JPWO2023276846A1 - - Google Patents
Info
- Publication number
- JPWO2023276846A1 JPWO2023276846A1 JP2023531878A JP2023531878A JPWO2023276846A1 JP WO2023276846 A1 JPWO2023276846 A1 JP WO2023276846A1 JP 2023531878 A JP2023531878 A JP 2023531878A JP 2023531878 A JP2023531878 A JP 2023531878A JP WO2023276846 A1 JPWO2023276846 A1 JP WO2023276846A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
- C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/20—Arrangements for cooling
- H10W40/25—Arrangements for cooling characterised by their materials
- H10W40/251—Organics
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/10—Metal compounds
- C08K3/105—Compounds containing metals of Groups 1 to 3 or of Groups 11 to 13 of the Periodic Table
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/20—Arrangements for cooling
- H10W40/25—Arrangements for cooling characterised by their materials
- H10W40/253—Semiconductors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0806—Silver
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/006—Additives being defined by their surface area
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/016—Additives defined by their aspect ratio
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Combustion & Propulsion (AREA)
- Thermal Sciences (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021110436 | 2021-07-02 | ||
| JP2021110436 | 2021-07-02 | ||
| PCT/JP2022/025063 WO2023276846A1 (ja) | 2021-07-02 | 2022-06-23 | 熱伝導性シリコーン組成物、半導体装置及びその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023276846A1 true JPWO2023276846A1 (https=) | 2023-01-05 |
| JP7650612B2 JP7650612B2 (ja) | 2025-03-25 |
Family
ID=84691297
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023531878A Active JP7650612B2 (ja) | 2021-07-02 | 2022-06-23 | 熱伝導性シリコーン組成物、半導体装置及びその製造方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20250223444A1 (https=) |
| EP (1) | EP4365238A4 (https=) |
| JP (1) | JP7650612B2 (https=) |
| KR (1) | KR20240028463A (https=) |
| CN (1) | CN117580912A (https=) |
| TW (1) | TW202302761A (https=) |
| WO (1) | WO2023276846A1 (https=) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016509086A (ja) * | 2012-12-20 | 2016-03-24 | ダウ コーニング コーポレーションＤｏｗ Ｃｏｒｎｉｎｇ Ｃｏｒｐｏｒａｔｉｏｎ | 硬化性シリコーン組成物、導電性シリコーン接着剤、これらの製造及び使用方法、並びにこれらを含有する電気装置 |
| JP2017066406A (ja) * | 2015-10-02 | 2017-04-06 | 信越化学工業株式会社 | 熱伝導性シリコーン組成物及び半導体装置 |
| WO2017159252A1 (ja) * | 2016-03-18 | 2017-09-21 | 信越化学工業株式会社 | 熱伝導性シリコーン組成物及び半導体装置 |
| JP2018058953A (ja) * | 2016-10-03 | 2018-04-12 | 信越化学工業株式会社 | 熱伝導性シリコーン組成物及び半導体装置 |
| WO2018079362A1 (ja) * | 2016-10-31 | 2018-05-03 | 信越化学工業株式会社 | 熱伝導性シリコーン組成物、半導体装置及び半導体装置の製造方法 |
| WO2020129555A1 (ja) * | 2018-12-21 | 2020-06-25 | 信越化学工業株式会社 | 熱伝導性シリコーン組成物及び半導体装置 |
| WO2020137332A1 (ja) * | 2018-12-25 | 2020-07-02 | 信越化学工業株式会社 | 熱伝導性シリコーン組成物及び半導体装置 |
| WO2020241054A1 (ja) * | 2019-05-27 | 2020-12-03 | 信越化学工業株式会社 | 熱伝導性シリコーン組成物、半導体装置及びその製造方法 |
| JP2021098768A (ja) * | 2019-12-20 | 2021-07-01 | 信越化学工業株式会社 | 熱伝導性シリコーン組成物、半導体装置及びその製造方法 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0639591B2 (ja) | 1988-12-05 | 1994-05-25 | 信越化学工業株式会社 | シリコーングリース組成物 |
| US5011870A (en) | 1989-02-08 | 1991-04-30 | Dow Corning Corporation | Thermally conductive organosiloxane compositions |
| JP3130193B2 (ja) | 1993-10-06 | 2001-01-31 | 東レ・ダウコーニング・シリコーン株式会社 | シリコーンゴム用銀粉末、その製造方法、およびシリコーンゴム組成物 |
| JP3142800B2 (ja) | 1996-08-09 | 2001-03-07 | 信越化学工業株式会社 | 熱伝導性シリコーン組成物、熱伝導性材料及び熱伝導性シリコーングリース |
| JP2930298B1 (ja) | 1998-08-18 | 1999-08-03 | 信越化学工業株式会社 | 熱伝導性グリース組成物 |
| JP3948642B2 (ja) | 1998-08-21 | 2007-07-25 | 信越化学工業株式会社 | 熱伝導性グリース組成物及びそれを使用した半導体装置 |
| JP3677671B2 (ja) | 1999-04-30 | 2005-08-03 | 東レ・ダウコーニング株式会社 | シリコーンゴム用銀粉末の製造方法 |
| JP2002030217A (ja) | 2000-07-17 | 2002-01-31 | Fujitsu Ltd | 熱伝導性シリコーン組成物 |
| JP3130193U (ja) | 2006-12-28 | 2007-03-15 | ライオン株式会社 | エアゾール缶用押しボタン |
| JP2008222776A (ja) | 2007-03-09 | 2008-09-25 | Shin Etsu Chem Co Ltd | 熱伝導性シリコーングリース組成物 |
-
2022
- 2022-06-23 WO PCT/JP2022/025063 patent/WO2023276846A1/ja not_active Ceased
- 2022-06-23 EP EP22832993.4A patent/EP4365238A4/en not_active Withdrawn
- 2022-06-23 JP JP2023531878A patent/JP7650612B2/ja active Active
- 2022-06-23 KR KR1020247003492A patent/KR20240028463A/ko active Pending
- 2022-06-23 CN CN202280046667.8A patent/CN117580912A/zh active Pending
- 2022-06-23 US US18/575,346 patent/US20250223444A1/en active Pending
- 2022-06-27 TW TW111123867A patent/TW202302761A/zh unknown
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016509086A (ja) * | 2012-12-20 | 2016-03-24 | ダウ コーニング コーポレーションＤｏｗ Ｃｏｒｎｉｎｇ Ｃｏｒｐｏｒａｔｉｏｎ | 硬化性シリコーン組成物、導電性シリコーン接着剤、これらの製造及び使用方法、並びにこれらを含有する電気装置 |
| JP2017066406A (ja) * | 2015-10-02 | 2017-04-06 | 信越化学工業株式会社 | 熱伝導性シリコーン組成物及び半導体装置 |
| WO2017159252A1 (ja) * | 2016-03-18 | 2017-09-21 | 信越化学工業株式会社 | 熱伝導性シリコーン組成物及び半導体装置 |
| JP2018058953A (ja) * | 2016-10-03 | 2018-04-12 | 信越化学工業株式会社 | 熱伝導性シリコーン組成物及び半導体装置 |
| WO2018079362A1 (ja) * | 2016-10-31 | 2018-05-03 | 信越化学工業株式会社 | 熱伝導性シリコーン組成物、半導体装置及び半導体装置の製造方法 |
| WO2020129555A1 (ja) * | 2018-12-21 | 2020-06-25 | 信越化学工業株式会社 | 熱伝導性シリコーン組成物及び半導体装置 |
| WO2020137332A1 (ja) * | 2018-12-25 | 2020-07-02 | 信越化学工業株式会社 | 熱伝導性シリコーン組成物及び半導体装置 |
| WO2020241054A1 (ja) * | 2019-05-27 | 2020-12-03 | 信越化学工業株式会社 | 熱伝導性シリコーン組成物、半導体装置及びその製造方法 |
| JP2021098768A (ja) * | 2019-12-20 | 2021-07-01 | 信越化学工業株式会社 | 熱伝導性シリコーン組成物、半導体装置及びその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP4365238A1 (en) | 2024-05-08 |
| WO2023276846A1 (ja) | 2023-01-05 |
| TW202302761A (zh) | 2023-01-16 |
| JP7650612B2 (ja) | 2025-03-25 |
| US20250223444A1 (en) | 2025-07-10 |
| KR20240028463A (ko) | 2024-03-05 |
| EP4365238A4 (en) | 2025-04-02 |
| CN117580912A (zh) | 2024-02-20 |
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