JPH0131690B2 - - Google Patents

Info

Publication number
JPH0131690B2
JPH0131690B2 JP19592281A JP19592281A JPH0131690B2 JP H0131690 B2 JPH0131690 B2 JP H0131690B2 JP 19592281 A JP19592281 A JP 19592281A JP 19592281 A JP19592281 A JP 19592281A JP H0131690 B2 JPH0131690 B2 JP H0131690B2
Authority
JP
Japan
Prior art keywords
electrodes
semiconductor element
connection
conductive paste
external circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP19592281A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5896742A (ja
Inventor
Ryuichi Toyoda
Takeshi Mizutani
Koichi Kawada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP56195922A priority Critical patent/JPS5896742A/ja
Publication of JPS5896742A publication Critical patent/JPS5896742A/ja
Publication of JPH0131690B2 publication Critical patent/JPH0131690B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/093—Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces

Landscapes

  • Led Device Packages (AREA)
  • Led Devices (AREA)
  • Wire Bonding (AREA)
JP56195922A 1981-12-04 1981-12-04 半導体素子の接続方法 Granted JPS5896742A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56195922A JPS5896742A (ja) 1981-12-04 1981-12-04 半導体素子の接続方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56195922A JPS5896742A (ja) 1981-12-04 1981-12-04 半導体素子の接続方法

Publications (2)

Publication Number Publication Date
JPS5896742A JPS5896742A (ja) 1983-06-08
JPH0131690B2 true JPH0131690B2 (enExample) 1989-06-27

Family

ID=16349208

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56195922A Granted JPS5896742A (ja) 1981-12-04 1981-12-04 半導体素子の接続方法

Country Status (1)

Country Link
JP (1) JPS5896742A (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2461658A1 (en) * 2010-12-03 2012-06-06 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO Method and apparatus for assembling electric components on a flexible substrate as well as assembly of an electric component with a flexible substrate

Also Published As

Publication number Publication date
JPS5896742A (ja) 1983-06-08

Similar Documents

Publication Publication Date Title
US6211469B1 (en) Printed circuit substrate with comb-type electrodes capable of improving the reliability of the electrode connections
JPH11219420A (ja) Ｉｃカードモジュール、ｉｃカード及びそれらの製造方法
JPH02500231A (ja) 電子モジユール回路用テープの生産方法とこの方法によつて得られるテープ
JPS63275127A (ja) 半導体チップの実装体
JPH0131690B2 (enExample)
JPS62132331A (ja) 半導体装置の製造方法
JPH04171949A (ja) 半導体装置の製造方法及び半導体装置の製造装置
JPS6279638A (ja) 絶縁材料製の枠の開放部内に懸架されたｉｃを基板上に取付ける方法
JP3352471B2 (ja) フィルムキャリア
JP2879159B2 (ja) 電気的接続部材及び金属バンプの形成方法
JP3021508B2 (ja) 導電突起の形成方法
JP2523641B2 (ja) 半導体装置
JPS61231797A (ja) 小型電子部品取付方法
JP3204090B2 (ja) 半導体チップテスト用コンタクトピン
JP3021509B2 (ja) 導電突起の形成方法
JPH021961A (ja) 半導体装置製造方法
JPS6347262B2 (enExample)
JP3027851B2 (ja) 電気回路部品の接続方法
JP2867547B2 (ja) 導電突起の形成方法
JPS6086853A (ja) 半導体装置の製造方法
JPH01305527A (ja) 半導体装置
JPH11204312A (ja) 複合電子部品およびその製造方法
JPH04162734A (ja) 半導体装置及びその形成方法
JP2609709B2 (ja) 半導体チップの実装方法
JPH0311565A (ja) 電極の接続構造