JPH0131690B2 - - Google Patents
Info
- Publication number
- JPH0131690B2 JPH0131690B2 JP19592281A JP19592281A JPH0131690B2 JP H0131690 B2 JPH0131690 B2 JP H0131690B2 JP 19592281 A JP19592281 A JP 19592281A JP 19592281 A JP19592281 A JP 19592281A JP H0131690 B2 JPH0131690 B2 JP H0131690B2
- Authority
- JP
- Japan
- Prior art keywords
- electrodes
- semiconductor element
- connection
- conductive paste
- external circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10W70/093—
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- H10W70/60—
-
- H10W72/5363—
-
- H10W72/874—
Landscapes
- Wire Bonding (AREA)
- Led Device Packages (AREA)
- Led Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56195922A JPS5896742A (ja) | 1981-12-04 | 1981-12-04 | 半導体素子の接続方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56195922A JPS5896742A (ja) | 1981-12-04 | 1981-12-04 | 半導体素子の接続方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5896742A JPS5896742A (ja) | 1983-06-08 |
| JPH0131690B2 true JPH0131690B2 (enExample) | 1989-06-27 |
Family
ID=16349208
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56195922A Granted JPS5896742A (ja) | 1981-12-04 | 1981-12-04 | 半導体素子の接続方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5896742A (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2461658A1 (en) * | 2010-12-03 | 2012-06-06 | Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO | Method and apparatus for assembling electric components on a flexible substrate as well as assembly of an electric component with a flexible substrate |
-
1981
- 1981-12-04 JP JP56195922A patent/JPS5896742A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5896742A (ja) | 1983-06-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6211469B1 (en) | Printed circuit substrate with comb-type electrodes capable of improving the reliability of the electrode connections | |
| JPH11219420A (ja) | Icカードモジュール、icカード及びそれらの製造方法 | |
| JPH02500231A (ja) | 電子モジユール回路用テープの生産方法とこの方法によつて得られるテープ | |
| JPS63275127A (ja) | 半導体チップの実装体 | |
| JPH0131690B2 (enExample) | ||
| JPS62132331A (ja) | 半導体装置の製造方法 | |
| JPH04171949A (ja) | 半導体装置の製造方法及び半導体装置の製造装置 | |
| JPS6279638A (ja) | 絶縁材料製の枠の開放部内に懸架されたicを基板上に取付ける方法 | |
| JP3352471B2 (ja) | フィルムキャリア | |
| JP2879159B2 (ja) | 電気的接続部材及び金属バンプの形成方法 | |
| JP3021508B2 (ja) | 導電突起の形成方法 | |
| JP2523641B2 (ja) | 半導体装置 | |
| JPS61231797A (ja) | 小型電子部品取付方法 | |
| JP3204090B2 (ja) | 半導体チップテスト用コンタクトピン | |
| JP3021509B2 (ja) | 導電突起の形成方法 | |
| JPH021961A (ja) | 半導体装置製造方法 | |
| JPS6347262B2 (enExample) | ||
| JP3027851B2 (ja) | 電気回路部品の接続方法 | |
| JP2867547B2 (ja) | 導電突起の形成方法 | |
| JPS6086853A (ja) | 半導体装置の製造方法 | |
| JPH01305527A (ja) | 半導体装置 | |
| JPH11204312A (ja) | 複合電子部品およびその製造方法 | |
| JPH04162734A (ja) | 半導体装置及びその形成方法 | |
| JP2609709B2 (ja) | 半導体チップの実装方法 | |
| JPH0311565A (ja) | 電極の接続構造 |