JP7650612B2 - 熱伝導性シリコーン組成物、半導体装置及びその製造方法 - Google Patents

熱伝導性シリコーン組成物、半導体装置及びその製造方法 Download PDF

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JP7650612B2
JP7650612B2 JP2023531878A JP2023531878A JP7650612B2 JP 7650612 B2 JP7650612 B2 JP 7650612B2 JP 2023531878 A JP2023531878 A JP 2023531878A JP 2023531878 A JP2023531878 A JP 2023531878A JP 7650612 B2 JP7650612 B2 JP 7650612B2
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thermally conductive
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conductive silicone
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翔太 秋場
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Shin Etsu Chemical Co Ltd
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
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    • C08K3/00—Use of inorganic substances as compounding ingredients
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    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
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    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
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    • H10W40/00—Arrangements for thermal protection or thermal control
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    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
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    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
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    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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    • C08L2203/00—Applications
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    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
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    • H10W40/00—Arrangements for thermal protection or thermal control
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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
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  • Combustion & Propulsion (AREA)
  • Thermal Sciences (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2023531878A 2021-07-02 2022-06-23 熱伝導性シリコーン組成物、半導体装置及びその製造方法 Active JP7650612B2 (ja)

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JP2021110436 2021-07-02
JP2021110436 2021-07-02
PCT/JP2022/025063 WO2023276846A1 (ja) 2021-07-02 2022-06-23 熱伝導性シリコーン組成物、半導体装置及びその製造方法

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JP7650612B2 true JP7650612B2 (ja) 2025-03-25

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US (1) US20250223444A1 (https=)
EP (1) EP4365238A4 (https=)
JP (1) JP7650612B2 (https=)
KR (1) KR20240028463A (https=)
CN (1) CN117580912A (https=)
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WO (1) WO2023276846A1 (https=)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016509086A (ja) 2012-12-20 2016-03-24 ダウ コーニング コーポレーションＤｏｗ Ｃｏｒｎｉｎｇ Ｃｏｒｐｏｒａｔｉｏｎ 硬化性シリコーン組成物、導電性シリコーン接着剤、これらの製造及び使用方法、並びにこれらを含有する電気装置
WO2017159252A1 (ja) 2016-03-18 2017-09-21 信越化学工業株式会社 熱伝導性シリコーン組成物及び半導体装置
WO2020129555A1 (ja) 2018-12-21 2020-06-25 信越化学工業株式会社 熱伝導性シリコーン組成物及び半導体装置
WO2020137332A1 (ja) 2018-12-25 2020-07-02 信越化学工業株式会社 熱伝導性シリコーン組成物及び半導体装置
WO2020241054A1 (ja) 2019-05-27 2020-12-03 信越化学工業株式会社 熱伝導性シリコーン組成物、半導体装置及びその製造方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0639591B2 (ja) 1988-12-05 1994-05-25 信越化学工業株式会社 シリコーングリース組成物
US5011870A (en) 1989-02-08 1991-04-30 Dow Corning Corporation Thermally conductive organosiloxane compositions
JP3130193B2 (ja) 1993-10-06 2001-01-31 東レ・ダウコーニング・シリコーン株式会社 シリコーンゴム用銀粉末、その製造方法、およびシリコーンゴム組成物
JP3142800B2 (ja) 1996-08-09 2001-03-07 信越化学工業株式会社 熱伝導性シリコーン組成物、熱伝導性材料及び熱伝導性シリコーングリース
JP2930298B1 (ja) 1998-08-18 1999-08-03 信越化学工業株式会社 熱伝導性グリース組成物
JP3948642B2 (ja) 1998-08-21 2007-07-25 信越化学工業株式会社 熱伝導性グリース組成物及びそれを使用した半導体装置
JP3677671B2 (ja) 1999-04-30 2005-08-03 東レ・ダウコーニング株式会社 シリコーンゴム用銀粉末の製造方法
JP2002030217A (ja) 2000-07-17 2002-01-31 Fujitsu Ltd 熱伝導性シリコーン組成物
JP3130193U (ja) 2006-12-28 2007-03-15 ライオン株式会社 エアゾール缶用押しボタン
JP2008222776A (ja) 2007-03-09 2008-09-25 Shin Etsu Chem Co Ltd 熱伝導性シリコーングリース組成物
EP3150672B1 (en) * 2015-10-02 2018-05-09 Shin-Etsu Chemical Co., Ltd. Thermal conductive silicone composition and semiconductor device
JP6610491B2 (ja) * 2016-10-03 2019-11-27 信越化学工業株式会社 熱伝導性シリコーン組成物及び半導体装置
JP6607166B2 (ja) * 2016-10-31 2019-11-20 信越化学工業株式会社 熱伝導性シリコーン組成物及び半導体装置
JP7271411B2 (ja) * 2019-12-20 2023-05-11 信越化学工業株式会社 熱伝導性シリコーン組成物、半導体装置及びその製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016509086A (ja) 2012-12-20 2016-03-24 ダウ コーニング コーポレーションＤｏｗ Ｃｏｒｎｉｎｇ Ｃｏｒｐｏｒａｔｉｏｎ 硬化性シリコーン組成物、導電性シリコーン接着剤、これらの製造及び使用方法、並びにこれらを含有する電気装置
WO2017159252A1 (ja) 2016-03-18 2017-09-21 信越化学工業株式会社 熱伝導性シリコーン組成物及び半導体装置
WO2020129555A1 (ja) 2018-12-21 2020-06-25 信越化学工業株式会社 熱伝導性シリコーン組成物及び半導体装置
WO2020137332A1 (ja) 2018-12-25 2020-07-02 信越化学工業株式会社 熱伝導性シリコーン組成物及び半導体装置
WO2020241054A1 (ja) 2019-05-27 2020-12-03 信越化学工業株式会社 熱伝導性シリコーン組成物、半導体装置及びその製造方法

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EP4365238A1 (en) 2024-05-08
WO2023276846A1 (ja) 2023-01-05
TW202302761A (zh) 2023-01-16
US20250223444A1 (en) 2025-07-10
JPWO2023276846A1 (https=) 2023-01-05
KR20240028463A (ko) 2024-03-05
EP4365238A4 (en) 2025-04-02
CN117580912A (zh) 2024-02-20

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