518B1 (ko) 1983-12-16 1984-11-24 반도체장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58236154A JPS60128646A (ja) 1983-12-16 1983-12-16 絶縁型パワートランジスタの製造方法

Publications (2)

Publication Number Publication Date
JPS60128646A JPS60128646A (ja) 1985-07-09
JPH0527261B2 true JPH0527261B2 (enExample) 1993-04-20

Family

ID=16996560

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58236154A Granted JPS60128646A (ja) 1983-12-16 1983-12-16 絶縁型パワートランジスタの製造方法

Country Status (3)

Country Link
JP (1) JPS60128646A (enExample)
KR (1) KR930007518B1 (enExample)
GB (1) GB2151845A (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60172346U (ja) * 1984-04-23 1985-11-15 新電元工業株式会社 樹脂密封型半導体装置
JPS61207040U (enExample) * 1985-06-17 1986-12-27
JPS62180957U (enExample) * 1986-05-06 1987-11-17
JPH079917B2 (ja) * 1987-05-11 1995-02-01 サンケン電気株式会社 樹脂封止型半導体装置の製造方法
JPH0824156B2 (ja) * 1987-05-25 1996-03-06 サンケン電気株式会社 樹脂封止型半導体装置の製造方法
JPH0744194B2 (ja) * 1989-02-17 1995-05-15 サンケン電気株式会社 樹脂封止形半導体装置の製造方法
US5028741A (en) * 1990-05-24 1991-07-02 Motorola, Inc. High frequency, power semiconductor device
JP3598579B2 (ja) * 1995-04-17 2004-12-08 株式会社デンソー 電磁弁ブロック
US20040113240A1 (en) 2002-10-11 2004-06-17 Wolfgang Hauser An electronic component with a leadframe
JP4953205B2 (ja) * 2007-05-01 2012-06-13 三菱電機株式会社 半導体装置
US11602055B2 (en) 2018-09-04 2023-03-07 Apple Inc. Overmolded components having sub-flush residuals

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS615818Y2 (enExample) * 1979-06-07 1986-02-21
US4451973A (en) * 1981-04-28 1984-06-05 Matsushita Electronics Corporation Method for manufacturing a plastic encapsulated semiconductor device and a lead frame therefor
JPS57188858A (en) * 1981-05-18 1982-11-19 Matsushita Electronics Corp Plastic molded type semiconductor device
JPS58143538A (ja) * 1982-02-19 1983-08-26 Matsushita Electronics Corp 樹脂封止形半導体装置の製造方法

Also Published As

Publication number Publication date
GB8429620D0 (en) 1985-01-03
JPS60128646A (ja) 1985-07-09
KR930007518B1 (ko) 1993-08-12
GB2151845A (en) 1985-07-24
KR850005152A (ko) 1985-08-21

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