JPH0244147B2 - - Google Patents

Info

Publication number
JPH0244147B2
JPH0244147B2 JP59217187A JP21718784A JPH0244147B2 JP H0244147 B2 JPH0244147 B2 JP H0244147B2 JP 59217187 A JP59217187 A JP 59217187A JP 21718784 A JP21718784 A JP 21718784A JP H0244147 B2 JPH0244147 B2 JP H0244147B2
Authority
JP
Japan
Prior art keywords
support plate
lead
connection
chip
resin body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59217187A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6195536A (ja
Inventor
Minehide Totokawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanken Electric Co Ltd
Original Assignee
Sanken Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanken Electric Co Ltd filed Critical Sanken Electric Co Ltd
Priority to JP59217187A priority Critical patent/JPS6195536A/ja
Publication of JPS6195536A publication Critical patent/JPS6195536A/ja
Publication of JPH0244147B2 publication Critical patent/JPH0244147B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W74/016—
    • H10W72/0198—
    • H10W72/01515—
    • H10W72/075—
    • H10W72/5449—
    • H10W74/00—
    • H10W74/10—
    • H10W90/756—

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP59217187A 1984-10-16 1984-10-16 樹脂封止型半導体装置の製造方法 Granted JPS6195536A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59217187A JPS6195536A (ja) 1984-10-16 1984-10-16 樹脂封止型半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59217187A JPS6195536A (ja) 1984-10-16 1984-10-16 樹脂封止型半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS6195536A JPS6195536A (ja) 1986-05-14
JPH0244147B2 true JPH0244147B2 (enExample) 1990-10-02

Family

ID=16700224

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59217187A Granted JPS6195536A (ja) 1984-10-16 1984-10-16 樹脂封止型半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS6195536A (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05206365A (ja) * 1992-01-30 1993-08-13 Fuji Electric Co Ltd 半導体装置およびその組立用リードフレーム
JP3073367B2 (ja) * 1993-06-25 2000-08-07 ローム株式会社 樹脂封止型半導体装置
KR200299491Y1 (ko) * 2002-09-02 2003-01-03 코리아옵토 주식회사 표면실장형 발광다이오드
US20040113240A1 (en) * 2002-10-11 2004-06-17 Wolfgang Hauser An electronic component with a leadframe
JP5161688B2 (ja) * 2008-07-30 2013-03-13 オンセミコンダクター・トレーディング・リミテッド 半導体装置および半導体モジュール
DE112017007395T5 (de) * 2017-04-04 2019-12-12 Mitsubishi Electric Corporation Halbleitervorrichtung und Verfahren zum Herstellen derselben

Also Published As

Publication number Publication date
JPS6195536A (ja) 1986-05-14

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees