JPH0213461B2 - - Google Patents

Info

Publication number
JPH0213461B2
JPH0213461B2 JP59207727A JP20772784A JPH0213461B2 JP H0213461 B2 JPH0213461 B2 JP H0213461B2 JP 59207727 A JP59207727 A JP 59207727A JP 20772784 A JP20772784 A JP 20772784A JP H0213461 B2 JPH0213461 B2 JP H0213461B2
Authority
JP
Japan
Prior art keywords
support plate
resin
mold
chip
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59207727A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6185828A (ja
Inventor
Akira Terasaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanken Electric Co Ltd
Original Assignee
Sanken Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanken Electric Co Ltd filed Critical Sanken Electric Co Ltd
Priority to JP59207727A priority Critical patent/JPS6185828A/ja
Publication of JPS6185828A publication Critical patent/JPS6185828A/ja
Publication of JPH0213461B2 publication Critical patent/JPH0213461B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W74/016—
    • H10W72/01515—
    • H10W72/075—
    • H10W72/5449—
    • H10W74/00—
    • H10W74/10—
    • H10W90/756—

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP59207727A 1984-10-03 1984-10-03 樹脂封止型半導体装置の製造方法 Granted JPS6185828A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59207727A JPS6185828A (ja) 1984-10-03 1984-10-03 樹脂封止型半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59207727A JPS6185828A (ja) 1984-10-03 1984-10-03 樹脂封止型半導体装置の製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP1062951A Division JPH0744195B2 (ja) 1989-03-15 1989-03-15 樹脂封止型半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS6185828A JPS6185828A (ja) 1986-05-01
JPH0213461B2 true JPH0213461B2 (enExample) 1990-04-04

Family

ID=16544539

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59207727A Granted JPS6185828A (ja) 1984-10-03 1984-10-03 樹脂封止型半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS6185828A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4549171B2 (ja) * 2004-08-31 2010-09-22 三洋電機株式会社 混成集積回路装置
CN102672141B (zh) * 2012-05-31 2014-02-26 昆山拓安塑料制品有限公司 一种多功能led散热支撑架铝合金压铸模具

Also Published As

Publication number Publication date
JPS6185828A (ja) 1986-05-01

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees