DE3836002A1 - Unterlagschicht mit weicher oberflaeche fuer halbleiterbauteile - Google Patents
Unterlagschicht mit weicher oberflaeche fuer halbleiterbauteileInfo
- Publication number
- DE3836002A1 DE3836002A1 DE3836002A DE3836002A DE3836002A1 DE 3836002 A1 DE3836002 A1 DE 3836002A1 DE 3836002 A DE3836002 A DE 3836002A DE 3836002 A DE3836002 A DE 3836002A DE 3836002 A1 DE3836002 A1 DE 3836002A1
- Authority
- DE
- Germany
- Prior art keywords
- layer
- semiconductor device
- soft
- interface device
- encapsulated semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 42
- 239000004033 plastic Substances 0.000 claims abstract description 12
- 229920003023 plastic Polymers 0.000 claims abstract description 12
- 229920002379 silicone rubber Polymers 0.000 claims abstract description 9
- 239000004945 silicone rubber Substances 0.000 claims abstract description 9
- 229910052582 BN Inorganic materials 0.000 claims abstract description 7
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000000853 adhesive Substances 0.000 claims abstract description 6
- 230000001070 adhesive effect Effects 0.000 claims abstract description 6
- 229920003002 synthetic resin Polymers 0.000 claims abstract description 6
- 239000000057 synthetic resin Substances 0.000 claims abstract description 6
- 239000003822 epoxy resin Substances 0.000 claims abstract description 5
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 5
- 229920000728 polyester Polymers 0.000 claims abstract description 5
- 239000004814 polyurethane Substances 0.000 claims abstract description 5
- 239000013528 metallic particle Substances 0.000 claims abstract description 3
- 239000007787 solid Substances 0.000 claims description 6
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 5
- 239000000203 mixture Substances 0.000 claims description 4
- 229920002635 polyurethane Polymers 0.000 claims description 4
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 241001676573 Minium Species 0.000 claims 1
- 239000004744 fabric Substances 0.000 claims 1
- 239000002245 particle Substances 0.000 claims 1
- 229910017083 AlN Inorganic materials 0.000 abstract 1
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 abstract 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 26
- 239000000463 material Substances 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 2
- 239000002313 adhesive film Substances 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000002775 capsule Substances 0.000 description 1
- 239000011529 conductive interlayer Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000006735 deficit Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 239000012120 mounting media Substances 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49562—Geometry of the lead-frame for individual devices of subclass H10D
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE8817206U DE8817206U1 (de) | 1988-05-26 | 1988-10-21 | Unterlagschicht mit weicher Oberfläche für Halbleiterbauteile |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US19919588A | 1988-05-26 | 1988-05-26 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE3836002A1 true DE3836002A1 (de) | 1989-11-30 |
Family
ID=22736595
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE3836002A Ceased DE3836002A1 (de) | 1988-05-26 | 1988-10-21 | Unterlagschicht mit weicher oberflaeche fuer halbleiterbauteile |
Country Status (6)
Country | Link |
---|---|
JP (1) | JPH01305548A (enrdf_load_stackoverflow) |
KR (1) | KR890017799A (enrdf_load_stackoverflow) |
CA (1) | CA1307355C (enrdf_load_stackoverflow) |
DE (1) | DE3836002A1 (enrdf_load_stackoverflow) |
FR (1) | FR2632119B1 (enrdf_load_stackoverflow) |
GB (1) | GB2219133B (enrdf_load_stackoverflow) |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4037488A1 (de) * | 1990-11-24 | 1992-05-27 | Bosch Gmbh Robert | Leistungsbausteine mit elektrisch isolierender thermischer ankopplung |
DE4105152A1 (de) * | 1991-02-20 | 1992-09-03 | Export Contor Aussenhandel | Elektronische schaltungsanordnung |
DE4237763A1 (de) * | 1992-11-09 | 1994-05-11 | Siemens Ag | Vorrichtung zur isolierten Befestigung von wärmeerzeugenden Halbleiter-Bauteilen |
DE4302917C1 (de) * | 1993-02-03 | 1994-07-07 | Bosch Gmbh Robert | Anordnung zur Wärmeableitung von auf Leiterplatten montierten Leistungsbauelementen |
FR2718600A1 (fr) * | 1994-04-11 | 1995-10-13 | Sagem | Dispositif de bridage de composants électriques de puissance sur un châssis. |
DE19506664A1 (de) * | 1995-02-25 | 1996-02-29 | Bosch Gmbh Robert | Elektrisches Gerät |
DE19543920A1 (de) * | 1995-11-24 | 1997-05-28 | Eupec Gmbh & Co Kg | Leistungshalbleiter-Modul |
DE19734110C1 (de) * | 1997-08-07 | 1998-11-19 | Bosch Gmbh Robert | Elektrisches Gerät mit einer Leiterplatte und Verfahren zum Fügen des Geräts |
DE19835127A1 (de) * | 1998-08-04 | 2000-02-10 | Wuerth Elektronik Gmbh | Leiterplatte mit einem Heatsink und Verfahren zum Anbringen eines Heatsink |
DE4108667C2 (de) * | 1991-03-16 | 2000-05-04 | Bosch Gmbh Robert | Verbundanordnung aus einer metallischen Grundplatte und einer keramischen Leiterplatte sowie Verfahren zu deren Herstellung |
DE19860322B4 (de) * | 1997-12-25 | 2005-06-02 | Yazaki Corp. | Anordnung zur Abführung von in einem PTC-Element entstehender Wärme |
DE10331335B4 (de) * | 2002-11-13 | 2008-10-16 | Mitsubishi Denki K.K. | Leistungs-Halbleitervorrichtung |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FI88452C (fi) * | 1990-03-29 | 1993-05-10 | Nokia Mobile Phones Ltd | Konstruktion foer att foerbaettra avkylning av en effekttransistor |
US5545473A (en) * | 1994-02-14 | 1996-08-13 | W. L. Gore & Associates, Inc. | Thermally conductive interface |
US5591034A (en) * | 1994-02-14 | 1997-01-07 | W. L. Gore & Associates, Inc. | Thermally conductive adhesive interface |
US5738936A (en) * | 1996-06-27 | 1998-04-14 | W. L. Gore & Associates, Inc. | Thermally conductive polytetrafluoroethylene article |
JP4086946B2 (ja) * | 1998-01-05 | 2008-05-14 | 日東電工株式会社 | 熱伝導性感圧接着シ―ト類およびこれを用いた電子部品と放熱部材との固定方法 |
JP4154325B2 (ja) * | 2003-12-19 | 2008-09-24 | 株式会社日立産機システム | 電気回路モジュール |
JP4976718B2 (ja) * | 2005-03-25 | 2012-07-18 | 住友化学株式会社 | 固体撮像装置及びその製造方法 |
US20070013053A1 (en) * | 2005-07-12 | 2007-01-18 | Peter Chou | Semiconductor device and method for manufacturing a semiconductor device |
KR101472234B1 (ko) * | 2010-11-22 | 2014-12-11 | 가부시끼가이샤 도시바 | 압접 구조용 세라믹 히트 싱크재, 그를 이용한 반도체 모듈 및 반도체 모듈의 제조 방법 |
JP6315229B2 (ja) | 2013-06-27 | 2018-04-25 | 株式会社リコー | 放熱部品、電子機器 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1086003A (en) * | 1964-03-13 | 1967-10-04 | Ass Elect Ind | Mounting arrangements for electronic devices |
DE2840514A1 (de) * | 1977-09-19 | 1979-03-22 | Gentron Corp | Leistungssteuergeraet und verfahren zum anbringen desselben |
EP0042693A2 (en) * | 1980-06-21 | 1981-12-30 | LUCAS INDUSTRIES public limited company | Semi-conductor power device assembly and method of manufacture thereof |
DE3446047A1 (de) * | 1984-02-29 | 1985-09-05 | The Bergquist Co., Minneapolis, Minn. | Montageunterlage fuer festkoerpereinrichtungen |
GB2196472A (en) * | 1986-05-02 | 1988-04-27 | Trw Transport Elect Ltd | Improvements relating to adhesive mountings |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1265007A (enrdf_load_stackoverflow) * | 1968-12-09 | 1972-03-01 | ||
US3846824A (en) * | 1973-06-13 | 1974-11-05 | Gen Electric | Improved thermally conductive and electrically insulative mounting systems for heat sinks |
EP0002883B1 (en) * | 1977-12-23 | 1981-01-07 | International Business Machines Corporation | A thermal interface between surfaces of a heat source and heat sink |
US4396936A (en) * | 1980-12-29 | 1983-08-02 | Honeywell Information Systems, Inc. | Integrated circuit chip package with improved cooling means |
EP0065686A3 (en) * | 1981-05-21 | 1984-10-10 | General Electric Company | Power device module |
US4654754A (en) * | 1982-11-02 | 1987-03-31 | Fairchild Weston Systems, Inc. | Thermal link |
JPS6028252A (ja) * | 1983-07-26 | 1985-02-13 | Toshiba Corp | 樹脂封止半導体装置 |
US4602678A (en) * | 1983-09-02 | 1986-07-29 | The Bergquist Company | Interfacing of heat sinks with electrical devices, and the like |
US4666545A (en) * | 1984-06-27 | 1987-05-19 | The Bergquist Company | Method of making a mounting base pad for semiconductor devices |
DE3784906T2 (de) * | 1987-01-28 | 1993-10-07 | Unisys Corp | Verfahren, das eine elastische Folie benutzt zum Herstellen einer integrierten Schaltungspackung mit Kontaktflecken in einer abgestuften Grube. |
-
1988
- 1988-09-02 CA CA000576364A patent/CA1307355C/en not_active Expired - Fee Related
- 1988-09-21 KR KR1019880012188A patent/KR890017799A/ko not_active Ceased
- 1988-09-22 JP JP63238624A patent/JPH01305548A/ja active Pending
- 1988-10-05 FR FR888813027A patent/FR2632119B1/fr not_active Expired - Fee Related
- 1988-10-10 GB GB8823716A patent/GB2219133B/en not_active Expired - Lifetime
- 1988-10-21 DE DE3836002A patent/DE3836002A1/de not_active Ceased
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1086003A (en) * | 1964-03-13 | 1967-10-04 | Ass Elect Ind | Mounting arrangements for electronic devices |
DE2840514A1 (de) * | 1977-09-19 | 1979-03-22 | Gentron Corp | Leistungssteuergeraet und verfahren zum anbringen desselben |
EP0042693A2 (en) * | 1980-06-21 | 1981-12-30 | LUCAS INDUSTRIES public limited company | Semi-conductor power device assembly and method of manufacture thereof |
DE3446047A1 (de) * | 1984-02-29 | 1985-09-05 | The Bergquist Co., Minneapolis, Minn. | Montageunterlage fuer festkoerpereinrichtungen |
GB2196472A (en) * | 1986-05-02 | 1988-04-27 | Trw Transport Elect Ltd | Improvements relating to adhesive mountings |
Non-Patent Citations (7)
Title |
---|
Elektronik Produktion & Prüftechnik, 1985, S. 718 * |
Fachkunde für metallverarbeitende Berufe, 42. Aufl., Wuppertal: Verlag Europa-Lehrmittel, 1985, S. 111 * |
IBM Technical Disclosure Bulletin, 1981, Vol. 24, Nr. 6, S. 2966 * |
IBM Technical Disclosure Bulletin, 1981, Vol. 24, Nr. 7A, S. 3530 * |
IBM Technical Disclosure Bulletin, 1983, Vol. 25, Nr. 10, S. 5322 * |
SAECHTLING, Hansjürgen: Kunststoff Taschenbuch, 23. Ausgabe, München, Wien: Hanser-Verlag, 1986, S. 303,494-495 * |
Western Electric, Technical Digest, Okt. 1979, Nr. 56, S. 13 * |
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4037488A1 (de) * | 1990-11-24 | 1992-05-27 | Bosch Gmbh Robert | Leistungsbausteine mit elektrisch isolierender thermischer ankopplung |
DE4105152A1 (de) * | 1991-02-20 | 1992-09-03 | Export Contor Aussenhandel | Elektronische schaltungsanordnung |
DE4108667C2 (de) * | 1991-03-16 | 2000-05-04 | Bosch Gmbh Robert | Verbundanordnung aus einer metallischen Grundplatte und einer keramischen Leiterplatte sowie Verfahren zu deren Herstellung |
DE4237763A1 (de) * | 1992-11-09 | 1994-05-11 | Siemens Ag | Vorrichtung zur isolierten Befestigung von wärmeerzeugenden Halbleiter-Bauteilen |
DE4302917C1 (de) * | 1993-02-03 | 1994-07-07 | Bosch Gmbh Robert | Anordnung zur Wärmeableitung von auf Leiterplatten montierten Leistungsbauelementen |
FR2718600A1 (fr) * | 1994-04-11 | 1995-10-13 | Sagem | Dispositif de bridage de composants électriques de puissance sur un châssis. |
DE19506664A1 (de) * | 1995-02-25 | 1996-02-29 | Bosch Gmbh Robert | Elektrisches Gerät |
DE19543920A1 (de) * | 1995-11-24 | 1997-05-28 | Eupec Gmbh & Co Kg | Leistungshalbleiter-Modul |
DE19543920C2 (de) * | 1995-11-24 | 2000-11-16 | Eupec Gmbh & Co Kg | Leistungshalbleiter-Modul |
DE19734110C1 (de) * | 1997-08-07 | 1998-11-19 | Bosch Gmbh Robert | Elektrisches Gerät mit einer Leiterplatte und Verfahren zum Fügen des Geräts |
DE19860322B4 (de) * | 1997-12-25 | 2005-06-02 | Yazaki Corp. | Anordnung zur Abführung von in einem PTC-Element entstehender Wärme |
DE19835127A1 (de) * | 1998-08-04 | 2000-02-10 | Wuerth Elektronik Gmbh | Leiterplatte mit einem Heatsink und Verfahren zum Anbringen eines Heatsink |
DE10331335B4 (de) * | 2002-11-13 | 2008-10-16 | Mitsubishi Denki K.K. | Leistungs-Halbleitervorrichtung |
DE10331335C5 (de) * | 2002-11-13 | 2014-11-20 | Mitsubishi Denki K.K. | Leistungs-Halbleitervorrichtung |
Also Published As
Publication number | Publication date |
---|---|
CA1307355C (en) | 1992-09-08 |
GB2219133B (en) | 1991-11-20 |
JPH01305548A (ja) | 1989-12-08 |
FR2632119A1 (enrdf_load_stackoverflow) | 1989-12-01 |
GB2219133A (en) | 1989-11-29 |
GB8823716D0 (en) | 1988-11-16 |
FR2632119B1 (enrdf_load_stackoverflow) | 1994-09-02 |
KR890017799A (ko) | 1989-12-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8110 | Request for examination paragraph 44 | ||
8131 | Rejection |