JPH01119602A - 銀被覆銅粉の製造法 - Google Patents
銀被覆銅粉の製造法Info
- Publication number
- JPH01119602A JPH01119602A JP62277689A JP27768987A JPH01119602A JP H01119602 A JPH01119602 A JP H01119602A JP 62277689 A JP62277689 A JP 62277689A JP 27768987 A JP27768987 A JP 27768987A JP H01119602 A JPH01119602 A JP H01119602A
- Authority
- JP
- Japan
- Prior art keywords
- copper powder
- silver
- weight
- coated copper
- soln
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 113
- 229910052709 silver Inorganic materials 0.000 title claims abstract description 81
- 239000004332 silver Substances 0.000 title claims abstract description 81
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 title claims abstract description 74
- 238000004519 manufacturing process Methods 0.000 title claims description 24
- SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(1+) nitrate Chemical compound [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 claims abstract description 28
- 239000002738 chelating agent Substances 0.000 claims abstract description 27
- 239000003638 chemical reducing agent Substances 0.000 claims abstract description 20
- FOIXSVOLVBLSDH-UHFFFAOYSA-N Silver ion Chemical compound [Ag+] FOIXSVOLVBLSDH-UHFFFAOYSA-N 0.000 claims abstract description 17
- 229910001961 silver nitrate Inorganic materials 0.000 claims abstract description 14
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 claims abstract description 11
- IMNIMPAHZVJRPE-UHFFFAOYSA-N triethylenediamine Chemical compound C1CN2CCN1CC2 IMNIMPAHZVJRPE-UHFFFAOYSA-N 0.000 claims abstract description 10
- 230000002378 acidificating effect Effects 0.000 claims abstract description 9
- 239000006185 dispersion Substances 0.000 claims abstract description 7
- 230000007935 neutral effect Effects 0.000 claims abstract description 5
- QPCDCPDFJACHGM-UHFFFAOYSA-N N,N-bis{2-[bis(carboxymethyl)amino]ethyl}glycine Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(=O)O)CCN(CC(O)=O)CC(O)=O QPCDCPDFJACHGM-UHFFFAOYSA-N 0.000 claims description 4
- 229940071106 ethylenediaminetetraacetate Drugs 0.000 claims description 4
- 229960003330 pentetic acid Drugs 0.000 claims description 4
- 150000001732 carboxylic acid derivatives Chemical class 0.000 claims description 2
- 238000006722 reduction reaction Methods 0.000 abstract description 12
- 230000003647 oxidation Effects 0.000 abstract description 11
- 238000007254 oxidation reaction Methods 0.000 abstract description 11
- 239000007788 liquid Substances 0.000 abstract description 8
- 229910052802 copper Inorganic materials 0.000 abstract description 6
- 239000010949 copper Substances 0.000 abstract description 6
- 239000011231 conductive filler Substances 0.000 abstract description 4
- 150000001735 carboxylic acids Chemical class 0.000 abstract description 2
- 239000002253 acid Substances 0.000 abstract 1
- 230000008021 deposition Effects 0.000 abstract 1
- 239000000243 solution Substances 0.000 description 31
- 238000000034 method Methods 0.000 description 17
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 16
- -1 silver ions Chemical class 0.000 description 13
- 239000011248 coating agent Substances 0.000 description 11
- 238000000576 coating method Methods 0.000 description 11
- 238000003756 stirring Methods 0.000 description 8
- 238000006243 chemical reaction Methods 0.000 description 7
- 238000001556 precipitation Methods 0.000 description 7
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 6
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 238000006467 substitution reaction Methods 0.000 description 6
- QGZKDVFQNNGYKY-UHFFFAOYSA-N ammonia Natural products N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 238000004140 cleaning Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000005011 phenolic resin Substances 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 238000011282 treatment Methods 0.000 description 4
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 description 3
- JJLJMEJHUUYSSY-UHFFFAOYSA-L Copper hydroxide Chemical compound [OH-].[OH-].[Cu+2] JJLJMEJHUUYSSY-UHFFFAOYSA-L 0.000 description 3
- 239000005750 Copper hydroxide Substances 0.000 description 3
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical class [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 3
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 230000032683 aging Effects 0.000 description 3
- 239000012298 atmosphere Substances 0.000 description 3
- 239000003153 chemical reaction reagent Substances 0.000 description 3
- 229910001956 copper hydroxide Inorganic materials 0.000 description 3
- 229910001431 copper ion Inorganic materials 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 230000000977 initiatory effect Effects 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 238000002203 pretreatment Methods 0.000 description 3
- 239000008213 purified water Substances 0.000 description 3
- 235000002906 tartaric acid Nutrition 0.000 description 3
- 239000011975 tartaric acid Substances 0.000 description 3
- 229960001124 trientine Drugs 0.000 description 3
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- ATRRKUHOCOJYRX-UHFFFAOYSA-N Ammonium bicarbonate Chemical compound [NH4+].OC([O-])=O ATRRKUHOCOJYRX-UHFFFAOYSA-N 0.000 description 2
- QUSNBJAOOMFDIB-UHFFFAOYSA-N Ethylamine Chemical compound CCN QUSNBJAOOMFDIB-UHFFFAOYSA-N 0.000 description 2
- AEMRFAOFKBGASW-UHFFFAOYSA-N Glycolic acid Chemical compound OCC(O)=O AEMRFAOFKBGASW-UHFFFAOYSA-N 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- GLUUGHFHXGJENI-UHFFFAOYSA-N Piperazine Chemical compound C1CNCCN1 GLUUGHFHXGJENI-UHFFFAOYSA-N 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 229910021529 ammonia Inorganic materials 0.000 description 2
- 239000001099 ammonium carbonate Substances 0.000 description 2
- 235000012501 ammonium carbonate Nutrition 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000006227 byproduct Substances 0.000 description 2
- 238000005238 degreasing Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 239000000706 filtrate Substances 0.000 description 2
- 150000004679 hydroxides Chemical class 0.000 description 2
- 239000008235 industrial water Substances 0.000 description 2
- 238000005342 ion exchange Methods 0.000 description 2
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 229920001568 phenolic resin Polymers 0.000 description 2
- SIOXPEMLGUPBBT-UHFFFAOYSA-N picolinic acid Chemical compound OC(=O)C1=CC=CC=N1 SIOXPEMLGUPBBT-UHFFFAOYSA-N 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000012266 salt solution Substances 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- LFAGQMCIGQNPJG-UHFFFAOYSA-N silver cyanide Chemical compound [Ag+].N#[C-] LFAGQMCIGQNPJG-UHFFFAOYSA-N 0.000 description 2
- 229940098221 silver cyanide Drugs 0.000 description 2
- HAAYBYDROVFKPU-UHFFFAOYSA-N silver;azane;nitrate Chemical compound N.N.[Ag+].[O-][N+]([O-])=O HAAYBYDROVFKPU-UHFFFAOYSA-N 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- BJEPYKJPYRNKOW-REOHCLBHSA-N (S)-malic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O BJEPYKJPYRNKOW-REOHCLBHSA-N 0.000 description 1
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- 239000005749 Copper compound Substances 0.000 description 1
- 239000005751 Copper oxide Substances 0.000 description 1
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 description 1
- QZKRHPLGUJDVAR-UHFFFAOYSA-K EDTA trisodium salt Chemical class [Na+].[Na+].[Na+].OC(=O)CN(CC([O-])=O)CCN(CC([O-])=O)CC([O-])=O QZKRHPLGUJDVAR-UHFFFAOYSA-K 0.000 description 1
- WQZGKKKJIJFFOK-GASJEMHNSA-N Glucose Natural products OC[C@H]1OC(O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-GASJEMHNSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- DGEZNRSVGBDHLK-UHFFFAOYSA-N [1,10]phenanthroline Chemical compound C1=CN=C2C3=NC=CC=C3C=CC2=C1 DGEZNRSVGBDHLK-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 150000001299 aldehydes Chemical class 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- BJEPYKJPYRNKOW-UHFFFAOYSA-N alpha-hydroxysuccinic acid Natural products OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000000889 atomisation Methods 0.000 description 1
- WQZGKKKJIJFFOK-VFUOTHLCSA-N beta-D-glucose Chemical compound OC[C@H]1O[C@@H](O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-VFUOTHLCSA-N 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- 150000001720 carbohydrates Chemical class 0.000 description 1
- 235000014633 carbohydrates Nutrition 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 150000001880 copper compounds Chemical class 0.000 description 1
- 229910000431 copper oxide Inorganic materials 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000008103 glucose Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 239000004310 lactic acid Substances 0.000 description 1
- 235000014655 lactic acid Nutrition 0.000 description 1
- HWSZZLVAJGOAAY-UHFFFAOYSA-L lead(II) chloride Chemical compound Cl[Pb]Cl HWSZZLVAJGOAAY-UHFFFAOYSA-L 0.000 description 1
- 238000013035 low temperature curing Methods 0.000 description 1
- 239000001630 malic acid Substances 0.000 description 1
- 235000011090 malic acid Nutrition 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000005065 mining Methods 0.000 description 1
- DIHKMUNUGQVFES-UHFFFAOYSA-N n,n,n',n'-tetraethylethane-1,2-diamine Chemical compound CCN(CC)CCN(CC)CC DIHKMUNUGQVFES-UHFFFAOYSA-N 0.000 description 1
- MGFYIUFZLHCRTH-UHFFFAOYSA-N nitrilotriacetic acid Chemical compound OC(=O)CN(CC(O)=O)CC(O)=O MGFYIUFZLHCRTH-UHFFFAOYSA-N 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 229940081066 picolinic acid Drugs 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000000276 potassium ferrocyanide Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 150000003378 silver Chemical class 0.000 description 1
- BTURAGWYSMTVOW-UHFFFAOYSA-M sodium dodecanoate Chemical compound [Na+].CCCCCCCCCCCC([O-])=O BTURAGWYSMTVOW-UHFFFAOYSA-M 0.000 description 1
- 229940082004 sodium laurate Drugs 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- XOGGUFAVLNCTRS-UHFFFAOYSA-N tetrapotassium;iron(2+);hexacyanide Chemical compound [K+].[K+].[K+].[K+].[Fe+2].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-] XOGGUFAVLNCTRS-UHFFFAOYSA-N 0.000 description 1
- UEUXEKPTXMALOB-UHFFFAOYSA-J tetrasodium;2-[2-[bis(carboxylatomethyl)amino]ethyl-(carboxylatomethyl)amino]acetate Chemical compound [Na+].[Na+].[Na+].[Na+].[O-]C(=O)CN(CC([O-])=O)CCN(CC([O-])=O)CC([O-])=O UEUXEKPTXMALOB-UHFFFAOYSA-J 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/17—Metallic particles coated with metal
Landscapes
- Powder Metallurgy (AREA)
- Chemically Coating (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62277689A JPH01119602A (ja) | 1987-11-02 | 1987-11-02 | 銀被覆銅粉の製造法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62277689A JPH01119602A (ja) | 1987-11-02 | 1987-11-02 | 銀被覆銅粉の製造法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01119602A true JPH01119602A (ja) | 1989-05-11 |
| JPH0246641B2 JPH0246641B2 (enrdf_load_stackoverflow) | 1990-10-16 |
Family
ID=17586931
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62277689A Granted JPH01119602A (ja) | 1987-11-02 | 1987-11-02 | 銀被覆銅粉の製造法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01119602A (enrdf_load_stackoverflow) |
Cited By (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5178909A (en) * | 1990-07-24 | 1993-01-12 | Mitsui Kinzoku Kogyo Kabushiki Kaisha | Production of silver-coated copper-based powders |
| JPH10501025A (ja) * | 1993-10-08 | 1998-01-27 | アメリカ合衆国 | 酸で補助された冷間圧接および金属間形成およびその歯科用途 |
| JP2006161081A (ja) * | 2004-12-03 | 2006-06-22 | Dowa Mining Co Ltd | 銀被覆銅粉およびその製造方法並びに導電ペースト |
| US7156928B2 (en) | 2001-11-20 | 2007-01-02 | Shin-Etsu Chemical Co., Ltd. | Corrosion-resistant rare earth element magnet |
| KR100791231B1 (ko) * | 2000-12-20 | 2008-01-03 | 도와 홀딩스 가부시끼가이샤 | 은 확산 구리 분말, 이의 제조방법, 및 이를 사용하는 전도성 페이스트 및 프린트 전자회로용 도선 |
| CN101887767A (zh) * | 2010-06-11 | 2010-11-17 | 山东大学 | 一种以表面覆盖银纳米结构的铜粉为填料的导电浆料的制备方法 |
| CN101653826B (zh) | 2009-09-11 | 2011-01-26 | 南京金视显科技有限公司 | 一种银粉表面改性处理方法 |
| JP2011058068A (ja) * | 2009-09-11 | 2011-03-24 | Toyobo Co Ltd | 銅薄膜製造方法および銅薄膜 |
| JP2011082145A (ja) * | 2009-09-11 | 2011-04-21 | Toyobo Co Ltd | 銅薄膜および銅薄膜積層体 |
| CN103128308A (zh) * | 2013-03-06 | 2013-06-05 | 东南大学 | 一锅法制备致密银包铜粉的方法 |
| JP2013185213A (ja) * | 2012-03-08 | 2013-09-19 | Tokyo Institute Of Technology | 金属ナノ粒子及びその製造方法並びに導電性インク |
| US8617688B2 (en) | 2005-05-30 | 2013-12-31 | Sumitomo Electric Industries, Ltd. | Conductive paste and multilayer printed wiring board using the same |
| CN103890966A (zh) * | 2011-10-18 | 2014-06-25 | 迪睿合电子材料有限公司 | 导电性粘接剂以及使用该导电性粘接剂的太阳能电池模块及其制造方法 |
| JP2014118590A (ja) * | 2012-12-14 | 2014-06-30 | Unitika Ltd | 繊維状銀微粒子集合体 |
| JP2014118589A (ja) * | 2012-12-14 | 2014-06-30 | Unitika Ltd | 被覆繊維状銅微粒子集合体 |
| CN105127449A (zh) * | 2015-10-20 | 2015-12-09 | 陈键 | 一种制备表面镀银铜粉的方法 |
| CN105598468A (zh) * | 2016-03-17 | 2016-05-25 | 中国科学院深圳先进技术研究院 | 一种可用于导电油墨的银包铜纳米颗粒的制备方法 |
| JP2017150086A (ja) * | 2012-01-17 | 2017-08-31 | Ｄｏｗａエレクトロニクス株式会社 | 銀被覆銅合金粉末およびその製造方法 |
| CN110551995A (zh) * | 2019-09-16 | 2019-12-10 | 上海交通大学 | 一种化学镀法制备光滑致密银包铜粉的方法 |
| CN119407166A (zh) * | 2025-01-07 | 2025-02-11 | 安徽壹石通材料科技股份有限公司 | 一种小粒径镀银铜粉及其制备方法与应用 |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0640099A (ja) * | 1992-07-23 | 1994-02-15 | Pfu Ltd | プリンタ装置 |
| JP6076249B2 (ja) * | 2011-06-14 | 2017-02-08 | ユニチカ株式会社 | 被覆繊維状銅微粒子、並びに該被覆繊維状銅微粒子を含む導電性コーティング剤および導電性フィルム |
| JP5631910B2 (ja) * | 2011-10-21 | 2014-11-26 | 三井金属鉱業株式会社 | 銀被覆銅粉 |
| WO2015194347A1 (ja) * | 2014-06-16 | 2015-12-23 | 三井金属鉱業株式会社 | 銅粉、その製造方法、及びそれを含む導電性組成物 |
| CN110523973A (zh) * | 2019-09-21 | 2019-12-03 | 深圳市百柔新材料技术有限公司 | 表面包覆致密银层的片状银铜粉、制备方法及其应用 |
-
1987
- 1987-11-02 JP JP62277689A patent/JPH01119602A/ja active Granted
Cited By (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5178909A (en) * | 1990-07-24 | 1993-01-12 | Mitsui Kinzoku Kogyo Kabushiki Kaisha | Production of silver-coated copper-based powders |
| JPH10501025A (ja) * | 1993-10-08 | 1998-01-27 | アメリカ合衆国 | 酸で補助された冷間圧接および金属間形成およびその歯科用途 |
| KR100791231B1 (ko) * | 2000-12-20 | 2008-01-03 | 도와 홀딩스 가부시끼가이샤 | 은 확산 구리 분말, 이의 제조방법, 및 이를 사용하는 전도성 페이스트 및 프린트 전자회로용 도선 |
| US7156928B2 (en) | 2001-11-20 | 2007-01-02 | Shin-Etsu Chemical Co., Ltd. | Corrosion-resistant rare earth element magnet |
| JP2006161081A (ja) * | 2004-12-03 | 2006-06-22 | Dowa Mining Co Ltd | 銀被覆銅粉およびその製造方法並びに導電ペースト |
| US8617688B2 (en) | 2005-05-30 | 2013-12-31 | Sumitomo Electric Industries, Ltd. | Conductive paste and multilayer printed wiring board using the same |
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| JP2013185213A (ja) * | 2012-03-08 | 2013-09-19 | Tokyo Institute Of Technology | 金属ナノ粒子及びその製造方法並びに導電性インク |
| JP2014118589A (ja) * | 2012-12-14 | 2014-06-30 | Unitika Ltd | 被覆繊維状銅微粒子集合体 |
| JP2014118590A (ja) * | 2012-12-14 | 2014-06-30 | Unitika Ltd | 繊維状銀微粒子集合体 |
| CN103128308A (zh) * | 2013-03-06 | 2013-06-05 | 东南大学 | 一锅法制备致密银包铜粉的方法 |
| CN105127449A (zh) * | 2015-10-20 | 2015-12-09 | 陈键 | 一种制备表面镀银铜粉的方法 |
| CN105598468A (zh) * | 2016-03-17 | 2016-05-25 | 中国科学院深圳先进技术研究院 | 一种可用于导电油墨的银包铜纳米颗粒的制备方法 |
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| CN119407166A (zh) * | 2025-01-07 | 2025-02-11 | 安徽壹石通材料科技股份有限公司 | 一种小粒径镀银铜粉及其制备方法与应用 |
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