JP2019040901A - 回路基板 - Google Patents
回路基板 Download PDFInfo
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- JP2019040901A JP2019040901A JP2017159301A JP2017159301A JP2019040901A JP 2019040901 A JP2019040901 A JP 2019040901A JP 2017159301 A JP2017159301 A JP 2017159301A JP 2017159301 A JP2017159301 A JP 2017159301A JP 2019040901 A JP2019040901 A JP 2019040901A
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- 229920005989 resin Polymers 0.000 claims abstract description 90
- 239000011347 resin Substances 0.000 claims abstract description 90
- 239000000463 material Substances 0.000 claims abstract description 41
- 229910052751 metal Inorganic materials 0.000 claims abstract description 9
- 239000002184 metal Substances 0.000 claims abstract description 9
- 230000003014 reinforcing effect Effects 0.000 claims description 119
- 239000000758 substrate Substances 0.000 claims description 100
- 238000003384 imaging method Methods 0.000 claims description 8
- 230000002787 reinforcement Effects 0.000 abstract description 11
- 230000005855 radiation Effects 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 107
- 239000011810 insulating material Substances 0.000 description 39
- 230000002093 peripheral effect Effects 0.000 description 19
- 238000000034 method Methods 0.000 description 18
- 230000017525 heat dissipation Effects 0.000 description 10
- 239000011229 interlayer Substances 0.000 description 9
- 239000010949 copper Substances 0.000 description 6
- 239000011162 core material Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000011241 protective layer Substances 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 229920002457 flexible plastic Polymers 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000002985 plastic film Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229920000106 Liquid crystal polymer Polymers 0.000 description 1
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
- H05K1/0281—Reinforcement details thereof
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49838—Geometry or layout
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
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- H01L27/14618—Containers
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
- H05K1/186—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0014—Shaping of the substrate, e.g. by moulding
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14634—Assemblies, i.e. Hybrid structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14636—Interconnect structures
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09036—Recesses or grooves in insulating substrate
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10121—Optical component, e.g. opto-electronic component
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10151—Sensor
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10287—Metal wires as connectors or conductors
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2018—Presence of a frame in a printed circuit or printed circuit assembly
Abstract
Description
上記可撓性配線基材は、厚さ方向に直交する第1の主面および第2の主面を有する第1の端部と、上記第1の端部とは反対側の第2の端部とを有する。
上記補強部は、第1の樹脂層と、第2の樹脂層と、第1の実装面と、第2の実装面と、金属製の板状または枠状の補強部材とを有する。上記第1の樹脂層は、上記第1の端部の上記第1の主面を選択的に被覆する。上記第2の樹脂層は、上記第1の端部の上記第2の主面を選択的に被覆する。上記第1の実装面は、上記第1の樹脂層に設けられ、上記可撓性配線基材に電気的に接続される第1の配線層を有する。上記第2の実装面は、上記第2の樹脂層に設けられ、上記可撓性配線基材に電気的に接続される第2の配線層を有する。上記補強部材は、上記第1の端部に埋設され、上記第2の実装面よりも上記第1の実装面に近づけて配置される。
これにより、補強部材を可撓性配線基材の厚み寸法の範囲内において第1の主面側に近付けて配置することができる。
これにより、補強部材を可撓性配線基材の第1の端部へ容易に埋設することができる。
この場合、補強部材を配線の一部として用いることができる。
これにより、補強部の反りを抑制してリジッド部の平坦度を高めることができる。
補強部材が第1の実装面側に偏って配置されているため、補強部材による撮像素子の放熱性を高めることができる。
図1は、本発明の第1の実施形態に係る回路基板の構成を示す概略平面図である。図2は、図1におけるA−A線方向断面図である。
なお、各図においてX軸、Y軸及びZ軸は、相互に直交する3軸方向を示しており、Z軸方向は、回路基板の厚み方向に相当する。
本実施形態の回路基板100は、第1の基板本体10と、第2の基板本体20とを有する。回路基板100は、典型的には、制御基板30と一体的に構成されるが、制御基板30とは別部品として構成されてもよい。
第1の基板本体10は、第2の基板本体20と制御基板30との間を接続する可撓性配線基材11で構成され、回路基板100においてフレキシブル部を構成する。可撓性配線基材11は、典型的には、X軸方向に長手方向、Y軸方向に幅方向を有し、第1の基板本体10に相当する長手方向の中央部は幅狭に形成される。可撓性配線基材11の長手方向の一端部(第1の端部11a)には補強部12が設けられ、他端部(第2の端部11b)には制御基板30が設けられる。
第2の基板本体20は、可撓性配線基材11の第1の端部11aを選択的に被覆する第1及び第2の樹脂層211,212と、第1及び第2の樹脂層211,212に設けられた回路部22(第1の配線層221、第2の配線層222)と、第1の端部11aに埋設された金属製の補強部材23とを有する補強部12を含む。第2の基板本体20(あるいは補強部12)は、回路基板100においてリジッド部を構成する。
制御基板30は、IC等の集積回路やその周辺部品等が搭載されるメイン基板に相当し、第1の基板本体10を介して第2の基板本体20と電気的に接続される。制御基板30は、典型的には、第2の基板本体20と同等あるいはこれよりも大面積の両面基板で構成される。
続いて、以上のように構成される回路基板100の製造方法について説明する。
図6は、本発明の第2の実施形態に係る回路基板の構成を示す概略側断面図である。以下、第1の実施形態と異なる構成について主に説明し、第1の実施形態と同様の構成については同様の符号を付しその説明を省略または簡略化する。
図7は、本発明の第3の実施形態に係る回路基板の構成を示す概略側断面図である。以下、第1の実施形態と異なる構成について主に説明し、第1の実施形態と同様の構成については同様の符号を付しその説明を省略または簡略化する。
11…可撓性配線基材
12…補強部
20…第2の基板本体
22…回路部
23…補強部材
41…撮像素子
30…制御基板
100,200…回路基板
211…第1の樹脂層
212…第2の樹脂層
213…収容部
233…第3の樹脂層
S11…第1の主面
S12…第2の主面
S21…第1の実装面
S22…第2の実装面
Claims (7)
- 厚さ方向に直交する第1の主面および第2の主面を有する第1の端部と、前記第1の端部とは反対側の第2の端部とを有する可撓性配線基材と、
前記第1の主面を選択的に被覆する第1の樹脂層と、前記第2の主面を選択的に被覆する第2の樹脂層と、前記第1の樹脂層に設けられ前記可撓性配線基材に電気的に接続される第1の配線層を有する第1の実装面と、前記第2の樹脂層に設けられ前記可撓性配線基材に電気的に接続される第2の配線層を有する第2の実装面と、前記第1の端部に埋設され、前記第2の実装面よりも前記第1の実装面に近づけて配置された金属製の板状または枠状の補強部材と、を有する補強部と
を具備する回路基板。 - 請求項1に記載の回路基板であって、
前記補強部材は、前記可撓性配線基材よりも小さい厚みを有する
回路基板。 - 請求項1又は2に記載の回路基板であって、
前記第1の端部は、有底又は無底の凹部を有し、
前記補強部材は、前記凹部に配置される
回路基板。 - 請求項1〜3のいずれか1つに記載の回路基板であって、
前記補強部材は、前記第1の配線層と電気的に接続される
回路基板。 - 請求項1〜4のいずれか1つに記載の回路基板であって、
前記補強部は、前記補強部材と前記第2の樹脂層との間に設けられ前記第2の樹脂層よりも熱膨張係数が小さい樹脂材料で構成された第3の樹脂層をさらに有する
回路基板。 - 請求項1〜5のいずれか1つに記載の回路基板であって、
前記第1の実装面に搭載され、前記第1の配線層と電気的に接続される撮像素子をさらに具備する
回路基板。 - 請求項1〜6のいずれか1つに記載の回路基板であって、
前記第1の端部は、前記第2の実装面よりも前記第1の実装面に近づけて配置される
回路基板。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017159301A JP6745770B2 (ja) | 2017-08-22 | 2017-08-22 | 回路基板 |
US16/107,233 US10602608B2 (en) | 2017-08-22 | 2018-08-21 | Circuit board |
US16/107,214 US10499494B2 (en) | 2017-08-22 | 2018-08-21 | Circuit board |
CN201810959409.4A CN109427731B (zh) | 2017-08-22 | 2018-08-22 | 电路基板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017159301A JP6745770B2 (ja) | 2017-08-22 | 2017-08-22 | 回路基板 |
Publications (2)
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Cited By (1)
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CN111278222A (zh) * | 2020-02-22 | 2020-06-12 | 瑞声科技(沭阳)有限公司 | 补强制作贴合方法 |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
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US10602608B2 (en) * | 2017-08-22 | 2020-03-24 | Taiyo Yuden Co., Ltd. | Circuit board |
JP6745770B2 (ja) | 2017-08-22 | 2020-08-26 | 太陽誘電株式会社 | 回路基板 |
JP6783724B2 (ja) * | 2017-08-22 | 2020-11-11 | 太陽誘電株式会社 | 回路基板 |
KR20210009181A (ko) * | 2019-07-16 | 2021-01-26 | 삼성전기주식회사 | 인쇄회로기판 |
CN112203407A (zh) * | 2019-07-08 | 2021-01-08 | 三星电机株式会社 | 印刷电路板 |
CN114554673B (zh) * | 2020-11-25 | 2024-03-15 | 鹏鼎控股(深圳)股份有限公司 | 柔性电路板及柔性电路板的制作方法 |
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2017
- 2017-08-22 JP JP2017159301A patent/JP6745770B2/ja active Active
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- 2018-08-22 CN CN201810959409.4A patent/CN109427731B/zh not_active Expired - Fee Related
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CN111278222A (zh) * | 2020-02-22 | 2020-06-12 | 瑞声科技(沭阳)有限公司 | 补强制作贴合方法 |
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CN109427731B (zh) | 2021-06-04 |
US20190069398A1 (en) | 2019-02-28 |
US10499494B2 (en) | 2019-12-03 |
CN109427731A (zh) | 2019-03-05 |
JP6745770B2 (ja) | 2020-08-26 |
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