JPH0210572B2 - - Google Patents

Info

Publication number
JPH0210572B2
JPH0210572B2 JP59122047A JP12204784A JPH0210572B2 JP H0210572 B2 JPH0210572 B2 JP H0210572B2 JP 59122047 A JP59122047 A JP 59122047A JP 12204784 A JP12204784 A JP 12204784A JP H0210572 B2 JPH0210572 B2 JP H0210572B2
Authority
JP
Japan
Prior art keywords
cavity
resin
support plate
mold
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59122047A
Other languages
English (en)
Japanese (ja)
Other versions
JPS612348A (ja
Inventor
Takaaki Yokoyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanken Electric Co Ltd
Original Assignee
Sanken Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanken Electric Co Ltd filed Critical Sanken Electric Co Ltd
Priority to JP59122047A priority Critical patent/JPS612348A/ja
Publication of JPS612348A publication Critical patent/JPS612348A/ja
Publication of JPH0210572B2 publication Critical patent/JPH0210572B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W74/111—
    • H10W72/884—
    • H10W74/10—
    • H10W90/756—

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP59122047A 1984-06-15 1984-06-15 樹脂封止形半導体装置の製造方法 Granted JPS612348A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59122047A JPS612348A (ja) 1984-06-15 1984-06-15 樹脂封止形半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59122047A JPS612348A (ja) 1984-06-15 1984-06-15 樹脂封止形半導体装置の製造方法

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP3036487A Division JPH04211139A (ja) 1991-02-07 1991-02-07 樹脂封止形半導体装置の製造方法
JP3036488A Division JPH04211140A (ja) 1991-02-07 1991-02-07 樹脂封止形半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS612348A JPS612348A (ja) 1986-01-08
JPH0210572B2 true JPH0210572B2 (enExample) 1990-03-08

Family

ID=14826290

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59122047A Granted JPS612348A (ja) 1984-06-15 1984-06-15 樹脂封止形半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS612348A (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6248050A (ja) * 1985-08-28 1987-03-02 Seiei Kosan Kk 半導体デバイス等のパツケ−ジング方法
US5133921A (en) * 1987-12-31 1992-07-28 Sanken Electric Co., Ltd. Method for manufacturing plastic encapsulated electronic semiconductor devices
JPH01179332A (ja) * 1987-12-31 1989-07-17 Sanken Electric Co Ltd 樹脂封止型電子装置の製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58151035A (ja) * 1982-03-04 1983-09-08 Toshiba Corp 半導体装置の製造方法
JPH0210572A (ja) * 1988-06-28 1990-01-16 Mitsubishi Electric Corp 再生装置の制御装置

Also Published As

Publication number Publication date
JPS612348A (ja) 1986-01-08

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees