FR2632119A1 - - Google Patents

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Publication number
FR2632119A1
FR2632119A1 FR8813027A FR8813027A FR2632119A1 FR 2632119 A1 FR2632119 A1 FR 2632119A1 FR 8813027 A FR8813027 A FR 8813027A FR 8813027 A FR8813027 A FR 8813027A FR 2632119 A1 FR2632119 A1 FR 2632119A1
Authority
FR
France
Prior art keywords
semiconductor device
interface element
layer
malleable
flexible
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR8813027A
Other languages
English (en)
French (fr)
Other versions
FR2632119B1 (enrdf_load_stackoverflow
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bergquist Co Inc
Original Assignee
Bergquist Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bergquist Co Inc filed Critical Bergquist Co Inc
Publication of FR2632119A1 publication Critical patent/FR2632119A1/fr
Application granted granted Critical
Publication of FR2632119B1 publication Critical patent/FR2632119B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49562—Geometry of the lead-frame for individual devices of subclass H10D
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
FR888813027A 1988-05-26 1988-10-05 Expired - Fee Related FR2632119B1 (enrdf_load_stackoverflow)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US19919588A 1988-05-26 1988-05-26

Publications (2)

Publication Number Publication Date
FR2632119A1 true FR2632119A1 (enrdf_load_stackoverflow) 1989-12-01
FR2632119B1 FR2632119B1 (enrdf_load_stackoverflow) 1994-09-02

Family

ID=22736595

Family Applications (1)

Application Number Title Priority Date Filing Date
FR888813027A Expired - Fee Related FR2632119B1 (enrdf_load_stackoverflow) 1988-05-26 1988-10-05

Country Status (6)

Country Link
JP (1) JPH01305548A (enrdf_load_stackoverflow)
KR (1) KR890017799A (enrdf_load_stackoverflow)
CA (1) CA1307355C (enrdf_load_stackoverflow)
DE (1) DE3836002A1 (enrdf_load_stackoverflow)
FR (1) FR2632119B1 (enrdf_load_stackoverflow)
GB (1) GB2219133B (enrdf_load_stackoverflow)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FI88452C (fi) * 1990-03-29 1993-05-10 Nokia Mobile Phones Ltd Konstruktion foer att foerbaettra avkylning av en effekttransistor
DE4037488A1 (de) * 1990-11-24 1992-05-27 Bosch Gmbh Robert Leistungsbausteine mit elektrisch isolierender thermischer ankopplung
DE4105152A1 (de) * 1991-02-20 1992-09-03 Export Contor Aussenhandel Elektronische schaltungsanordnung
DE4108667C2 (de) * 1991-03-16 2000-05-04 Bosch Gmbh Robert Verbundanordnung aus einer metallischen Grundplatte und einer keramischen Leiterplatte sowie Verfahren zu deren Herstellung
DE4237763C2 (de) * 1992-11-09 1996-01-25 Siemens Ag Vorrichtung zur isolierten Befestigung von wärmeerzeugenden Halbleiter-Bauteilen
DE4302917C1 (de) * 1993-02-03 1994-07-07 Bosch Gmbh Robert Anordnung zur Wärmeableitung von auf Leiterplatten montierten Leistungsbauelementen
US5545473A (en) * 1994-02-14 1996-08-13 W. L. Gore & Associates, Inc. Thermally conductive interface
US5591034A (en) * 1994-02-14 1997-01-07 W. L. Gore & Associates, Inc. Thermally conductive adhesive interface
FR2718600B1 (fr) * 1994-04-11 1996-06-14 Sagem Dispositif de bridage de composants électriques de puissance sur un châssis.
DE19506664A1 (de) * 1995-02-25 1996-02-29 Bosch Gmbh Robert Elektrisches Gerät
DE19543920C2 (de) * 1995-11-24 2000-11-16 Eupec Gmbh & Co Kg Leistungshalbleiter-Modul
US5738936A (en) * 1996-06-27 1998-04-14 W. L. Gore & Associates, Inc. Thermally conductive polytetrafluoroethylene article
DE19734110C1 (de) * 1997-08-07 1998-11-19 Bosch Gmbh Robert Elektrisches Gerät mit einer Leiterplatte und Verfahren zum Fügen des Geräts
JPH11186003A (ja) * 1997-12-25 1999-07-09 Yazaki Corp Ｐｔｃ素子の放熱構造
JP4086946B2 (ja) * 1998-01-05 2008-05-14 日東電工株式会社 熱伝導性感圧接着シ―ト類およびこれを用いた電子部品と放熱部材との固定方法
DE19835127A1 (de) * 1998-08-04 2000-02-10 Wuerth Elektronik Gmbh Leiterplatte mit einem Heatsink und Verfahren zum Anbringen eines Heatsink
JP3740117B2 (ja) * 2002-11-13 2006-02-01 三菱電機株式会社 電力用半導体装置
JP4154325B2 (ja) * 2003-12-19 2008-09-24 株式会社日立産機システム 電気回路モジュール
JP4976718B2 (ja) * 2005-03-25 2012-07-18 住友化学株式会社 固体撮像装置及びその製造方法
US20070013053A1 (en) * 2005-07-12 2007-01-18 Peter Chou Semiconductor device and method for manufacturing a semiconductor device
KR101472234B1 (ko) * 2010-11-22 2014-12-11 가부시끼가이샤 도시바 압접 구조용 세라믹 히트 싱크재, 그를 이용한 반도체 모듈 및 반도체 모듈의 제조 방법
JP6315229B2 (ja) 2013-06-27 2018-04-25 株式会社リコー 放熱部品、電子機器

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0002883A1 (en) * 1977-12-23 1979-07-11 International Business Machines Corporation A thermal interface between surfaces of a heat source and heat sink
JPS6028252A (ja) * 1983-07-26 1985-02-13 Toshiba Corp 樹脂封止半導体装置
US4602678A (en) * 1983-09-02 1986-07-29 The Bergquist Company Interfacing of heat sinks with electrical devices, and the like
US4654754A (en) * 1982-11-02 1987-03-31 Fairchild Weston Systems, Inc. Thermal link
US4666545A (en) * 1984-06-27 1987-05-19 The Bergquist Company Method of making a mounting base pad for semiconductor devices
EP0276345A1 (en) * 1987-01-28 1988-08-03 Unisys Corporation Elastic bladder method of fabricating an integrated circuit package having bonding pads in a stepped cavity

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1086003A (en) * 1964-03-13 1967-10-04 Ass Elect Ind Mounting arrangements for electronic devices
GB1265007A (enrdf_load_stackoverflow) * 1968-12-09 1972-03-01
US3846824A (en) * 1973-06-13 1974-11-05 Gen Electric Improved thermally conductive and electrically insulative mounting systems for heat sinks
US4394530A (en) * 1977-09-19 1983-07-19 Kaufman Lance R Power switching device having improved heat dissipation means
DE3169519D1 (en) * 1980-06-21 1985-05-02 Lucas Ind Plc Semi-conductor power device assembly and method of manufacture thereof
US4396936A (en) * 1980-12-29 1983-08-02 Honeywell Information Systems, Inc. Integrated circuit chip package with improved cooling means
EP0065686A3 (en) * 1981-05-21 1984-10-10 General Electric Company Power device module
US4574879A (en) * 1984-02-29 1986-03-11 The Bergquist Company Mounting pad for solid-state devices
GB8610814D0 (en) * 1986-05-02 1986-06-11 Trw Transport Elect Ltd Adhesive mountings

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0002883A1 (en) * 1977-12-23 1979-07-11 International Business Machines Corporation A thermal interface between surfaces of a heat source and heat sink
US4654754A (en) * 1982-11-02 1987-03-31 Fairchild Weston Systems, Inc. Thermal link
JPS6028252A (ja) * 1983-07-26 1985-02-13 Toshiba Corp 樹脂封止半導体装置
US4602678A (en) * 1983-09-02 1986-07-29 The Bergquist Company Interfacing of heat sinks with electrical devices, and the like
US4666545A (en) * 1984-06-27 1987-05-19 The Bergquist Company Method of making a mounting base pad for semiconductor devices
EP0276345A1 (en) * 1987-01-28 1988-08-03 Unisys Corporation Elastic bladder method of fabricating an integrated circuit package having bonding pads in a stepped cavity

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN, vol. 9, no. 147 (E-323), 21 june 1985; & JP-A-60 28 252 (TOSHIBA K.K.) 13-02-1985 *

Also Published As

Publication number Publication date
DE3836002A1 (de) 1989-11-30
CA1307355C (en) 1992-09-08
GB2219133B (en) 1991-11-20
JPH01305548A (ja) 1989-12-08
GB2219133A (en) 1989-11-29
GB8823716D0 (en) 1988-11-16
FR2632119B1 (enrdf_load_stackoverflow) 1994-09-02
KR890017799A (ko) 1989-12-18

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Legal Events

Date Code Title Description
ER Errata listed in the french official journal (bopi)

Free format text: 48/89

ST Notification of lapse