JPH0213462B2 - - Google Patents
Info
- Publication number
- JPH0213462B2 JPH0213462B2 JP59224343A JP22434384A JPH0213462B2 JP H0213462 B2 JPH0213462 B2 JP H0213462B2 JP 59224343 A JP59224343 A JP 59224343A JP 22434384 A JP22434384 A JP 22434384A JP H0213462 B2 JPH0213462 B2 JP H0213462B2
- Authority
- JP
- Japan
- Prior art keywords
- support plate
- chip
- resin
- rough surface
- semiconductor chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10W74/01—
-
- H10W72/01515—
-
- H10W72/075—
-
- H10W90/756—
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59224343A JPS61102040A (ja) | 1984-10-25 | 1984-10-25 | 樹脂封止型半導体装置の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59224343A JPS61102040A (ja) | 1984-10-25 | 1984-10-25 | 樹脂封止型半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61102040A JPS61102040A (ja) | 1986-05-20 |
| JPH0213462B2 true JPH0213462B2 (enExample) | 1990-04-04 |
Family
ID=16812269
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59224343A Granted JPS61102040A (ja) | 1984-10-25 | 1984-10-25 | 樹脂封止型半導体装置の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61102040A (enExample) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| IT1252624B (it) * | 1991-12-05 | 1995-06-19 | Cons Ric Microelettronica | Dispositivo semiconduttore incapsulato in resina e elettricamente isolato di migliorate caratteristiche di isolamento,e relativo processo di fabbricazione |
| JP2556250B2 (ja) * | 1993-04-16 | 1996-11-20 | 日本電気株式会社 | 半導体装置 |
| JPH0712634U (ja) * | 1993-08-06 | 1995-03-03 | 日産ディーゼル工業株式会社 | 車両のクラッチ制御装置 |
| JP2009147032A (ja) | 2007-12-13 | 2009-07-02 | Panasonic Corp | 半導体装置および光ピックアップ装置 |
| JP6162643B2 (ja) | 2014-05-21 | 2017-07-12 | 三菱電機株式会社 | 半導体装置 |
| JP6448712B2 (ja) * | 2017-06-15 | 2019-01-09 | 三菱電機株式会社 | 半導体装置 |
| JP7126614B2 (ja) * | 2019-06-06 | 2022-08-26 | 日立Astemo株式会社 | 樹脂成形体及び樹脂成形体の製造方法 |
-
1984
- 1984-10-25 JP JP59224343A patent/JPS61102040A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61102040A (ja) | 1986-05-20 |
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