JPH01305548A - 放熱取付け装置 - Google Patents

放熱取付け装置

Info

Publication number
JPH01305548A
JPH01305548A JP63238624A JP23862488A JPH01305548A JP H01305548 A JPH01305548 A JP H01305548A JP 63238624 A JP63238624 A JP 63238624A JP 23862488 A JP23862488 A JP 23862488A JP H01305548 A JPH01305548 A JP H01305548A
Authority
JP
Japan
Prior art keywords
semiconductor device
interface device
plastic layer
flexible plastic
interface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP63238624A
Other languages
English (en)
Japanese (ja)
Inventor
David C Degree
デビッド　シー．デグリー
Herbert J Fick
ハーバード　ジェイ．フィック
Kevin L Hanson
ケビン　エル．ハンソン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bergquist Co Inc
Original Assignee
Bergquist Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bergquist Co Inc filed Critical Bergquist Co Inc
Publication of JPH01305548A publication Critical patent/JPH01305548A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49562—Geometry of the lead-frame for individual devices of subclass H10D
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP63238624A 1988-05-26 1988-09-22 放熱取付け装置 Pending JPH01305548A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US199195 1980-10-21
US19919588A 1988-05-26 1988-05-26

Publications (1)

Publication Number Publication Date
JPH01305548A true JPH01305548A (ja) 1989-12-08

Family

ID=22736595

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63238624A Pending JPH01305548A (ja) 1988-05-26 1988-09-22 放熱取付け装置

Country Status (6)

Country Link
JP (1) JPH01305548A (enrdf_load_stackoverflow)
KR (1) KR890017799A (enrdf_load_stackoverflow)
CA (1) CA1307355C (enrdf_load_stackoverflow)
DE (1) DE3836002A1 (enrdf_load_stackoverflow)
FR (1) FR2632119B1 (enrdf_load_stackoverflow)
GB (1) GB2219133B (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006303485A (ja) * 2005-03-25 2006-11-02 Sumitomo Chemical Co Ltd 固体撮像装置及びその製造方法
WO2012070463A1 (ja) * 2010-11-22 2012-05-31 株式会社東芝 圧接構造用セラミックスヒートシンク材およびそれを用いた半導体モジュール並びに半導体モジュールの製造方法
JP2015012050A (ja) * 2013-06-27 2015-01-19 株式会社リコー 放熱部品、電子機器

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FI88452C (fi) * 1990-03-29 1993-05-10 Nokia Mobile Phones Ltd Konstruktion foer att foerbaettra avkylning av en effekttransistor
DE4037488A1 (de) * 1990-11-24 1992-05-27 Bosch Gmbh Robert Leistungsbausteine mit elektrisch isolierender thermischer ankopplung
DE4105152A1 (de) * 1991-02-20 1992-09-03 Export Contor Aussenhandel Elektronische schaltungsanordnung
DE4108667C2 (de) * 1991-03-16 2000-05-04 Bosch Gmbh Robert Verbundanordnung aus einer metallischen Grundplatte und einer keramischen Leiterplatte sowie Verfahren zu deren Herstellung
DE4237763C2 (de) * 1992-11-09 1996-01-25 Siemens Ag Vorrichtung zur isolierten Befestigung von wärmeerzeugenden Halbleiter-Bauteilen
DE4302917C1 (de) * 1993-02-03 1994-07-07 Bosch Gmbh Robert Anordnung zur Wärmeableitung von auf Leiterplatten montierten Leistungsbauelementen
US5545473A (en) * 1994-02-14 1996-08-13 W. L. Gore & Associates, Inc. Thermally conductive interface
US5591034A (en) * 1994-02-14 1997-01-07 W. L. Gore & Associates, Inc. Thermally conductive adhesive interface
FR2718600B1 (fr) * 1994-04-11 1996-06-14 Sagem Dispositif de bridage de composants électriques de puissance sur un châssis.
DE19506664A1 (de) * 1995-02-25 1996-02-29 Bosch Gmbh Robert Elektrisches Gerät
DE19543920C2 (de) * 1995-11-24 2000-11-16 Eupec Gmbh & Co Kg Leistungshalbleiter-Modul
US5738936A (en) * 1996-06-27 1998-04-14 W. L. Gore & Associates, Inc. Thermally conductive polytetrafluoroethylene article
DE19734110C1 (de) * 1997-08-07 1998-11-19 Bosch Gmbh Robert Elektrisches Gerät mit einer Leiterplatte und Verfahren zum Fügen des Geräts
JPH11186003A (ja) * 1997-12-25 1999-07-09 Yazaki Corp Ｐｔｃ素子の放熱構造
JP4086946B2 (ja) * 1998-01-05 2008-05-14 日東電工株式会社 熱伝導性感圧接着シ―ト類およびこれを用いた電子部品と放熱部材との固定方法
DE19835127A1 (de) * 1998-08-04 2000-02-10 Wuerth Elektronik Gmbh Leiterplatte mit einem Heatsink und Verfahren zum Anbringen eines Heatsink
JP3740117B2 (ja) * 2002-11-13 2006-02-01 三菱電機株式会社 電力用半導体装置
JP4154325B2 (ja) * 2003-12-19 2008-09-24 株式会社日立産機システム 電気回路モジュール
US20070013053A1 (en) * 2005-07-12 2007-01-18 Peter Chou Semiconductor device and method for manufacturing a semiconductor device

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1086003A (en) * 1964-03-13 1967-10-04 Ass Elect Ind Mounting arrangements for electronic devices
GB1265007A (enrdf_load_stackoverflow) * 1968-12-09 1972-03-01
US3846824A (en) * 1973-06-13 1974-11-05 Gen Electric Improved thermally conductive and electrically insulative mounting systems for heat sinks
US4394530A (en) * 1977-09-19 1983-07-19 Kaufman Lance R Power switching device having improved heat dissipation means
EP0002883B1 (en) * 1977-12-23 1981-01-07 International Business Machines Corporation A thermal interface between surfaces of a heat source and heat sink
DE3169519D1 (en) * 1980-06-21 1985-05-02 Lucas Ind Plc Semi-conductor power device assembly and method of manufacture thereof
US4396936A (en) * 1980-12-29 1983-08-02 Honeywell Information Systems, Inc. Integrated circuit chip package with improved cooling means
EP0065686A3 (en) * 1981-05-21 1984-10-10 General Electric Company Power device module
US4654754A (en) * 1982-11-02 1987-03-31 Fairchild Weston Systems, Inc. Thermal link
JPS6028252A (ja) * 1983-07-26 1985-02-13 Toshiba Corp 樹脂封止半導体装置
US4602678A (en) * 1983-09-02 1986-07-29 The Bergquist Company Interfacing of heat sinks with electrical devices, and the like
US4574879A (en) * 1984-02-29 1986-03-11 The Bergquist Company Mounting pad for solid-state devices
US4666545A (en) * 1984-06-27 1987-05-19 The Bergquist Company Method of making a mounting base pad for semiconductor devices
GB8610814D0 (en) * 1986-05-02 1986-06-11 Trw Transport Elect Ltd Adhesive mountings
DE3784906T2 (de) * 1987-01-28 1993-10-07 Unisys Corp Verfahren, das eine elastische Folie benutzt zum Herstellen einer integrierten Schaltungspackung mit Kontaktflecken in einer abgestuften Grube.

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006303485A (ja) * 2005-03-25 2006-11-02 Sumitomo Chemical Co Ltd 固体撮像装置及びその製造方法
WO2012070463A1 (ja) * 2010-11-22 2012-05-31 株式会社東芝 圧接構造用セラミックスヒートシンク材およびそれを用いた半導体モジュール並びに半導体モジュールの製造方法
KR101472234B1 (ko) * 2010-11-22 2014-12-11 가부시끼가이샤 도시바 압접 구조용 세라믹 히트 싱크재, 그를 이용한 반도체 모듈 및 반도체 모듈의 제조 방법
US9057569B2 (en) 2010-11-22 2015-06-16 Kabushiki Kaisha Toshiba Ceramic heat sink material for pressure contact structure and semiconductor module using the same
JP5996435B2 (ja) * 2010-11-22 2016-09-21 株式会社東芝 半導体モジュールおよび半導体モジュールの製造方法
JP2016181715A (ja) * 2010-11-22 2016-10-13 株式会社東芝 圧接構造用セラミックスヒートシンク材およびそれを用いた半導体モジュール
JP2015012050A (ja) * 2013-06-27 2015-01-19 株式会社リコー 放熱部品、電子機器
US9668374B2 (en) 2013-06-27 2017-05-30 Ricoh Company, Ltd. Heat dissipating component and electronic device

Also Published As

Publication number Publication date
DE3836002A1 (de) 1989-11-30
CA1307355C (en) 1992-09-08
GB2219133B (en) 1991-11-20
FR2632119A1 (enrdf_load_stackoverflow) 1989-12-01
GB2219133A (en) 1989-11-29
GB8823716D0 (en) 1988-11-16
FR2632119B1 (enrdf_load_stackoverflow) 1994-09-02
KR890017799A (ko) 1989-12-18

Similar Documents

Publication Publication Date Title
JPH01305548A (ja) 放熱取付け装置
TW549011B (en) Dissipation of heat from a circuit board having bare silicon chips mounted thereon
EP0987757B1 (en) Heat dissipator for electronic device
US6896045B2 (en) Structure and method of attaching a heat transfer part having a compressible interface
US7875807B2 (en) Elastic conductive resin, and electronic device including elastic conductive bumps made of the elastic conductive resin
JP3498823B2 (ja) 放熱スペーサーおよびその用途
US20040226707A1 (en) Method of manufacturing an elastomeric heat sink with a pressure sensitive adhesive backing
US20070254137A1 (en) Thermally Conducting Multi-Layer Film
JPH10242354A (ja) 熱伝導部材およびそれを用いた電子装置
JP2003198166A (ja) 発熱電子部品の冷却方法及びそれに用いる熱伝導性シート
EP0805618B1 (en) Heat dissipating spacer for electronic equipments
JP2012159463A (ja) 感圧センサ体
KR101991951B1 (ko) 열 전도 부재
KR101895573B1 (ko) 복합 열전 부재
JP2000101005A (ja) 放熱材
JP2504057B2 (ja) 導電性粒子
RU2189635C2 (ru) Модуль карточки с интегральными схемами
JPS62234804A (ja) 異方導電フイルム
JP3092699B2 (ja) 放熱スペーサーとその用途およびシリコーン組成物
JP2000211055A (ja) 導電性と熱伝導性を備えたシ―ト
HK148995A (en) Hot-press head for connection of electrodes
JP3791053B2 (ja) 導電性接着剤及び電子部品搭載装置
JP5395544B2 (ja) 機能性成形体および機能性成形体の製造方法
JPS63245484A (ja) 接着剤組成物
JP4251905B2 (ja) 導電性基材