JP7808426B2 - 接続構造体の製造方法、及び接続構造体、並びにフィルム構造体、及びフィルム構造体の製造方法 - Google Patents

接続構造体の製造方法、及び接続構造体、並びにフィルム構造体、及びフィルム構造体の製造方法

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Publication number
JP7808426B2
JP7808426B2 JP2020035390A JP2020035390A JP7808426B2 JP 7808426 B2 JP7808426 B2 JP 7808426B2 JP 2020035390 A JP2020035390 A JP 2020035390A JP 2020035390 A JP2020035390 A JP 2020035390A JP 7808426 B2 JP7808426 B2 JP 7808426B2
Authority
JP
Japan
Prior art keywords
film
substrate
shape
connection
electronic component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2020035390A
Other languages
English (en)
Japanese (ja)
Other versions
JP2020198422A5 (https=
JP2020198422A (ja
Inventor
雄介 田中
勇介 鎌田
秀次 波木
学 鈴木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dexerials Corp
Original Assignee
Dexerials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dexerials Corp filed Critical Dexerials Corp
Priority to PCT/JP2020/008778 priority Critical patent/WO2020184267A1/ja
Priority to KR1020217028421A priority patent/KR102601787B1/ko
Priority to US17/437,350 priority patent/US12142621B2/en
Priority to KR1020237038370A priority patent/KR20230157536A/ko
Priority to TW113142654A priority patent/TW202516986A/zh
Priority to TW109107238A priority patent/TWI863970B/zh
Publication of JP2020198422A publication Critical patent/JP2020198422A/ja
Publication of JP2020198422A5 publication Critical patent/JP2020198422A5/ja
Priority to US18/905,331 priority patent/US20250031468A1/en
Priority to JP2024206427A priority patent/JP2025019287A/ja
Priority to JP2025185902A priority patent/JP2026009318A/ja
Application granted granted Critical
Publication of JP7808426B2 publication Critical patent/JP7808426B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/809—Constructional details of image sensors of hybrid image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/811—Interconnections

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)
  • Wire Bonding (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP2020035390A 2019-03-08 2020-03-02 接続構造体の製造方法、及び接続構造体、並びにフィルム構造体、及びフィルム構造体の製造方法 Active JP7808426B2 (ja)

Priority Applications (9)

Application Number Priority Date Filing Date Title
PCT/JP2020/008778 WO2020184267A1 (ja) 2019-03-08 2020-03-02 接続構造体の製造方法、及び接続構造体、並びにフィルム構造体、及びフィルム構造体の製造方法
KR1020217028421A KR102601787B1 (ko) 2019-03-08 2020-03-02 접속 구조체의 제조 방법, 및 접속 구조체, 그리고 필름 구조체, 및 필름 구조체의 제조 방법
US17/437,350 US12142621B2 (en) 2019-03-08 2020-03-02 Method of manufacturing connection structure, connection structure, film structure, and method of manufacturing film structure
KR1020237038370A KR20230157536A (ko) 2019-03-08 2020-03-02 접속 구조체의 제조 방법, 및 접속 구조체, 그리고 필름 구조체, 및 필름 구조체의 제조 방법
TW113142654A TW202516986A (zh) 2019-03-08 2020-03-05 連接構造體之製造方法、及連接構造體、以及膜構造體、膜捲裝體、及膜構造體之製造方法
TW109107238A TWI863970B (zh) 2019-03-08 2020-03-05 連接構造體之製造方法、及連接構造體、以及膜構造體、及膜構造體之製造方法
US18/905,331 US20250031468A1 (en) 2019-03-08 2024-10-03 Method of manufacturing connection structure, connection structure, film structure, and method of manufacturing film structure
JP2024206427A JP2025019287A (ja) 2019-03-08 2024-11-27 接続構造体の製造方法、及び接続構造体、並びにフィルム構造体、及びフィルム構造体の製造方法
JP2025185902A JP2026009318A (ja) 2019-03-08 2025-11-04 接続構造体の製造方法、及び接続構造体、並びにフィルム構造体、及びフィルム構造体の製造方法

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2019043203 2019-03-08
JP2019043203 2019-03-08
JP2019100787 2019-05-29
JP2019100787 2019-05-29

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP2024206427A Division JP2025019287A (ja) 2019-03-08 2024-11-27 接続構造体の製造方法、及び接続構造体、並びにフィルム構造体、及びフィルム構造体の製造方法
JP2025185902A Division JP2026009318A (ja) 2019-03-08 2025-11-04 接続構造体の製造方法、及び接続構造体、並びにフィルム構造体、及びフィルム構造体の製造方法

Publications (3)

Publication Number Publication Date
JP2020198422A JP2020198422A (ja) 2020-12-10
JP2020198422A5 JP2020198422A5 (https=) 2023-04-28
JP7808426B2 true JP7808426B2 (ja) 2026-01-29

Family

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Family Applications (1)

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JP2020035390A Active JP7808426B2 (ja) 2019-03-08 2020-03-02 接続構造体の製造方法、及び接続構造体、並びにフィルム構造体、及びフィルム構造体の製造方法

Country Status (4)

Country Link
JP (1) JP7808426B2 (https=)
KR (1) KR102601787B1 (https=)
CN (1) CN113474872A (https=)
TW (1) TWI863970B (https=)

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Publication number Priority date Publication date Assignee Title
US20250114982A1 (en) 2021-09-29 2025-04-10 Dexerials Corporation Method for manufacturing a connection film
JP2023125888A (ja) * 2022-02-28 2023-09-07 デクセリアルズ株式会社 接続構造体の製造方法、フィルム構造体、及びフィルム構造体の製造方法
JP2023151680A (ja) * 2022-03-31 2023-10-16 デクセリアルズ株式会社 個片加工接着フィルム、接続構造体の製造方法、及び接続構造体
JP2023151678A (ja) * 2022-03-31 2023-10-16 デクセリアルズ株式会社 長尺フィルムの製造方法、長尺フィルムの検査方法、及び検査マーキング装置
JP2023151679A (ja) 2022-03-31 2023-10-16 デクセリアルズ株式会社 長尺フィルム、及び接続構造体の製造方法
WO2024241858A1 (ja) * 2023-05-23 2024-11-28 デクセリアルズ株式会社 接続構造体の製造方法、及び接続構造体
JP2024170214A (ja) 2023-05-26 2024-12-06 デクセリアルズ株式会社 導電性接着フィルム、導電性接着フィルムの製造方法、接続体、接続体の製造方法
JP2025156041A (ja) * 2024-03-27 2025-10-14 デクセリアルズ株式会社 接続構造体の製造方法、接続フィルム、接続フィルムの製造方法

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JP2001131510A (ja) 1999-11-05 2001-05-15 Nissho Kk 接着材薄片支持体および部品の接着方法
WO2007058108A1 (ja) 2005-11-21 2007-05-24 Hitachi Chemical Company, Ltd. 異方導電接着剤
JP2010209353A (ja) 2010-06-03 2010-09-24 Sony Chemical & Information Device Corp 異方性導電フィルム及びその製造方法
JP2012182442A (ja) 2011-02-07 2012-09-20 Hitachi High-Technologies Corp 表示パネルモジュール組立装置、及び異方性導電材搬送装置
WO2014007116A1 (ja) 2012-07-03 2014-01-09 東レ株式会社 個片化された接着剤層を有する接着剤シートの製造方法、接着剤シートを用いた配線基板の製造方法、半導体装置の製造方法および接着剤シートの製造装置

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JPS61111943U (https=) * 1984-12-27 1986-07-15
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JP2549250Y2 (ja) * 1991-09-13 1997-09-30 日東電工株式会社 フレキシブル磁気ディスク用接合材
JPH09111196A (ja) * 1995-10-16 1997-04-28 Nitto Denko Corp 両面粘着材
JP2006016572A (ja) * 2004-07-05 2006-01-19 Okamoto Lace Kk 収納シート用接着テープ
KR100653551B1 (ko) * 2004-08-23 2006-12-04 (주)아이셀론 초음파 접합을 이용한 이미지센서의 칩 스케일 패키지제조방법
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JP2012182358A (ja) * 2011-03-02 2012-09-20 Hitachi High-Technologies Corp Ｆｐｄモジュールの組立装置及び組立方法
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JP2001131510A (ja) 1999-11-05 2001-05-15 Nissho Kk 接着材薄片支持体および部品の接着方法
WO2007058108A1 (ja) 2005-11-21 2007-05-24 Hitachi Chemical Company, Ltd. 異方導電接着剤
JP2010209353A (ja) 2010-06-03 2010-09-24 Sony Chemical & Information Device Corp 異方性導電フィルム及びその製造方法
JP2012182442A (ja) 2011-02-07 2012-09-20 Hitachi High-Technologies Corp 表示パネルモジュール組立装置、及び異方性導電材搬送装置
WO2014007116A1 (ja) 2012-07-03 2014-01-09 東レ株式会社 個片化された接着剤層を有する接着剤シートの製造方法、接着剤シートを用いた配線基板の製造方法、半導体装置の製造方法および接着剤シートの製造装置

Also Published As

Publication number Publication date
TW202044950A (zh) 2020-12-01
KR102601787B1 (ko) 2023-11-13
CN113474872A (zh) 2021-10-01
KR20210124387A (ko) 2021-10-14
TWI863970B (zh) 2024-12-01
JP2020198422A (ja) 2020-12-10

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