JP7423158B2 - 加工装置 - Google Patents
加工装置 Download PDFInfo
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- JP7423158B2 JP7423158B2 JP2020090227A JP2020090227A JP7423158B2 JP 7423158 B2 JP7423158 B2 JP 7423158B2 JP 2020090227 A JP2020090227 A JP 2020090227A JP 2020090227 A JP2020090227 A JP 2020090227A JP 7423158 B2 JP7423158 B2 JP 7423158B2
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- 238000012423 maintenance Methods 0.000 claims description 109
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- 230000007246 mechanism Effects 0.000 description 41
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
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Images
Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/048—Interaction techniques based on graphical user interfaces [GUI]
- G06F3/0487—Interaction techniques based on graphical user interfaces [GUI] using specific features provided by the input device, e.g. functions controlled by the rotation of a mouse with dual sensing arrangements, or of the nature of the input device, e.g. tap gestures based on pressure sensed by a digitiser
- G06F3/0489—Interaction techniques based on graphical user interfaces [GUI] using specific features provided by the input device, e.g. functions controlled by the rotation of a mouse with dual sensing arrangements, or of the nature of the input device, e.g. tap gestures based on pressure sensed by a digitiser using dedicated keyboard keys or combinations thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/048—Interaction techniques based on graphical user interfaces [GUI]
- G06F3/0484—Interaction techniques based on graphical user interfaces [GUI] for the control of specific functions or operations, e.g. selecting or manipulating an object, an image or a displayed text element, setting a parameter value or selecting a range
- G06F3/04842—Selection of displayed objects or displayed text elements
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/048—Interaction techniques based on graphical user interfaces [GUI]
- G06F3/0487—Interaction techniques based on graphical user interfaces [GUI] using specific features provided by the input device, e.g. functions controlled by the rotation of a mouse with dual sensing arrangements, or of the nature of the input device, e.g. tap gestures based on pressure sensed by a digitiser
- G06F3/0488—Interaction techniques based on graphical user interfaces [GUI] using specific features provided by the input device, e.g. functions controlled by the rotation of a mouse with dual sensing arrangements, or of the nature of the input device, e.g. tap gestures based on pressure sensed by a digitiser using a touch-screen or digitiser, e.g. input of commands through traced gestures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/268—Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
Description
13 ウェーハ
15 テープ(ダイシングテープ)
17 フレーム
2 加工装置
4 基台
4a 開口
4b 開口
6 カセット載置台(カセットエレベーター)
8 カセット
10 検出器(センサー)
12 移動機構
12a 移動テーブル
14 防塵防滴カバー
16 保持テーブル(チャックテーブル)
16a 保持面
18 クランプ
20 ガイドレール
22 第1支持構造
24 レール
26 移動機構(昇降機構)
28 搬送ユニット(搬送機構)
28a 把持部(把持機構)
30 レール
32 移動機構(昇降機構)
34 搬送ユニット(搬送機構)
36 第2支持構造
38a,38b 移動機構
40a,40b 加工ユニット
42 切削ブレード
44 ハウジング
46 スピンドル
48 撮像ユニット(カメラ)
50 洗浄ユニット
52 スピンナテーブル
54 ノズル
56 カバー
58 入力ユニット(入力部、入力装置)
60 表示ユニット(表示部、表示装置)
60a 表示領域
62 タッチパネル
64 報知ユニット(報知部)
66 制御ユニット(制御部)
68 処理部
70 記憶部
80 Y軸ガイドレール
82 Y軸移動プレート
84 Y軸ボールねじ
86 Z軸ガイドレール
88 Z軸移動プレート
90 Z軸ボールねじ
92 Z軸パルスモータ
100 操作画面(メンテナンス画面)
102,102a~102f 選択キー(メンテナンス実行キー)
104 選択キー(確定キー)
106 選択キー(終了キー)
Claims (3)
- 被加工物を加工する加工装置であって、
移動可能な可動ユニットと、
入力ユニットと、
表示ユニットと、
該可動ユニット、該入力ユニット及び該表示ユニットを制御する制御ユニットと、を備え、
該制御ユニットは、メンテナンスの名称と、該メンテナンスが実行される際の該可動ユニットの位置を示す位置情報とを記憶する記憶部を有し、
該表示ユニットは、該メンテナンスを選択するための選択キーを表示し、
該制御ユニットは、該選択キーが選択されると該可動ユニットを該位置情報が示す位置に移動させ、
該記憶部に記憶される該メンテナンスの名称及び該位置情報は、該入力ユニットの操作によって変更可能であることを特徴とする加工装置。 - 該記憶部に該メンテナンスの名称と該位置情報とが記憶されていない場合には、該表示ユニットは該選択キーとして空欄を表示し、
該記憶部に該メンテナンスの名称と該位置情報とが記憶されている場合には、該表示ユニットは該選択キーとして該メンテナンスの名称を示す表示欄を表示することを特徴とする請求項1に記載の加工装置。 - 該可動ユニットは、該被加工物を保持する保持テーブル、又は、該被加工物を加工する加工ユニットであることを特徴とする請求項1又は請求項2に記載の加工装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020090227A JP7423158B2 (ja) | 2020-05-25 | 2020-05-25 | 加工装置 |
KR1020210056054A KR20210145668A (ko) | 2020-05-25 | 2021-04-29 | 가공 장치 |
CN202110539299.8A CN113725118A (zh) | 2020-05-25 | 2021-05-18 | 加工装置 |
TW110118346A TW202145326A (zh) | 2020-05-25 | 2021-05-20 | 加工裝置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020090227A JP7423158B2 (ja) | 2020-05-25 | 2020-05-25 | 加工装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2021185590A JP2021185590A (ja) | 2021-12-09 |
JP7423158B2 true JP7423158B2 (ja) | 2024-01-29 |
Family
ID=78672678
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2020090227A Active JP7423158B2 (ja) | 2020-05-25 | 2020-05-25 | 加工装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP7423158B2 (ja) |
KR (1) | KR20210145668A (ja) |
CN (1) | CN113725118A (ja) |
TW (1) | TW202145326A (ja) |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009117776A (ja) | 2007-11-09 | 2009-05-28 | Disco Abrasive Syst Ltd | 加工装置 |
JP2010049466A (ja) | 2008-08-21 | 2010-03-04 | Disco Abrasive Syst Ltd | 加工装置 |
US20120258647A1 (en) | 2011-03-29 | 2012-10-11 | Liebherr-Verzahntechnik Gmbh | Gear cutting machine |
JP2016112674A (ja) | 2014-12-18 | 2016-06-23 | 株式会社ディスコ | 切削装置 |
JP2017019075A (ja) | 2015-07-14 | 2017-01-26 | 株式会社ディスコ | ドレッサーツール及び該ドレッサーツールを使用した切削ブレードの先端形状成形方法 |
JP2017163088A (ja) | 2016-03-11 | 2017-09-14 | 東芝メモリ株式会社 | 基板処理装置及び基板処理装置の制御方法 |
JP2019204929A (ja) | 2018-05-25 | 2019-11-28 | 株式会社ディスコ | 搬送用治具及び交換方法 |
JP2020113124A (ja) | 2019-01-15 | 2020-07-27 | 東芝テック株式会社 | 情報処理装置及び情報処理プログラム |
-
2020
- 2020-05-25 JP JP2020090227A patent/JP7423158B2/ja active Active
-
2021
- 2021-04-29 KR KR1020210056054A patent/KR20210145668A/ko active Search and Examination
- 2021-05-18 CN CN202110539299.8A patent/CN113725118A/zh active Pending
- 2021-05-20 TW TW110118346A patent/TW202145326A/zh unknown
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009117776A (ja) | 2007-11-09 | 2009-05-28 | Disco Abrasive Syst Ltd | 加工装置 |
JP2010049466A (ja) | 2008-08-21 | 2010-03-04 | Disco Abrasive Syst Ltd | 加工装置 |
US20120258647A1 (en) | 2011-03-29 | 2012-10-11 | Liebherr-Verzahntechnik Gmbh | Gear cutting machine |
JP2016112674A (ja) | 2014-12-18 | 2016-06-23 | 株式会社ディスコ | 切削装置 |
JP2017019075A (ja) | 2015-07-14 | 2017-01-26 | 株式会社ディスコ | ドレッサーツール及び該ドレッサーツールを使用した切削ブレードの先端形状成形方法 |
JP2017163088A (ja) | 2016-03-11 | 2017-09-14 | 東芝メモリ株式会社 | 基板処理装置及び基板処理装置の制御方法 |
JP2019204929A (ja) | 2018-05-25 | 2019-11-28 | 株式会社ディスコ | 搬送用治具及び交換方法 |
JP2020113124A (ja) | 2019-01-15 | 2020-07-27 | 東芝テック株式会社 | 情報処理装置及び情報処理プログラム |
Also Published As
Publication number | Publication date |
---|---|
CN113725118A (zh) | 2021-11-30 |
JP2021185590A (ja) | 2021-12-09 |
KR20210145668A (ko) | 2021-12-02 |
TW202145326A (zh) | 2021-12-01 |
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