CN101653826B - 一种银粉表面改性处理方法 - Google Patents
一种银粉表面改性处理方法 Download PDFInfo
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- CN101653826B CN101653826B CN200910183400XA CN200910183400A CN101653826B CN 101653826 B CN101653826 B CN 101653826B CN 200910183400X A CN200910183400X A CN 200910183400XA CN 200910183400 A CN200910183400 A CN 200910183400A CN 101653826 B CN101653826 B CN 101653826B
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- powder
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- coating machine
- silver powder
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Priority Applications (1)
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CN200910183400XA CN101653826B (zh) | 2009-09-11 | 2009-09-11 | 一种银粉表面改性处理方法 |
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CN200910183400XA CN101653826B (zh) | 2009-09-11 | 2009-09-11 | 一种银粉表面改性处理方法 |
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CN101653826A CN101653826A (zh) | 2010-02-24 |
CN101653826B true CN101653826B (zh) | 2011-01-26 |
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CN200910183400XA Expired - Fee Related CN101653826B (zh) | 2009-09-11 | 2009-09-11 | 一种银粉表面改性处理方法 |
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Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102262915B (zh) * | 2011-07-19 | 2013-09-11 | 彩虹集团公司 | 一种基于大功率led 芯片贴装用环保型银导体浆料及其制备方法 |
CN102262916A (zh) * | 2011-07-19 | 2011-11-30 | 彩虹集团公司 | 一种晶体硅太阳能电池用正银浆料及其制备方法 |
CN103817321B (zh) * | 2014-02-19 | 2016-03-30 | 南京林业大学 | 一种改性纳米银粉的制备方法 |
CN110935394B (zh) * | 2019-11-05 | 2021-07-30 | 南京清大迈特新材料有限公司 | 一种微纳粉体精细加工方法及装置 |
CN111230098B (zh) * | 2020-03-18 | 2021-07-13 | 北京大学 | 一种金属基纳米复合粉末材料、制备方法及其应用 |
CN114226712A (zh) * | 2021-12-14 | 2022-03-25 | 英特派铂业股份有限公司 | 一种银粉表面高效融合包覆工艺 |
CN114273653A (zh) * | 2021-12-24 | 2022-04-05 | 长沙新材料产业研究院有限公司 | 一种用于增材制造的复合粉末及其制备方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2448738A1 (de) * | 1974-10-12 | 1976-04-15 | Heraeus Gmbh W C | Metallischer verbundwerkstoff und verfahren zu seiner herstellung |
KR20050006056A (ko) * | 2003-07-08 | 2005-01-15 | 히다치 가세고교 가부시끼가이샤 | 도전성 분말 및 그 제조 방법 |
CN1202531C (zh) * | 2003-01-14 | 2005-05-18 | 中山大学 | 低含量纳米银导电浆料及其制备方法 |
CN1783355A (zh) * | 2005-06-16 | 2006-06-07 | 沈阳工业大学 | 铜银合金导体浆料及其制备方法 |
JP2007191752A (ja) * | 2006-01-18 | 2007-08-02 | Mitsui Mining & Smelting Co Ltd | 錫コート銀粉及びその錫コート銀粉の製造方法 |
CN101274367A (zh) * | 2007-03-26 | 2008-10-01 | 中南大学 | 一种导电浆料用铜粉的表面修饰方法 |
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2009
- 2009-09-11 CN CN200910183400XA patent/CN101653826B/zh not_active Expired - Fee Related
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2448738A1 (de) * | 1974-10-12 | 1976-04-15 | Heraeus Gmbh W C | Metallischer verbundwerkstoff und verfahren zu seiner herstellung |
CN1202531C (zh) * | 2003-01-14 | 2005-05-18 | 中山大学 | 低含量纳米银导电浆料及其制备方法 |
KR20050006056A (ko) * | 2003-07-08 | 2005-01-15 | 히다치 가세고교 가부시끼가이샤 | 도전성 분말 및 그 제조 방법 |
CN1783355A (zh) * | 2005-06-16 | 2006-06-07 | 沈阳工业大学 | 铜银合金导体浆料及其制备方法 |
JP2007191752A (ja) * | 2006-01-18 | 2007-08-02 | Mitsui Mining & Smelting Co Ltd | 錫コート銀粉及びその錫コート銀粉の製造方法 |
CN101274367A (zh) * | 2007-03-26 | 2008-10-01 | 中南大学 | 一种导电浆料用铜粉的表面修饰方法 |
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CN101653826A (zh) | 2010-02-24 |
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