HK148995A - Hot-press head for connection of electrodes - Google Patents

Hot-press head for connection of electrodes

Info

Publication number
HK148995A
HK148995A HK148995A HK148995A HK148995A HK 148995 A HK148995 A HK 148995A HK 148995 A HK148995 A HK 148995A HK 148995 A HK148995 A HK 148995A HK 148995 A HK148995 A HK 148995A
Authority
HK
Hong Kong
Prior art keywords
electrodes
hot
connection
press head
press
Prior art date
Application number
HK148995A
Inventor
Toshiyuki Kawaguchi
Original Assignee
Shinetsu Polymer Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Polymer Co filed Critical Shinetsu Polymer Co
Publication of HK148995A publication Critical patent/HK148995A/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B30PRESSES
    • B30BPRESSES IN GENERAL
    • B30B15/00Details of, or accessories for, presses; Auxiliary measures in connection with pressing
    • B30B15/06Platens or press rams
    • B30B15/062Press plates
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494Heating methods for reflowing of solder
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/36Assembling printed circuits with other printed circuits
    • H05K3/361Assembling flexible printed circuits with other printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Resistance Heating (AREA)
HK148995A 1988-05-24 1995-09-21 Hot-press head for connection of electrodes HK148995A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988068285U JPH055675Y2 (en) 1988-05-24 1988-05-24

Publications (1)

Publication Number Publication Date
HK148995A true HK148995A (en) 1995-09-29

Family

ID=13369341

Family Applications (1)

Application Number Title Priority Date Filing Date
HK148995A HK148995A (en) 1988-05-24 1995-09-21 Hot-press head for connection of electrodes

Country Status (4)

Country Link
JP (1) JPH055675Y2 (en)
KR (1) KR950008482B1 (en)
GB (1) GB2218932B (en)
HK (1) HK148995A (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3233195B2 (en) * 1996-07-02 2001-11-26 信越ポリマー株式会社 Semiconductor element inspection socket
DE10352754B3 (en) * 2003-11-12 2005-06-30 Bachmann Kunststoff Technologien Gmbh Hot-pressing device with a press plate and at least one elastic coating
JP2009188114A (en) * 2008-02-05 2009-08-20 Three M Innovative Properties Co Method of connection of flexible printed circuit board and electronic device obtained thereby
CN101870179B (en) * 2010-05-26 2012-01-25 太原重工股份有限公司 Constant-temperature pressure head of carbon and electrode press
CN103200780A (en) * 2012-01-09 2013-07-10 苏州世鼎电子有限公司 Hot-pressing fit method of copper foil line and cover body substrate
EP3321982B1 (en) * 2013-03-28 2022-10-26 Nichia Corporation Light-emitting device, production method therefor, and device using light-emitting device
CN103538126A (en) * 2013-10-22 2014-01-29 昆山市联昆热压板有限公司 Improved hot-press plate

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB565998A (en) * 1943-06-03 1944-12-07 British Tyre & Rubber Company Improvements in or relating to press tools
US3664902A (en) * 1970-01-09 1972-05-23 Bell Telephone Labor Inc Nonuniform pressure bonding method
JPS63114087A (en) * 1986-10-29 1988-05-18 松下電器産業株式会社 Thermocompression bonding

Also Published As

Publication number Publication date
JPH055675Y2 (en) 1993-02-15
KR950008482B1 (en) 1995-07-31
GB2218932B (en) 1992-10-28
GB8910827D0 (en) 1989-06-28
KR890017073A (en) 1989-12-15
JPH01170981U (en) 1989-12-04
GB2218932A (en) 1989-11-29

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Legal Events

Date Code Title Description
PF Patent in force
PE Patent expired

Effective date: 20090510