JP7370262B2 - 切削装置及び切削方法 - Google Patents
切削装置及び切削方法 Download PDFInfo
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- JP7370262B2 JP7370262B2 JP2020011765A JP2020011765A JP7370262B2 JP 7370262 B2 JP7370262 B2 JP 7370262B2 JP 2020011765 A JP2020011765 A JP 2020011765A JP 2020011765 A JP2020011765 A JP 2020011765A JP 7370262 B2 JP7370262 B2 JP 7370262B2
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q11/00—Accessories fitted to machine tools for keeping tools or parts of the machine in good working condition or for cooling work; Safety devices specially combined with or arranged in, or specially adapted for use in connection with, machine tools
- B23Q11/10—Arrangements for cooling or lubricating tools or work
- B23Q11/1076—Arrangements for cooling or lubricating tools or work with a cutting liquid nozzle specially adaptable to different kinds of machining operations
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
- B26D1/01—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work
- B26D1/12—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis
- B26D1/14—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter
- B26D1/141—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter for thin material, e.g. for sheets, strips or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q1/00—Members which are comprised in the general build-up of a form of machine, particularly relatively large fixed members
- B23Q1/01—Frames, beds, pillars or like members; Arrangement of ways
- B23Q1/015—Frames, beds, pillars
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q11/00—Accessories fitted to machine tools for keeping tools or parts of the machine in good working condition or for cooling work; Safety devices specially combined with or arranged in, or specially adapted for use in connection with, machine tools
- B23Q11/0042—Devices for removing chips
- B23Q11/005—Devices for removing chips by blowing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q17/00—Arrangements for observing, indicating or measuring on machine tools
- B23Q17/24—Arrangements for observing, indicating or measuring on machine tools using optics or electromagnetic waves
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0064—Devices for the automatic drive or the program control of the machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
- B28D5/0094—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Optics & Photonics (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Dicing (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
Description
本発明の実施形態1に係る切削装置を図面に基づいて説明する。図1は、実施形態1に係る切削装置の構成例を示す斜視図である。図2は、図1に示された切削装置の保持ユニットと撮像カメラを示す斜視図である。図3は、図1に示された切削装置の除去ユニットの斜視図である。図4は、図3に示された除去ユニットの当接部材等を示す斜視図である。図5は、図4に示された除去ユニットの当接部材等を示す側面図である。
図7は、図6に示された切削方法の除去ステップにおいて、当接部材を保持テーブルの保持面のX軸方向の一端部に当接させた状態を示す側面図である。図8は、図6に示された切削方法の除去ステップにおいて、当接部材を保持テーブルの保持面のX軸方向の中央部に当接させた状態を示す側面図である。図9は、図6に示された切削方法の除去ステップにおいて、当接部材を保持テーブルの保持面のX軸方向の他端部に当接させた状態を示す側面図である。
図10は、図6に示された切削方法の保持ステップを一部断面で示す側面図である。図11は、図10中のXI部を拡大して一部断面で示す側面図である。
図12は、図6に示された切削方法の撮像ステップを一部断面で示す側面図である。撮像ステップST3は、保持ステップST2を実施した後、透明部123を介して撮像カメラ50で被加工物200を撮像するステップである。
図13は、図6に示された切削方法の切削ステップを一部断面で示す側面図である。切削ステップST4は、保持テーブル12で保持された被加工物200を切削ブレード21で切削するステップである。切削ステップST4では、切削装置1は、制御ユニット100がX軸移動ユニット31を制御して、保持テーブル12を加工領域5まで移動し、制御ユニット100が移動ユニット30及び切削ユニット20を制御して、保持テーブル12と切削ユニット20の切削ブレード21とをストリート203に沿って相対的に移動させながら切削水を切削水ノズル24から供給しながらストリート203に切削ブレード21をテープ211に到達するまで切り込ませて切削溝を形成する。
本発明の実施形態2に係る切削装置を図面に基づいて説明する。図14は、実施形態2に係る切削装置の除去ユニットの当接部材等を示す斜視図である。図14は、実施形態1と同一部分に同一符号を付して説明を省略する。
本発明の実施形態3に係る切削装置を図面に基づいて説明する。図15は、実施形態3に係る切削装置の除去ユニットの噴射部を示す斜視図である。図16は、図15に示された噴射部を下方からみた斜視図である。
12 保持テーブル
20 切削ユニット
21 切削ブレード
24 切削水ノズル
31 X軸移動ユニット(移動機構)
50 撮像カメラ
60,60-2,60-3 除去ユニット
63,63-2 当接部材
67 噴射部
123 透明部
124 保持面
200 被加工物
ST1 除去ステップ
ST2 保持ステップ
ST3 撮像ステップ
ST4 切削ステップ
Claims (4)
- 切削装置であって、
少なくとも保持面の一部に透明部材からなる透明部を有し被加工物を保持する保持テーブルと、
該保持テーブルで保持された被加工物を切削する切削ブレードと、該切削ブレードによる被加工物の切削中に切削水を供給する切削水ノズルと、を有した切削ユニットと、
該透明部を介して被加工物を撮像する撮像カメラと、
該透明部に付着した液体を除去する除去ユニットと、を備えた切削装置。 - 該除去ユニットは、該透明部に当接する当接位置と退避位置とに位置付けられる当接部材と、
該透明部に当接した該当接部材を該透明部上で相対移動させる移動機構と、を有した請求項1に記載の切削装置。 - 該除去ユニットは、該透明部に向かってエアーを噴射する噴射部と、
該噴射部を該透明部上で移動させる移動機構と、を有した請求項1に記載の切削装置。 - 請求項1から請求項3のいずれか一項に記載の切削装置で被加工物を加工する切削方法であって、
該除去ユニットで該透明部上の液体を除去する除去ステップと、
該除去ステップを実施した後、該保持テーブルで被加工物を保持する保持ステップと、
該保持ステップを実施した後、該透明部を介して該撮像カメラで被加工物を撮像する撮像ステップと、
該保持テーブルで保持された被加工物を該切削ブレードで切削する切削ステップと、を備えた切削方法。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020011765A JP7370262B2 (ja) | 2020-01-28 | 2020-01-28 | 切削装置及び切削方法 |
KR1020200184628A KR20210096555A (ko) | 2020-01-28 | 2020-12-28 | 절삭 장치 및 절삭 방법 |
US17/144,318 US11745374B2 (en) | 2020-01-28 | 2021-01-08 | Cutting apparatus and cutting method |
CN202110086962.3A CN113246324A (zh) | 2020-01-28 | 2021-01-22 | 切削装置和切削方法 |
TW110102679A TW202129746A (zh) | 2020-01-28 | 2021-01-25 | 切割裝置以及切割方法 |
DE102021200658.2A DE102021200658A1 (de) | 2020-01-28 | 2021-01-26 | Schneidvorrichtung und schneidverfahren |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020011765A JP7370262B2 (ja) | 2020-01-28 | 2020-01-28 | 切削装置及び切削方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2021115681A JP2021115681A (ja) | 2021-08-10 |
JP7370262B2 true JP7370262B2 (ja) | 2023-10-27 |
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JP2020011765A Active JP7370262B2 (ja) | 2020-01-28 | 2020-01-28 | 切削装置及び切削方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US11745374B2 (ja) |
JP (1) | JP7370262B2 (ja) |
KR (1) | KR20210096555A (ja) |
CN (1) | CN113246324A (ja) |
DE (1) | DE102021200658A1 (ja) |
TW (1) | TW202129746A (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CN116728227B (zh) * | 2023-08-14 | 2023-11-24 | 泉州永嘉豪机械科技有限公司 | 一种针筒加工磨损检测的磨削机床 |
CN117102407B (zh) * | 2023-10-25 | 2024-01-02 | 江苏莱赫润轧辊科技有限公司 | 一种冷硬铸铁活塞杆的加工装置 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005051094A (ja) | 2003-07-30 | 2005-02-24 | Disco Abrasive Syst Ltd | 切削装置 |
JP2010087141A (ja) | 2008-09-30 | 2010-04-15 | Disco Abrasive Syst Ltd | 加工装置 |
JP2015054359A (ja) | 2013-09-10 | 2015-03-23 | 株式会社ディスコ | 研削装置 |
JP2016198874A (ja) | 2015-04-14 | 2016-12-01 | 株式会社ディスコ | チャックテーブルの洗浄方法 |
JP2019063885A (ja) | 2017-09-28 | 2019-04-25 | 株式会社ディスコ | 加工装置 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5198203B2 (ja) | 2008-09-30 | 2013-05-15 | 株式会社ディスコ | 加工装置 |
US10703016B2 (en) * | 2018-06-20 | 2020-07-07 | Texas Instruments Incorporated | Semiconductor sawing method and system |
JP7313805B2 (ja) * | 2018-08-15 | 2023-07-25 | 株式会社ディスコ | 切削装置 |
JP2022107953A (ja) * | 2021-01-12 | 2022-07-25 | 株式会社ディスコ | レーザー加工装置 |
JP2023006794A (ja) * | 2021-06-30 | 2023-01-18 | 株式会社ディスコ | 製造方法 |
-
2020
- 2020-01-28 JP JP2020011765A patent/JP7370262B2/ja active Active
- 2020-12-28 KR KR1020200184628A patent/KR20210096555A/ko active Search and Examination
-
2021
- 2021-01-08 US US17/144,318 patent/US11745374B2/en active Active
- 2021-01-22 CN CN202110086962.3A patent/CN113246324A/zh active Pending
- 2021-01-25 TW TW110102679A patent/TW202129746A/zh unknown
- 2021-01-26 DE DE102021200658.2A patent/DE102021200658A1/de active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005051094A (ja) | 2003-07-30 | 2005-02-24 | Disco Abrasive Syst Ltd | 切削装置 |
JP2010087141A (ja) | 2008-09-30 | 2010-04-15 | Disco Abrasive Syst Ltd | 加工装置 |
JP2015054359A (ja) | 2013-09-10 | 2015-03-23 | 株式会社ディスコ | 研削装置 |
JP2016198874A (ja) | 2015-04-14 | 2016-12-01 | 株式会社ディスコ | チャックテーブルの洗浄方法 |
JP2019063885A (ja) | 2017-09-28 | 2019-04-25 | 株式会社ディスコ | 加工装置 |
Also Published As
Publication number | Publication date |
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US11745374B2 (en) | 2023-09-05 |
US20210229306A1 (en) | 2021-07-29 |
CN113246324A (zh) | 2021-08-13 |
TW202129746A (zh) | 2021-08-01 |
DE102021200658A1 (de) | 2021-07-29 |
JP2021115681A (ja) | 2021-08-10 |
KR20210096555A (ko) | 2021-08-05 |
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