JPH0129060B2 - - Google Patents

Info

Publication number
JPH0129060B2
JPH0129060B2 JP57136948A JP13694882A JPH0129060B2 JP H0129060 B2 JPH0129060 B2 JP H0129060B2 JP 57136948 A JP57136948 A JP 57136948A JP 13694882 A JP13694882 A JP 13694882A JP H0129060 B2 JPH0129060 B2 JP H0129060B2
Authority
JP
Japan
Prior art keywords
chip
gnd
pad
ground
pads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57136948A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5927539A (ja
Inventor
Osamu Sugano
Masatoshi Oota
Yasuhiko Takamatsu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ricoh Co Ltd
Original Assignee
Ricoh Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ricoh Co Ltd filed Critical Ricoh Co Ltd
Priority to JP13694882A priority Critical patent/JPS5927539A/ja
Publication of JPS5927539A publication Critical patent/JPS5927539A/ja
Publication of JPH0129060B2 publication Critical patent/JPH0129060B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Wire Bonding (AREA)
JP13694882A 1982-08-05 1982-08-05 サーマルヘッド用ｉｃチップのパッド配列方法 Granted JPS5927539A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13694882A JPS5927539A (ja) 1982-08-05 1982-08-05 サーマルヘッド用ｉｃチップのパッド配列方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13694882A JPS5927539A (ja) 1982-08-05 1982-08-05 サーマルヘッド用ｉｃチップのパッド配列方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP30017490A Division JPH03175060A (ja) 1990-11-05 1990-11-05 Ｉｃチップ

Publications (2)

Publication Number Publication Date
JPS5927539A JPS5927539A (ja) 1984-02-14
JPH0129060B2 true JPH0129060B2 (enrdf_load_stackoverflow) 1989-06-07

Family

ID=15187254

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13694882A Granted JPS5927539A (ja) 1982-08-05 1982-08-05 サーマルヘッド用ｉｃチップのパッド配列方法

Country Status (1)

Country Link
JP (1) JPS5927539A (enrdf_load_stackoverflow)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03175060A (ja) * 1990-11-05 1991-07-30 Ricoh Co Ltd Ｉｃチップ
JP2626389B2 (ja) * 1991-12-26 1997-07-02 松下電器産業株式会社 チップ部品
US5781220A (en) * 1994-07-29 1998-07-14 Kyocera Corporation Thermal head
JP2674553B2 (ja) * 1995-03-30 1997-11-12 日本電気株式会社 半導体装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5878786A (ja) * 1981-11-05 1983-05-12 Toshiba Corp 感熱記録装置

Also Published As

Publication number Publication date
JPS5927539A (ja) 1984-02-14

Similar Documents

Publication Publication Date Title
JPH03165061A (ja) 半導体集積回路装置
JPS59164158A (ja) サ−マルヘツド
JPH0129060B2 (enrdf_load_stackoverflow)
DE69015847D1 (de) Aufzeichnungsgerät und Aufzeichnungskopfsubstrat für die Verwendung darin.
JP2602237B2 (ja) 液晶表示装置
JPH03175060A (ja) Ｉｃチップ
US4516136A (en) Thermal print head
JPS6222794B2 (enrdf_load_stackoverflow)
JP2817533B2 (ja) 半導体集積回路装置
JPS6018359A (ja) 感熱記録装置
JP2564591B2 (ja) 電子部品駆動装置
JPH03225949A (ja) ディスプレイドライバー集積回路
JPS60107366A (ja) サ−マルヘツド
JPS6124995B2 (enrdf_load_stackoverflow)
JP2527723B2 (ja) 半導体集積回路装置
JP3434959B2 (ja) ヘッド駆動用ｉｃ
JPS61214549A (ja) 電子回路アセンブリ
JPS6334161A (ja) 感熱記録ヘツド駆動用ｉｃ
JPH11177015A (ja) 半導体パッケージおよび半導体パッケージ実装用中間基板
JPS61225845A (ja) 半導体装置
JPH0195349U (enrdf_load_stackoverflow)
JP2823031B2 (ja) 平面実装構造
JPH0210582B2 (enrdf_load_stackoverflow)
JPH0349255A (ja) 半導体集積回路の封止方式
JPS58184735A (ja) 集積回路チツプ