JPH0163136U - - Google Patents
Info
- Publication number
- JPH0163136U JPH0163136U JP15759587U JP15759587U JPH0163136U JP H0163136 U JPH0163136 U JP H0163136U JP 15759587 U JP15759587 U JP 15759587U JP 15759587 U JP15759587 U JP 15759587U JP H0163136 U JPH0163136 U JP H0163136U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- metal reinforcing
- flexible printed
- wire bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002184 metal Substances 0.000 claims description 6
- 230000003014 reinforcing effect Effects 0.000 claims description 5
- 239000004020 conductor Substances 0.000 claims description 4
- 238000007747 plating Methods 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 238000007796 conventional method Methods 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1517—Multilayer substrate
Landscapes
- Structure Of Printed Boards (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15759587U JPH064579Y2 (ja) | 1987-10-15 | 1987-10-15 | フレキシブルプリント配線板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15759587U JPH064579Y2 (ja) | 1987-10-15 | 1987-10-15 | フレキシブルプリント配線板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0163136U true JPH0163136U (US07943777-20110517-C00090.png) | 1989-04-24 |
JPH064579Y2 JPH064579Y2 (ja) | 1994-02-02 |
Family
ID=31437172
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15759587U Expired - Lifetime JPH064579Y2 (ja) | 1987-10-15 | 1987-10-15 | フレキシブルプリント配線板 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH064579Y2 (US07943777-20110517-C00090.png) |
Cited By (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03166787A (ja) * | 1989-11-27 | 1991-07-18 | Hitachi Ltd | 配線基板 |
JPH03239331A (ja) * | 1990-02-16 | 1991-10-24 | Matsushita Electron Corp | 半導体装置の製造方法 |
JPH03128963U (US07943777-20110517-C00090.png) * | 1990-04-06 | 1991-12-25 | ||
JPH10341077A (ja) * | 1997-06-10 | 1998-12-22 | Ngk Spark Plug Co Ltd | 多層プリント配線板 |
JP2001135675A (ja) * | 1999-11-02 | 2001-05-18 | Nitto Denko Corp | フレキシブル配線板 |
JP2003133653A (ja) * | 2001-10-25 | 2003-05-09 | Hitachi Ltd | 配線基板およびそれを用いた半導体装置の実装構造体 |
JP2005183559A (ja) * | 2003-12-18 | 2005-07-07 | Nec Corp | プリント配線板およびその製造方法 |
JP2007019078A (ja) * | 2005-07-05 | 2007-01-25 | Shindo Denshi Kogyo Kk | フレキシブルプリント配線板、プリント回路板、およびフレキシブルプリント配線板の製造方法 |
JP2009166334A (ja) * | 2008-01-15 | 2009-07-30 | Seiko Epson Corp | 液体噴射ヘッド及び液体噴射装置 |
JP2010212375A (ja) * | 2009-03-09 | 2010-09-24 | Denso Corp | Ic搭載基板、プリント配線板、及び製造方法 |
WO2014203586A1 (ja) * | 2013-06-19 | 2014-12-24 | 株式会社フジクラ | 伸縮性基板、回路基板、及び伸縮性基板の製造方法 |
WO2015008671A1 (ja) * | 2013-07-16 | 2015-01-22 | 住友電気工業株式会社 | 電子部品及び電子部品の製造方法 |
JP2015142051A (ja) * | 2014-01-29 | 2015-08-03 | 住友電気工業株式会社 | 電子部品及び電子部品の製造方法 |
CN109427731A (zh) * | 2017-08-22 | 2019-03-05 | 太阳诱电株式会社 | 电路基板 |
CN109429431A (zh) * | 2017-08-22 | 2019-03-05 | 太阳诱电株式会社 | 电路基板 |
JP2019040903A (ja) * | 2017-08-22 | 2019-03-14 | 太陽誘電株式会社 | 回路基板及び半導体モジュール |
US10602608B2 (en) | 2017-08-22 | 2020-03-24 | Taiyo Yuden Co., Ltd. | Circuit board |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5845792B2 (ja) * | 2011-10-07 | 2016-01-20 | 株式会社村田製作所 | 電子部品 |
-
1987
- 1987-10-15 JP JP15759587U patent/JPH064579Y2/ja not_active Expired - Lifetime
Cited By (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03166787A (ja) * | 1989-11-27 | 1991-07-18 | Hitachi Ltd | 配線基板 |
JPH03239331A (ja) * | 1990-02-16 | 1991-10-24 | Matsushita Electron Corp | 半導体装置の製造方法 |
JPH03128963U (US07943777-20110517-C00090.png) * | 1990-04-06 | 1991-12-25 | ||
JPH10341077A (ja) * | 1997-06-10 | 1998-12-22 | Ngk Spark Plug Co Ltd | 多層プリント配線板 |
JP2001135675A (ja) * | 1999-11-02 | 2001-05-18 | Nitto Denko Corp | フレキシブル配線板 |
JP2003133653A (ja) * | 2001-10-25 | 2003-05-09 | Hitachi Ltd | 配線基板およびそれを用いた半導体装置の実装構造体 |
JP2005183559A (ja) * | 2003-12-18 | 2005-07-07 | Nec Corp | プリント配線板およびその製造方法 |
JP2007019078A (ja) * | 2005-07-05 | 2007-01-25 | Shindo Denshi Kogyo Kk | フレキシブルプリント配線板、プリント回路板、およびフレキシブルプリント配線板の製造方法 |
JP2009166334A (ja) * | 2008-01-15 | 2009-07-30 | Seiko Epson Corp | 液体噴射ヘッド及び液体噴射装置 |
JP2010212375A (ja) * | 2009-03-09 | 2010-09-24 | Denso Corp | Ic搭載基板、プリント配線板、及び製造方法 |
WO2014203586A1 (ja) * | 2013-06-19 | 2014-12-24 | 株式会社フジクラ | 伸縮性基板、回路基板、及び伸縮性基板の製造方法 |
WO2015008671A1 (ja) * | 2013-07-16 | 2015-01-22 | 住友電気工業株式会社 | 電子部品及び電子部品の製造方法 |
JP2015142051A (ja) * | 2014-01-29 | 2015-08-03 | 住友電気工業株式会社 | 電子部品及び電子部品の製造方法 |
CN109427731A (zh) * | 2017-08-22 | 2019-03-05 | 太阳诱电株式会社 | 电路基板 |
CN109429431A (zh) * | 2017-08-22 | 2019-03-05 | 太阳诱电株式会社 | 电路基板 |
JP2019040902A (ja) * | 2017-08-22 | 2019-03-14 | 太陽誘電株式会社 | 回路基板 |
JP2019040903A (ja) * | 2017-08-22 | 2019-03-14 | 太陽誘電株式会社 | 回路基板及び半導体モジュール |
JP2019040901A (ja) * | 2017-08-22 | 2019-03-14 | 太陽誘電株式会社 | 回路基板 |
US10499494B2 (en) | 2017-08-22 | 2019-12-03 | Taiyo Yuden Co., Ltd. | Circuit board |
US10602608B2 (en) | 2017-08-22 | 2020-03-24 | Taiyo Yuden Co., Ltd. | Circuit board |
CN109429431B (zh) * | 2017-08-22 | 2021-04-27 | 太阳诱电株式会社 | 电路基板 |
CN109427731B (zh) * | 2017-08-22 | 2021-06-04 | 太阳诱电株式会社 | 电路基板 |
Also Published As
Publication number | Publication date |
---|---|
JPH064579Y2 (ja) | 1994-02-02 |
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