JPH01206637A - Xy駆動機構 - Google Patents
Xy駆動機構Info
- Publication number
- JPH01206637A JPH01206637A JP63031594A JP3159488A JPH01206637A JP H01206637 A JPH01206637 A JP H01206637A JP 63031594 A JP63031594 A JP 63031594A JP 3159488 A JP3159488 A JP 3159488A JP H01206637 A JPH01206637 A JP H01206637A
- Authority
- JP
- Japan
- Prior art keywords
- axis
- frame
- axis direction
- motor
- motors
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/072—Connecting or disconnecting of bump connectors
- H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63031594A JPH01206637A (ja) | 1988-02-13 | 1988-02-13 | Xy駆動機構 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63031594A JPH01206637A (ja) | 1988-02-13 | 1988-02-13 | Xy駆動機構 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01206637A true JPH01206637A (ja) | 1989-08-18 |
| JPH0572103B2 JPH0572103B2 (https=) | 1993-10-08 |
Family
ID=12335520
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63031594A Granted JPH01206637A (ja) | 1988-02-13 | 1988-02-13 | Xy駆動機構 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01206637A (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007173264A (ja) * | 2005-12-19 | 2007-07-05 | Tanaka Seiki Kk | 多軸巻線機 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58141A (ja) * | 1981-06-25 | 1983-01-05 | Shinkawa Ltd | 自動インナ−リ−ドボンデイング方法 |
| JPS58120448A (ja) * | 1981-12-29 | 1983-07-18 | Fanuc Ltd | 工作機械のテ−ブル制御方式 |
-
1988
- 1988-02-13 JP JP63031594A patent/JPH01206637A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58141A (ja) * | 1981-06-25 | 1983-01-05 | Shinkawa Ltd | 自動インナ−リ−ドボンデイング方法 |
| JPS58120448A (ja) * | 1981-12-29 | 1983-07-18 | Fanuc Ltd | 工作機械のテ−ブル制御方式 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007173264A (ja) * | 2005-12-19 | 2007-07-05 | Tanaka Seiki Kk | 多軸巻線機 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0572103B2 (https=) | 1993-10-08 |
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