JPS6347262B2 - - Google Patents

Info

Publication number
JPS6347262B2
JPS6347262B2 JP56212872A JP21287281A JPS6347262B2 JP S6347262 B2 JPS6347262 B2 JP S6347262B2 JP 56212872 A JP56212872 A JP 56212872A JP 21287281 A JP21287281 A JP 21287281A JP S6347262 B2 JPS6347262 B2 JP S6347262B2
Authority
JP
Japan
Prior art keywords
electrode
window
external circuit
semiconductor element
photoresist film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56212872A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58116744A (ja
Inventor
Ryuichi Toyoda
Takeshi Mizutani
Koichi Kawada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP56212872A priority Critical patent/JPS58116744A/ja
Publication of JPS58116744A publication Critical patent/JPS58116744A/ja
Publication of JPS6347262B2 publication Critical patent/JPS6347262B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/093—Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces

Landscapes

  • Wire Bonding (AREA)
JP56212872A 1981-12-29 1981-12-29 半導体素子の接続方法 Granted JPS58116744A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56212872A JPS58116744A (ja) 1981-12-29 1981-12-29 半導体素子の接続方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56212872A JPS58116744A (ja) 1981-12-29 1981-12-29 半導体素子の接続方法

Publications (2)

Publication Number Publication Date
JPS58116744A JPS58116744A (ja) 1983-07-12
JPS6347262B2 true JPS6347262B2 (enExample) 1988-09-21

Family

ID=16629666

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56212872A Granted JPS58116744A (ja) 1981-12-29 1981-12-29 半導体素子の接続方法

Country Status (1)

Country Link
JP (1) JPS58116744A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07244006A (ja) * 1994-03-01 1995-09-19 Tiger Mach Seisakusho:Kk ドラム回転式コンクリートミキサーの水分調整用電極装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07244006A (ja) * 1994-03-01 1995-09-19 Tiger Mach Seisakusho:Kk ドラム回転式コンクリートミキサーの水分調整用電極装置

Also Published As

Publication number Publication date
JPS58116744A (ja) 1983-07-12

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