KR102601787B1 - 접속 구조체의 제조 방법, 및 접속 구조체, 그리고 필름 구조체, 및 필름 구조체의 제조 방법 - Google Patents

접속 구조체의 제조 방법, 및 접속 구조체, 그리고 필름 구조체, 및 필름 구조체의 제조 방법 Download PDF

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KR102601787B1
KR102601787B1 KR1020217028421A KR20217028421A KR102601787B1 KR 102601787 B1 KR102601787 B1 KR 102601787B1 KR 1020217028421 A KR1020217028421 A KR 1020217028421A KR 20217028421 A KR20217028421 A KR 20217028421A KR 102601787 B1 KR102601787 B1 KR 102601787B1
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South Korea
Prior art keywords
film
substrate
electronic component
connection
unit area
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Korean (ko)
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KR20210124387A (ko
Inventor
유스케 다나카
유스케 가마타
히데츠구 나미키
마나부 스즈키
Original Assignee
데쿠세리아루즈 가부시키가이샤
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Priority to KR1020237038370A priority Critical patent/KR20230157536A/ko
Priority claimed from PCT/JP2020/008778 external-priority patent/WO2020184267A1/ja
Publication of KR20210124387A publication Critical patent/KR20210124387A/ko
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H01L27/14618—
    • H01L27/14634—
    • H01L27/14636—
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/809—Constructional details of image sensors of hybrid image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/811—Interconnections

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)
  • Wire Bonding (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
KR1020217028421A 2019-03-08 2020-03-02 접속 구조체의 제조 방법, 및 접속 구조체, 그리고 필름 구조체, 및 필름 구조체의 제조 방법 Active KR102601787B1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020237038370A KR20230157536A (ko) 2019-03-08 2020-03-02 접속 구조체의 제조 방법, 및 접속 구조체, 그리고 필름 구조체, 및 필름 구조체의 제조 방법

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JPJP-P-2019-043203 2019-03-08
JP2019043203 2019-03-08
JPJP-P-2019-100787 2019-05-29
JP2019100787 2019-05-29
PCT/JP2020/008778 WO2020184267A1 (ja) 2019-03-08 2020-03-02 接続構造体の製造方法、及び接続構造体、並びにフィルム構造体、及びフィルム構造体の製造方法
JP2020035390A JP7808426B2 (ja) 2019-03-08 2020-03-02 接続構造体の製造方法、及び接続構造体、並びにフィルム構造体、及びフィルム構造体の製造方法
JPJP-P-2020-035390 2020-03-02

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020237038370A Division KR20230157536A (ko) 2019-03-08 2020-03-02 접속 구조체의 제조 방법, 및 접속 구조체, 그리고 필름 구조체, 및 필름 구조체의 제조 방법

Publications (2)

Publication Number Publication Date
KR20210124387A KR20210124387A (ko) 2021-10-14
KR102601787B1 true KR102601787B1 (ko) 2023-11-13

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JP (1) JP7808426B2 (https=)
KR (1) KR102601787B1 (https=)
CN (1) CN113474872A (https=)
TW (1) TWI863970B (https=)

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US20250114982A1 (en) 2021-09-29 2025-04-10 Dexerials Corporation Method for manufacturing a connection film
JP2023125888A (ja) * 2022-02-28 2023-09-07 デクセリアルズ株式会社 接続構造体の製造方法、フィルム構造体、及びフィルム構造体の製造方法
JP2023151680A (ja) * 2022-03-31 2023-10-16 デクセリアルズ株式会社 個片加工接着フィルム、接続構造体の製造方法、及び接続構造体
JP2023151678A (ja) * 2022-03-31 2023-10-16 デクセリアルズ株式会社 長尺フィルムの製造方法、長尺フィルムの検査方法、及び検査マーキング装置
JP2023151679A (ja) 2022-03-31 2023-10-16 デクセリアルズ株式会社 長尺フィルム、及び接続構造体の製造方法
WO2024241858A1 (ja) * 2023-05-23 2024-11-28 デクセリアルズ株式会社 接続構造体の製造方法、及び接続構造体
JP2024170214A (ja) 2023-05-26 2024-12-06 デクセリアルズ株式会社 導電性接着フィルム、導電性接着フィルムの製造方法、接続体、接続体の製造方法
JP2025156041A (ja) * 2024-03-27 2025-10-14 デクセリアルズ株式会社 接続構造体の製造方法、接続フィルム、接続フィルムの製造方法

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JP2012182442A (ja) * 2011-02-07 2012-09-20 Hitachi High-Technologies Corp 表示パネルモジュール組立装置、及び異方性導電材搬送装置

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JP7808426B2 (ja) 2026-01-29
TW202044950A (zh) 2020-12-01
CN113474872A (zh) 2021-10-01
KR20210124387A (ko) 2021-10-14
TWI863970B (zh) 2024-12-01
JP2020198422A (ja) 2020-12-10

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