JPS5927539A - サーマルヘッド用ｉｃチップのパッド配列方法 - Google Patents

サーマルヘッド用ｉｃチップのパッド配列方法

Info

Publication number
JPS5927539A
JPS5927539A JP13694882A JP13694882A JPS5927539A JP S5927539 A JPS5927539 A JP S5927539A JP 13694882 A JP13694882 A JP 13694882A JP 13694882 A JP13694882 A JP 13694882A JP S5927539 A JPS5927539 A JP S5927539A
Authority
JP
Japan
Prior art keywords
chip
pad
thermal head
pad arrangement
arrangement method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13694882A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0129060B2 (enrdf_load_stackoverflow
Inventor
Osamu Sugano
修 菅野
Masatoshi Oota
正俊 太田
Yasuhiko Takamatsu
恭彦 高松
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ricoh Co Ltd
Original Assignee
Ricoh Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ricoh Co Ltd filed Critical Ricoh Co Ltd
Priority to JP13694882A priority Critical patent/JPS5927539A/ja
Publication of JPS5927539A publication Critical patent/JPS5927539A/ja
Publication of JPH0129060B2 publication Critical patent/JPH0129060B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Wire Bonding (AREA)
JP13694882A 1982-08-05 1982-08-05 サーマルヘッド用ｉｃチップのパッド配列方法 Granted JPS5927539A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13694882A JPS5927539A (ja) 1982-08-05 1982-08-05 サーマルヘッド用ｉｃチップのパッド配列方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13694882A JPS5927539A (ja) 1982-08-05 1982-08-05 サーマルヘッド用ｉｃチップのパッド配列方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP30017490A Division JPH03175060A (ja) 1990-11-05 1990-11-05 Ｉｃチップ

Publications (2)

Publication Number Publication Date
JPS5927539A true JPS5927539A (ja) 1984-02-14
JPH0129060B2 JPH0129060B2 (enrdf_load_stackoverflow) 1989-06-07

Family

ID=15187254

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13694882A Granted JPS5927539A (ja) 1982-08-05 1982-08-05 サーマルヘッド用ｉｃチップのパッド配列方法

Country Status (1)

Country Link
JP (1) JPS5927539A (enrdf_load_stackoverflow)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03175060A (ja) * 1990-11-05 1991-07-30 Ricoh Co Ltd Ｉｃチップ
JPH05175274A (ja) * 1991-12-26 1993-07-13 Matsushita Electric Ind Co Ltd チップ部品
US5670802A (en) * 1995-03-30 1997-09-23 Nec Corporation Semiconductor device
US5781220A (en) * 1994-07-29 1998-07-14 Kyocera Corporation Thermal head

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5878786A (ja) * 1981-11-05 1983-05-12 Toshiba Corp 感熱記録装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5878786A (ja) * 1981-11-05 1983-05-12 Toshiba Corp 感熱記録装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03175060A (ja) * 1990-11-05 1991-07-30 Ricoh Co Ltd Ｉｃチップ
JPH05175274A (ja) * 1991-12-26 1993-07-13 Matsushita Electric Ind Co Ltd チップ部品
US5781220A (en) * 1994-07-29 1998-07-14 Kyocera Corporation Thermal head
US5670802A (en) * 1995-03-30 1997-09-23 Nec Corporation Semiconductor device

Also Published As

Publication number Publication date
JPH0129060B2 (enrdf_load_stackoverflow) 1989-06-07

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